Dielectric material forming methods and enhanced dielectric materials
View Patent ↗A dielectric material forming method includes forming a first monolayer and forming a second monolayer on the first monolayer, one of the first and second monolayers comprising tantalum and oxygen and the other of the first and second monolayers comprising oxygen and another element different from tantalum. A dielectric layer can be formed containing the first and second monolayers. The dielectric layer can exhibit a dielectric constant greater than the first monolayer. The another element can include a Group IB to VIIIB element, such as titanium and/or zirconium. The forming of the first and second monolayer can include atomic layer depositing. A dielectric material can include first and second chemisorbed materials, the second material containing oxygen and a Group IB to VIIIB element and the dielectric material exhibiting a dielectric constant greater than the first chemisorbed material. The dielectric material can further exhibit less current leakage than the first material.
1. A dielectric material forming method comprising:
chemisorbing a first dielectric material on a substrate;
chemisorbing a second dielectric material on the first material, one of the first and second materials consisting of oxygen, titanium, and zirconium; and
forming an enhanced dielectric material comprising the first and second materials, the enhanced dielectric material exhibiting a dielectric constant greater than the first material.
2. The method of claim 1 wherein the first material consists of oxygen, titanium, and zirconium.
3. The method of claim 1 wherein the second material consists of oxygen, titanium, and zirconium.
4. The method of claim 3 wherein the first material comprises tantalum pentoxide.
5. The method of claim 3 wherein the first material comprises tantalum and oxygen.
6. The method of claim 1 wherein at least one of the first and second materials consists of a monolayer.
7. The method of claim 1 wherein the chemisorbing of the first or second material comprises atomic layer depositing.
8. The method of claim 1 wherein the forming of the enhanced dielectric layer comprises annealing.
9. The method of claim 1 wherein the enhanced dielectric material further exhibits less current leakage than the first dielectric material.
10. A dielectric material comprising first and second chemisorbed materials, the second material consisting of oxygen, titanium, and zirconium and the dielectric material exhibiting a dielectric constant greater than the first chemisorbed material.
11. The dielectric of claim 10 wherein the first material comprises tantalum pentoxide.
12. The dielectric of claim 10 wherein at least one of the first and second materials consists of a monolayer.
13. The dielectric of claim 10 wherein the dielectric material further exhibits less current leakage than the first dielectric material.