Patent Assignment
Reel/Frame 031171/0001
Security Agreement
Recorded: 2013-09-06
Pages: 14
Assignor
AEHR TEST SYSTEMS
Executed: 2013-08-21
Assignee
SILICON VALLEY BANK
3003 TASMAN DRIVE, SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(58)
Apparatus for Testing Electronic Devices
System for Testing an Integrated Circuit of a Device and Its Method of Use
Adhesively Attached Stand-Offs On A Portable Pack For An Electronics Tester
Apparatus for Testing Electronic Devices
System for Testing an Integrated Circuit of a Device and Its Method of Use
Integrated Feedthrough Module
Electronics Tester with a Signal Distribution Board and a Wafer Chuck Having Different Coefficients of Thermal Expansion
System for Testing an Integrated Circuit of a Device and Its Method of Use
Separate Test Electronics and Blower Modules in an Apparatus for Testing an Integrated Circuit
System for Testing an Integrated Circuit of a Device and Its Method of Use
Apparatus for Testing Electronic Devices
Electronics Tester with a Signal Distribution Board and a Wafer Chuck Having Different Coefficients of Thermal Expansion
System for Testing an Integrated Circuit of a Device and Its Method of Use
Electronics Tester with a Signal Distribution Board and a Wafer Chuck Having Different Coefficients of Thermal Expansion
Assembly for Electrically Connecting a Test Component to a Testing Machine for Testing Electrical Circuits on the Test Component
Wafer Level Burn-in and Electrical Test System and Method
Printed Circuit Board Loader/Unloader
Patent:
5,093,984 →
Application:
07/526,069 →
Reusable Die Carrier for Burn-in and Burn-in Process
Patent:
5,517,125 →
Application:
08/089,752 →
Method and System for Testing Memory Programming Devices
Patent:
5,682,472 →
Application:
08/407,103 →
Wafer-Level Burn-in and Test Cartridge
Patent:
6,340,895 →
Application:
09/353,214 →
Kinematic Coupling
Wafer Burn-in and Test Employing Detachable Cartridge
Wafer Level Burn-in and Electrical Test System and Method
Patent:
6,562,636 →
Application:
09/353,121 →
Wafer Level Burn-in and Test Methods
Patent:
6,580,283 →
Application:
09/353,116 →
Wafer Level Burn-in and Electrical Test System and Method
System for Burn-in Testing of Electronic Devices
Patent:
6,815,966 →
Application:
10/184,525 →
Contactor Assembly for Testing Electrical Circuits
Patent:
6,853,209 →
Application:
10/197,133 →
Die Carrier
Assembly for Electrically Connecting a Test Component to a Testing Machine for Testing Electrical Circuits on the Test Component
System for Testing and Burning in of Integrated Circuits
Wafer Burn-in and Test Employing Detachable Cartridge
Reloading of Die Carriers Without Removal of Die Carriers from Sockets on Test Boards
Wafer Level Burn-in and Electrical Test System and Method
Electronics Tester with a Signal Distribution Board and a Wafer Chuck Having Different Coefficients of Thermal Expansion
Apparatus for Testing Electronic Devices
System for Testing an Integrated Circuit of a Device and Its Method of Use
Apparatus for Testing Electronic Devices
Separate Test Electronics and Blower Modules in an Apparatus for Testing an Integrated Circuit
System for Testing an Integrated Circuit of a Device and Its Method of Use
Interface on an Electronics Connector
Patent:
629,760 →
Application:
29/327,293 →
Connector
Patent:
630,166 →
Application:
29/327,294 →
High-Density Interconnect Technique
Patent:
5,429,510 →
Application:
08/161,282 →
Enhancements in Testing Devices on Burn-in Boards
Patent:
6,292,415 →
Application:
09/407,659 →
Wafer Level Burn-in and Test Thermal Chuck and Method
Patent:
6,140,616 →
Application:
09/161,323 →
Apparatus for Testing Electronic Devices
System for Testing an Integrated Circuit of a Device and Its Method of Use
Electronics Tester with a Signal Distribution Board and a Wafer Chuck Having Different Coefficients of Thermal Expansion
Apparatus for Testing Electronic Devices
Wafer Level Burn-in and Electrical Test System and Method
Electronics Tester with a Signal Distribution Board and a Wafer Chuck Having Different Coefficients of Thermal Expansion
Wafer Burn-in and Test Employing Detachable Cartridge
Assembly for Electrically Connecting a Test Component to a Testing Machine for Testing Electrical Circuits on the Test Component
Assembly for Electrically Connecting a Test Component to a Testing Machine for Testing Electrical Circuits on the Test Component
Contactor Assembly for Testing Electrical Circuits
Die Carrier
System for Burn-in Testing of Electronic Devices
Assembly for Electrically Connecting a Test Component to a Testing Machine for Testing Electrical Circuits on the Test Component
Reusable Die Carrier for Burn-in and Burn-in Process
Patent:
6,025,732 →
Application:
08/948,696 →
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
May 18, 1990
From: LAPE, LARRY J.
