IP Library Granted Patent US 7,063,544
Granted Patent B2
US 7,063,544 · App. 10/917,139 · Granted Jun 20, 2006

System for burn-in testing of electronic devices

Assignee: Aehr Test Systems
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,063,544
App. No.
10/917,139
Granted
Jun 20, 2006
Kind
B2
Abstract

A system is provided which allows for burn-in testing of electronic devices wherein power current is provided individually to each one of the electronic devices. The system also includes various connectors, cables, and other configurations that allow for power currents having large magnitudes to be provided to the electronic devices.

Claims (34)

1. A driver assembly, comprising:

a driver substrate;

a plurality of driver signal connectors secured to the driver substrate, each driver signal connector having a surface for releasably mating with a respective signal contact and each driver signal connector to carry a maximum direct current having a first magnitude;

signal electronics connected to the driver signal connectors;

a plurality of driver power connectors secured to the driver substrate, each driver power connector having a surface for releasably mating with a respective power contact and each driver power connector to carry a maximum direct current having a second magnitude which is larger than the first magnitude; and

a single power supply connected to the driver power connectors.

2. The driver assembly of claim 1 , wherein the second magnitude is at least 7 A.

3. The driver assembly of claim 1 , wherein the second magnitude is at least 1.5 times the first magnitude.

4. The driver assembly of claim 1 , wherein the second magnitude is at least 4 A more than the first magnitude.

5. The driver assembly of claim 1 , wherein the second magnitude is at least 7 A, at least 1.5 times the first magnitude, and at least 4 A more than the first magnitude.

6. The driver assembly of claim 1 , wherein the driver signal connectors and the driver power connectors are different types of connectors.

7. The driver assembly of claim 6 , wherein the driver signal connectors are within an edge finger connector block.

8. The driver assembly of claim 7 , wherein the surface of each driver power connector is substantially circular.

9. The driver assembly of claim 8 , wherein each driver power connector is a respective pin.

10. The driver assembly of claim 1 , wherein the driver signal connectors and the driver power connectors are in two distinct groups.

11. The driver assembly of claim 10 , further comprising:

a driver power connector block, the driver power connectors being secured to the driver power connector block, and the driver power connector block being secured to the driver substrate independent from the driver signal connectors.

12. The driver assembly of claim 11 , further comprising:

a driver power board, the driver power connector being secured to the driver power board and the driver power board being secured to the driver substrate independent from the driver signal connectors.

13. The driver assembly of claim 1 , wherein movement of the driver substrate in an insertion direction causes engagement of the driver signal connectors with the signal contacts and engagement of the driver power connectors with the power contacts.

14. The driver assembly of claim 1 , further comprising:

a plurality of driver current detectors, each detector being in communication with a respective one of the driver power connectors to detect current separately through each one of the driver power connectors; and

an output device in communication with the driver current detectors to provide an output of the respective currents through the respective driver power connectors.

15. A driver assembly, comprising:

a driver substrate;

a plurality of driver signal connectors secured to the driver substrate, each driver signal connector having a surface for releasably mating with a respective signal contact;

signal electronics connected to the driver signal connectors;

a plurality of driver power connectors secured to the driver substrate, each driver power connector having a surface for releasable mating with a respective power contact;

a power supply connected to the driver power connectors;

a plurality of driver current detectors, each detector being in communication with a respective one of the driver power connectors to detect current separately through each one of the driver power connectors; and

an output device in communication with the driver current detectors to provide an output of the respective currents through the respective driver power connectors.

16. The driver assembly of claim 15 , wherein power current provided by the power supply to a plurality of the driver power connectors is shut down if a current detected by a single driver current detector exceeds a predetermined maximum.

17. The driver assembly of claim 16 , wherein power current to at least 10 of the driver power connectors is shut down.

18. The driver assembly of claim 16 , wherein the power supply is shut down.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Nov 5, 2019
From: QVT FUND LP; QUINTESSENCE FUND L.P.
To: AEHR TEST SYSTEMS
Reel/Frame 050928/0695 →
SECURITY INTEREST Recorded Apr 14, 2015
From: AEHR TEST SYSTEMS
To: QVT FUND LP; QUINTESSENCE FUND L.P.
Reel/Frame 035424/0783 →
RELEASE OF SECURITY INTEREST Recorded Apr 13, 2015
From: SILICON VALLEY BANK
To: AEHR TEST SYSTEMS
Reel/Frame 035420/0390 →
SECURITY AGREEMENT Recorded Sep 6, 2013
From: AEHR TEST SYSTEMS
To: SILICON VALLEY BANK
Reel/Frame 031171/0001 →
Continuity (2)
Division 1018452500 · Jun 27, 2002
Related Publication 20050007137A1 · Jan 13, 2005