Die carrier
A die carrier is disclosed which is specifically designed for use in a TSOP socket. More specifically, the die carrier has a carrier substrate with carrier contacts thereon that are dimensioned specifically to match the positioning of the upper and lower socket contacts. The carrier substrate, being 145 microns thick, can also fit between the upper and lower socket contacts. A carrier base support component is located below a portion only of the carrier substrate, and does not impair insertion of the carrier substrate into the relatively small spacing between the upper and lower socket contacts. Damage to the carrier substrate is avoided by clamping edges of the carrier substrate from opposing sides between the upper and lower socket contacts. There are no screws or nuts within the carrier base support component that may increase its size and prevent it from being inserted into the socket.
1. A die carrier, comprising:
a carrier base support component having a first width;
a carrier substrate on the carrier base support component, the carrier substrate dimensioned to fit within a TSOP socket, the carrier substrate having a second width so that left and right portions of the carrier substrate extend beyond the carrier base support component;
a carrier body on the carrier substrate, the carrier body having a retaining formation to temporarily and removably receive a microelectronic die;
a plurality of die contacts within the retaining formation on the carrier substrate to make contact with respective ones of a plurality of terminals on the die; and
a plurality of carrier contacts on at least one surface of each of the left and right portions of the carrier substrate, the carrier contacts being electrically connected to the die contacts.
2. The die carrier of claim 1 , wherein the left and right portions of the carrier substrate are between 135 and 155 microns thick.
3. The die carrier of claim 1 , further comprising:
a compliant component that allows for movement of the die contacts relative to the carrier base support component.
4. The die carrier of claim 1 , having a suction hole through the carrier substrate and the carrier base support component.
5. A die carrier, comprising:
a carrier base support component;
a carrier substrate on the carrier base support component;
a carrier hinge base on the carrier base support component;
a carrier body on the carrier substrate, having a retaining formation to temporarily and removably receive a microelectronic die;
a carrier hinge component; and
a carrier hinge pin inserted through openings in the carrier hinge base and the carrier body to secure the carrier body to the carrier hinge base, and through an opening in the carrier hinge component to secure the carrier hinge component pivotably to the carrier hinge base.
6. The die carrier of claim 5 , wherein the carrier hinge component is a carrier cover pivotably moveable between an open position wherein the die is insertable into or removable from the retaining formation, and a closed position wherein the carrier cover holds the die within the retaining formation.
7. The die carrier of claim 5 , further comprising:
a plurality of die contacts within the retaining formation on the carrier substrate to make contact with respective ones of a plurality of terminals on the die; and
a plurality of carrier contacts located externally of the retaining formation on the carrier substrate, the carrier contacts being electrically connected to the die contacts.
8. A die carrier, comprising:
a carrier substrate dimensioned to fit within a TSOP socket;
a carrier body on the carrier substrate, having a retaining formation to temporarily and removably receive a microelectronic die;
a plurality of die contacts in the retaining formation on an upper side of the carrier substrate to make contact with respective ones of a plurality of terminals on the die; and
a plurality of lower carrier contacts on lower sides of left and right portions of the carrier substrate extending beyond the carrier body, the lower carrier contacts being electrically connected to at least some of the die contacts.
9. The die carrier of claim 8 , further comprising:
a plurality of upper carrier contacts on upper sides of the left and right portions of the carrier substrate, the upper carrier contacts being electrically connected to at least some of the die contacts.
10. A die carrier, comprising:
a carrier body having a retaining formation to temporarily and removably receive a microelectronic die;
a plurality of die contacts in the retaining formation and positioned to make contact with respective ones of a plurality of terminals on the die; and
portions extending to the left and the right of the carrier body, each portion having upper and lower surfaces, at least one of the upper and lower surfaces being at least partially formed by a plurality of carrier contacts that are electrically connected to respective ones of the die contacts, wherein a vertical height between the upper and lower surfaces of a respective portion is between 135 and 155 microns, and wherein the portions extending to the left and the right of the carrier body are dimensioned to fit within a TSOP socket.
11. The die carrier of claim 10 , wherein the carrier body and the portions extending to the left and the right of the carrier body, together, have a width of between 9 and 13 mm, a length of between 18 and 24 mm, and there are between 22 and 35 carrier contacts on a particular portion extending to the left or the right of the carrier body.
12. The die carrier of claim 11 , wherein the vertical height is approximately 145 microns, the width is approximately 12 mm, and the length is approximately 21 mm.
13. The die carrier of claim 12 , wherein there are 27 carrier contacts on a particular portion extending to the left or the right of the carrier body.
14. The die carrier of claim 12 , wherein there are 33 carrier contacts on a particular portion extending to the left or the right of the carrier body.