To: AEHR TEST SYSTEMS, UNITED STATES OF AMERICA
Reel/Frame 005322/0102 →
Security Interest
Jan 18, 1994
From: AEHR TEST SYSTEMS
To: SILICON VALLEY BANK
Reel/Frame 006834/0635 →
Release of Security Interest
Sep 18, 2002
From: SILICON VALLEY BANK
To: AEHR TEST SYSTEMS
Reel/Frame 013288/0923 →
Assignment of Assignor's Interest
Nov 21, 2003
From: RICHMOND, II, DONALD PAUL; HOANG, JOHN DINH; LOBACZ, JERZY
To: AEHR TEST SYSTEMS
Reel/Frame 014740/0177 →
Assignment of Assignor's Interest
Dec 19, 2007
From: LINDSEY, SCOTT E.; JOVANOVIC, JOVAN; HENDRICKSON, DAVID S.; RICHMOND, DONALD P., II
To: AEHR TEST SYSTEMS
Reel/Frame 020274/0135 →
Assignment of Assignor's Interest
Sep 29, 2008
From: STEPS, STEVEN C.; LINDSEY, SCOTT E.; DEBOE, KENNETH W.; RICHMOND, DONALD P., II
To: AEHR TEST SYSTEMS
Reel/Frame 021598/0659 →
Assignment of Assignor's Interest
May 18, 2009
From: LINDSEY, SCOTT E.; YEH, JUNJYE; JOVANOVIC, JOVAN; MALATHONG, SEANG P.
To: AEHR TEST SYSTEMS
Reel/Frame 022699/0270 →
Assignment of Assignor's Interest
Jun 23, 2009
From: HENDRICKSON, DAVID S.; JOVANOVIC, JOVAN; RICHMOND, DONALD P., II; BARRACLOUGH, WILLIAM D.
To: AEHR TEST SYSTEMS
Reel/Frame 022864/0496 →
Release of Security Interest
Apr 13, 2015
From: SILICON VALLEY BANK
To: AEHR TEST SYSTEMS
Reel/Frame 035420/0390 →
Security Interest
Apr 14, 2015
From: AEHR TEST SYSTEMS
To: QVT FUND LP; QUINTESSENCE FUND L.P.
Reel/Frame 035424/0783 →
Release of Security Interest
Nov 5, 2019
From: QVT FUND LP; QUINTESSENCE FUND L.P.
To: AEHR TEST SYSTEMS
Reel/Frame 050928/0695 →
Assignment of Assignor's Interest
Jul 12, 2022
From: RICHMOND, DONALD P., II; DEBOE, KENNETH W.; UHER, FRANK O.; JOVANOVIC, JOVAN
To: AEHR TEST SYSTEMS
Reel/Frame 060485/0485 →
Assignment of Assignor's Interest
Jul 19, 2022
From: LINDSEY, SCOTT E.; JOVANOVIC, JOVAN; HENDRICKSON, DAVID S.; RICHMOND, DONALD P., II
To: AEHR TEST SYSTEMS
Reel/Frame 060552/0826 →
Assignment of Assignor's Interest
Feb 14, 2023
From: LINDSEY, SCOTT E.; YEH, JUNJYE; JOVANOVIC, JOVAN; MALATHONG, SEANG P.
To: AEHR TEST SYSTEMS
Reel/Frame 062693/0662 →