Patent Assignment
Reel/Frame 050928/0695
Release of Security Interest
Recorded: 2019-11-05
Pages: 8
Assignee
AEHR TEST SYSTEMS
400 KATO TERRACE, FREMONT, CALIFORNIA, 94539
Covered Properties
(50)
Interface on an Electronics Connector
Patent:
629,760 →
Application:
29/327,293 →
Connector
Patent:
630,166 →
Application:
29/327,294 →
Printed Circuit Board Loader/Unloader
Patent:
5,093,984 →
Application:
07/526,069 →
Reusable Die Carrier for Burn-in and Burn-in Process
Patent:
5,517,125 →
Application:
08/089,752 →
High-Density Interconnect Technique
Patent:
5,429,510 →
Application:
08/161,282 →
Method and System for Testing Memory Programming Devices
Patent:
5,682,472 →
Application:
08/407,103 →
Reusable Die Carrier for Burn-in and Burn-in Process
Patent:
6,025,732 →
Application:
08/948,696 →
Wafer Level Burn-in and Test Thermal Chuck and Method
Patent:
6,140,616 →
Application:
09/161,323 →
Wafer Level Burn-in and Test Methods
Patent:
6,580,283 →
Application:
09/353,116 →
Wafer Level Burn-in and Electrical Test System and Method
Patent:
6,562,636 →
Application:
09/353,121 →
Kinematic Coupling
Wafer-Level Burn-in and Test Cartridge
Patent:
6,340,895 →
Application:
09/353,214 →
Enhancements in Testing Devices on Burn-in Boards
Patent:
6,292,415 →
Application:
09/407,659 →
Wafer Level Burn-in and Electrical Test System and Method
Wafer Burn-in and Test Employing Detachable Cartridge
System for Burn-in Testing of Electronic Devices
Patent:
6,815,966 →
Application:
10/184,525 →
Assembly for Electrically Connecting a Test Component to a Testing Machine for Testing Electrical Circuits on the Test Component
Contactor Assembly for Testing Electrical Circuits
Patent:
6,853,209 →
Application:
10/197,133 →
Die Carrier
Wafer Burn-in and Test Employing Detachable Cartridge
Wafer Level Burn-in and Electrical Test System and Method
Assembly for Electrically Connecting a Test Component to a Testing Machine for Testing Electrical Circuits on the Test Component
System for Burn-in Testing of Electronic Devices
Reloading of Die Carriers Without Removal of Die Carriers from Sockets on Test Boards
Contactor Assembly for Testing Electrical Circuits
System for Testing and Burning in of Integrated Circuits
Die Carrier
Wafer Burn-in and Test Employing Detachable Cartridge
Apparatus for Testing Electronic Devices
Assembly for Electrically Connecting a Test Component to a Testing Machine for Testing Electrical Circuits on the Test Component
Apparatus for Testing Electronic Devices
System for Testing an Integrated Circuit of a Device and Its Method of Use
Assembly for Electrically Connecting a Test Component to a Testing Machine for Testing Electrical Circuits on the Test Component
Electronics Tester with a Signal Distribution Board and a Wafer Chuck Having Different Coefficients of Thermal Expansion
System for Testing an Integrated Circuit of a Device and Its Method of Use
Separate Test Electronics and Blower Modules in an Apparatus for Testing an Integrated Circuit
Wafer Level Burn-in and Electrical Test System and Method
Electronics Tester with a Signal Distribution Board and a Wafer Chuck Having Different Coefficients of Thermal Expansion
Apparatus for Testing Electronic Devices
System for Testing an Integrated Circuit of a Device and Its Method of Use
Electronics Tester with a Signal Distribution Board and a Wafer Chuck Having Different Coefficients of Thermal Expansion
Integrated Feedthrough Module
System for Testing an Integrated Circuit of a Device and Its Method of Use
Apparatus for Testing Electronic Devices
Adhesively Attached Stand-Offs On A Portable Pack For An Electronics Tester
System for Testing an Integrated Circuit of a Device and Its Method of Use
Apparatus for Testing Electronic Devices
Apparatus for Testing Electronic Devices
Apparatus for Testing Electronic Devices
Apparatus for Testing Electronic Devices
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
May 18, 1990
From: LAPE, LARRY J.
To: AEHR TEST SYSTEMS, UNITED STATES OF AMERICA
Reel/Frame 005322/0102 →
Assignment of Assignor's Interest
Sep 13, 1993
From: POSEDEL, RHEA; LAPE, LARRY; WRENN, JAMES
To: AEHR TEST SYSTEMS, INC.
Reel/Frame 006716/0698 →
Security Interest
Jan 18, 1994
From: AEHR TEST SYSTEMS
To: SILICON VALLEY BANK
Reel/Frame 006834/0635 →
Assignment of Assignor's Interest
May 9, 1994
From: BARRACLOUGH, WILLIAM D.; ALPERIN, MIKHAIL A.; BREHM, JEFFREY A.; HOANG, JOHN DINH
To: AEHR TEST SYSTEMS, INC.
Reel/Frame 006970/0748 →
Assignment of Assignor's Interest
Mar 17, 1995
From: BREHM, JEFFREY A.
