System for testing an integrated circuit of a device and its method of use
A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.
1. A method of testing an integrated circuit of a device, comprising:
locating a compensating piece against a first piece of a subassembly of a contactor board assembly, the compensating piece having a three-dimensional profiled surface to improve planarity of a three-dimensional profile of a surface of the subassembly other than the profiled surface of the compensating piece;
holding the device against a surface of a holder;
moving the contactor board assembly relative to the holder to bring terminals of the contactor board assembly into contact with contacts on the device; and
providing signals through the terminals and contacts to the integrated circuit.
2. The method of claim 1 , wherein the compensating piece is held between first and second pieces of the subassembly.
3. The method of claim 1 , wherein the three-dimensional profile of the compensating piece makes the three-dimensional profile of the surface of the subassembly substantially planar.
4. The method of claim 1 , further comprising:
actuating first and second components of an actuator to move a contactor support structure relative to an apparatus frame and urge terminals on the contactor support structure against contacts on the device.
5. The method of claim 4 , further comprising:
allowing air through a fluid line to modify a size of a volume defined between the first and second components of the actuator to move the contactor support structure relative to the apparatus frame.
6. The method of claim 1 , wherein a plurality of electrical components are mounted on the contactor board assembly.
7. The method of claim 6 , wherein the electrical components are mounted on a side on the contactor board assembly opposing the terminals held by the contactor board assembly.
8. The method of claim 6 , wherein the electrical components are located between a force distribution substrate and the contactor board assembly, further comprising:
transferring force from the contactor board assembly to the force distribution substrate through a stand-off component, the stand-off component being located between the compensating piece and the surface of the subassembly.
9. The method of claim 1 , wherein the contactor board assembly includes a distribution board substrate and a contactor substrate mounted to the distribution board substrate.
10. The method of claim 1 , further comprising:
removably mounting a cartridge frame of a cartridge to an apparatus frame, the contactor board assembly forming part of the cartridge; and
connecting a surface of a connector interface to a surface of a contactor interface forming part of the cartridge.
11. The method of claim 10 , wherein the cartridge includes a common subassembly and a first unique contactor subassembly, further comprising:
replacing the first unique contactor subassembly with a second unique contactor subassembly.
12. The method of claim 11 , further comprising:
reducing a pressure in an area between the common subassembly and the second unique contactor subassembly, the compensating piece compensating for at least a profile change of the surface due to said reduction in pressure.