Patent Assignment
Reel/Frame 035424/0783
Security Interest
Recorded: 2015-04-14
Pages: 10
Assignor
AEHR TEST SYSTEMS
Executed: 2015-04-10
Assignees
QVT FUND LP
1177 AVENUE OF THE AMERICAS, 9TH FLOOR, C/O QVT FINANCIAL LP, NEW YORK, NEW YORK, 10036
QUINTESSENCE FUND L.P.
1177 AVENUE OF THE AMERICAS, 9TH FLOOR, C/O QVT FINANCIAL LP, NEW YORK, NEW YORK, 10036
Covered Properties
(50)
Adhesively Attached Stand-Offs On A Portable Pack For An Electronics Tester
Apparatus for Testing Electronic Devices
Integrated Feedthrough Module
System for Testing an Integrated Circuit of a Device and Its Method of Use
Apparatus for Testing Electronic Devices
Apparatus for Testing Electronic Devices
Apparatus for Testing Electronic Devices
Apparatus for Testing Electronic Devices
Apparatus for Testing Electronic Devices
Apparatus for Testing Electronic Devices
Apparatus for Testing Electronic Devices
Assembly for Electrically Connecting a Test Component to a Testing Machine for Testing Electrical Circuits on the Test Component
Assembly for Electrically Connecting a Test Component to a Testing Machine for Testing Electrical Circuits on the Test Component
Assembly for Electrically Connecting a Test Component to a Testing Machine for Testing Electrical Circuits on the Test Component
Assembly for Electrically Connecting a Test Component to a Testing Machine for Testing Electrical Circuits on the Test Component
Connector
Patent:
630,166 →
Application:
29/327,294 →
Contactor Assembly for Testing Electrical Circuits
Patent:
6,853,209 →
Application:
10/197,133 →
Contactor Assembly for Testing Electrical Circuits
Die Carrier
Die Carrier
Electronics Tester with a Signal Distribution Board and a Wafer Chuck Having Different Coefficients of Thermal Expansion
Electronics Tester with a Signal Distribution Board and a Wafer Chuck Having Different Coefficients of Thermal Expansion
Electronics Tester with a Signal Distribution Board and a Wafer Chuck Having Different Coefficients of Thermal Expansion
Enhancements in Testing Devices on Burn-in Boards
Patent:
6,292,415 →
Application:
09/407,659 →
Interface on an Electronics Connector
Patent:
629,760 →
Application:
29/327,293 →
Kinematic Coupling
Method and System for Testing Memory Programming Devices
Patent:
5,682,472 →
Application:
08/407,103 →
Reloading of Die Carriers Without Removal of Die Carriers from Sockets on Test Boards
Reusable Die Carrier for Burn-in and Burn-in Process
Patent:
6,025,732 →
Application:
08/948,696 →
Separate Test Electronics and Blower Modules in an Apparatus for Testing an Integrated Circuit
System for Burn-in Testing of Electronic Devices
Patent:
6,815,966 →
Application:
10/184,525 →
System for Burn-in Testing of Electronic Devices
System for Testing an Integrated Circuit of a Device and Its Method of Use
System for Testing an Integrated Circuit of a Device and Its Method of Use
System for Testing an Integrated Circuit of a Device and Its Method of Use
System for Testing an Integrated Circuit of a Device and Its Method of Use
System for Testing and Burning in of Integrated Circuits
Wafer Burn-in and Test Employing Detachable Cartridge
Wafer Burn-in and Test Employing Detachable Cartridge
Wafer Burn-in and Test Employing Detachable Cartridge
Wafer Level Burn-in and Electrical Test System and Method
Patent:
6,562,636 →
Application:
09/353,121 →
Wafer Level Burn-in and Electrical Test System and Method
Wafer Level Burn-in and Electrical Test System and Method
Wafer Level Burn-in and Electrical Test System and Method
Wafer Level Burn-in and Test Methods
Patent:
6,580,283 →
Application:
09/353,116 →
Wafer Level Burn-in and Test Thermal Chuck and Method
Patent:
6,140,616 →
Application:
09/161,323 →
Wafer-Level Burn-in and Test Cartridge
Patent:
6,340,895 →
Application:
09/353,214 →
Printed Circuit Board Loader/Unloader
Patent:
5,093,984 →
Application:
07/526,069 →
Reusable Die Carrier for Burn-in and Burn-in Process
Patent:
5,517,125 →
Application:
08/089,752 →
High-Density Interconnect Technique
Patent:
5,429,510 →
Application:
08/161,282 →
Related Assignments
(11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 16, 2002
From: JOVANOVIC, JOVAN; UHER, FRANK O.; RICHMOND, DONALD P., II
To: AEHR TEST SYSTEMS
Reel/Frame 013290/0524 →
Assignment of Assignor's Interest
Dec 18, 2002
From: RICHMOND II., DONALD P.; JOVANOVIC, JOVAN
To: AEHR TEST SYSTEMS
Reel/Frame 013304/0779 →
Assignment of Assignor's Interest
Aug 29, 2006
From: RICHMOND, DONALD P., II; DEBOE, KENNETH W.; UHER, FRANK O.; JOVANOVIC, JOVAN
To: AEHR TEST SYSTEMS
Reel/Frame 018249/0439 →
Assignment of Assignor's Interest
Sep 14, 2006
From: MAENNER, THOMAS T.
To: AEHR TEST SYSTEMS
Reel/Frame 018312/0362 →
Assignment of Assignor's Interest
Jan 9, 2009
From: LINDSEY, SCOTT E.; JOVANOVIC, JOVAN; HENDRICKSON, DAVID S.
To: AEHR TEST SYSTEMS
Reel/Frame 022085/0041 →
Security Agreement
Sep 6, 2013
From: AEHR TEST SYSTEMS
To: SILICON VALLEY BANK
Reel/Frame 031171/0001 →
Security Interest
Sep 16, 2014
From: AEHR TEST SYSTEMS
To: SILICON VALLEY BANK
Reel/Frame 033743/0852 →
Release of Security Interest
Apr 13, 2015
From: SILICON VALLEY BANK
To: AEHR TEST SYSTEMS
Reel/Frame 035420/0390 →
Release of Security Interest
Nov 5, 2019
From: QVT FUND LP; QUINTESSENCE FUND L.P.
To: AEHR TEST SYSTEMS
Reel/Frame 050928/0695 →
Assignment of Assignor's Interest
Jul 12, 2022
From: RICHMOND, DONALD P., II; DEBOE, KENNETH W.; UHER, FRANK O.; JOVANOVIC, JOVAN
To: AEHR TEST SYSTEMS
Reel/Frame 060485/0485 →
Assignment of Assignor's Interest
Jul 19, 2022
From: LINDSEY, SCOTT E.; JOVANOVIC, JOVAN; HENDRICKSON, DAVID S.; RICHMOND, DONALD P., II
To: AEHR TEST SYSTEMS
Reel/Frame 060552/0826 →