To: AEHR TEST SYSTEMS
Reel/Frame 007401/0444 →
Corrected Assignment
Jul 3, 1995
From: BREHM, JEFFREY A.; SHEPHERD, PATRICK M.
To: AEHR TEST SYSTEMS
Reel/Frame 007567/0589 →
Assignment of Assignor's Interest
Sep 25, 1998
From: ANDBERG, JOHN W.
To: AEHR TEST SYSTEMSS
Reel/Frame 009484/0495 →
Assignment of Assignor's Interest
Jul 14, 1999
From: CARBONE, MARK CHARLES; UHER, FRANK OTTO; ANDBERG, JOHN WILLIAM; RICHMOND, DONALD PAUL, II
To: AEHR TEST SYSTEMS
Reel/Frame 010112/0814 →
Assignment of Assignor's Interest
Jul 14, 1999
From: CARBONE, MARK CHARLES; UHER, FRANK OTTO; ANDBERG, JOHN WILLIAM; RICHMOND, DONALD PAUL, II
To: AEHR TEST SYSTEMS
Reel/Frame 010114/0094 →
Assignment of Assignor's Interest
Jul 14, 1999
From: CARBONE, MARK CHARLES; UHER, FRANK OTTO; ANDBERG, JOHN WILLIAM; LOBACZ, JERZY
To: AEHR TEST SYSTEMS
Reel/Frame 010112/0833 →
Assignment of Assignor's Interest
Sep 28, 1999
From: BREHM, JEFFREY A.
To: AEHR TEST SYSTEMS, INC.
Reel/Frame 010296/0835 →
Assignment of Assignor's Interest
Nov 4, 1999
From: RICHMOND, II, DONALD PAUL; HOANG, JOHN DINH; LOBACZ, JERZY
To: AEHR TEST SYSTEMS
Reel/Frame 010364/0963 →
Assignment of Assignor's Interest
May 25, 2001
From: RICHMOND II, DONALD PAUL; HOANG, JOHN DINH; LOBACZ, GERZY
To: AEHR TEST SYSTEMS
Reel/Frame 011860/0766 →
Assignment of Assignor's Interest
Jun 18, 2001
From: UHER, FRANK OTTO; ANDBERG, JOHN WILLIAM; CARBONE, MARK CHARLES; RICHMOND, DONALD PAUL III
To: AEHR TEST SYSTEMS
Reel/Frame 011947/0392 →
Assignment of Assignor's Interest
Sep 16, 2002
From: JOVANOVIC, JOVAN; UHER, FRANK O.; RICHMOND, DONALD P., II
To: AEHR TEST SYSTEMS
Reel/Frame 013290/0524 →
Release of Security Interest
Sep 18, 2002
From: SILICON VALLEY BANK
To: AEHR TEST SYSTEMS
Reel/Frame 013288/0923 →
Assignment of Assignor's Interest
Sep 18, 2002
From: GUNN, BRADLEY R.; CALDERON, ALBERT J.; JOVANOVIC, JOVAN; HENDRICKSON, DAVID S.
To: AEHR TEST SYSTEMS
Reel/Frame 013298/0691 →
Assignment of Assignor's Interest
Oct 31, 2002
From: MALATHONG, SEANG P.; HEMMERLING, MARTIN A.
To: AEHR TEST SYSTEMS
Reel/Frame 013468/0403 →
Assignment of Assignor's Interest
Dec 18, 2002
From: RICHMOND II., DONALD P.; JOVANOVIC, JOVAN
To: AEHR TEST SYSTEMS
Reel/Frame 013304/0779 →
Assignment of Assignor's Interest
Nov 21, 2003
From: RICHMOND, II, DONALD PAUL; HOANG, JOHN DINH; LOBACZ, JERZY
To: AEHR TEST SYSTEMS
Reel/Frame 014740/0177 →
Assignment of Assignor's Interest
Dec 8, 2004
From: UHER, FRANK OTTO; ANDBERG, JOHN WILLIAM; CARBONE, MARK CHARLES; RICHMOND, DONALD PAUL
To: AEHR TEST SYSTEMS
Reel/Frame 016070/0036 →
Correction to Reel and Frame 016070/0036
Jun 16, 2005
From: UHER, FRANK OTTO; ANDBERG, JOHN WILLIAM; CARBONE, MARK CHARLES; RICHMOND, DONALD PAUL II
To: AEHR TEST SYSTEMS
Reel/Frame 016351/0768 →
Assignment of Assignor's Interest
Jan 9, 2009
From: LINDSEY, SCOTT E.; JOVANOVIC, JOVAN; HENDRICKSON, DAVID S.
To: AEHR TEST SYSTEMS
Reel/Frame 022085/0023 →
Assignment of Assignor's Interest
Jan 9, 2009
From: LINDSEY, SCOTT E.; JOVANOVIC, JOVAN; HENDRICKSON, DAVID S.
To: AEHR TEST SYSTEMS
Reel/Frame 022085/0041 →
Security Agreement
Sep 6, 2013
From: AEHR TEST SYSTEMS
To: SILICON VALLEY BANK
Reel/Frame 031171/0001 →