IP Library Granted Patent US 8,986,048
Granted Patent B2
US 8,986,048 · App. 13/168,910 · Granted Mar 24, 2015

Integrated feedthrough module

Inventors: David S. Hendrickson (Los Gatos, CA); Jovan Jovanovic (Santa Clara, CA); Donald P. Richmond, II (Palo Alto, CA); William D. Barraclough (San Ramon, CA)
Assignee: Aehr Test Systems
G01R31/2862G01R31/2875
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Quick Facts
Patent No.
US 8,986,048
App. No.
13/168,910
Granted
Mar 24, 2015
Kind
B2
Abstract

The invention relates to an apparatus for testing an integrated circuit of an electronic device.

Claims (46)

1. A device holder subassembly, comprising:

a burn-in board substrate having an upper and a lower sides;

a plurality of sockets mounted to the burn-in substrate, each for releasably holding a respective electronic device;

a plurality of device holder terminals within each socket on the upper side of the device holder substrate, each device holder terminal positioned for contacting a respective contact on a respective electronic device;

a plurality of device holder signal contacts secured to the device holder substrate, each device holder signal contact having a surface for releasably mating with a respective surface of a respective signal connector terminal;

a plurality of device holder signal conductors connecting the device holder signal contacts to device holder terminals connected to signal contacts on the electronic devices;

a device holder power contact secured to the device holder substrate, the power connector having a contact surface for releasably mating with a respective surface of a respective power connector terminal; and

at least one device holder power conductor connecting the device holder board power contact to a power contact on one of the electronic devices within one of the sockets, wherein the device holder signal and power contacts are for mating the signal and power connector terminals, the signal and power connector terminals including first and second sets of connector terminals on the upper side of the device holder substrate and third and fourth sets of connector terminals on the lower side of the device holder substrate, the second set of connector terminals being spaced from the first set of connector terminals in a direction that the device holder engages with the connector body and, the fourth set of connector terminals being spaced from the third set of connector terminals in the direction that the device holder engages with the connector body, wherein the first, second, third and fourth sets of connector terminals are connected to respective ones of the device holder terminals on the upper side of the device holder substrate.

2. A module comprising:

a first connector including:

a connector body;

a first set of connector terminals on the connector body for connecting to respective ones of a first set of device holder contacts of a device holder;

a first set of connector contacts on the connector body for connecting to respective ones of a first set of board terminals of a board;

a first set of connector conductors carried by the connector body and connecting the first set of connector terminals to the first set of connector contacts;

a second set of connector terminals on the connector body, the second set of connector terminals being spaced from the first set of connector terminals in a direction that the device holder engages with the connector body;

a second set of connector contacts on the connector body, the second set of connector contacts being spaced from the first set of connector contacts in a direction that the board engages with the connector body; and

a second set of connector conductors carried by the connector body and connecting the second set of connector terminals to the second set of connector contacts;

a feedthrough board including:

a feedthrough board substrate;

first and second sets of board terminals spaced from one another on the feedthrough board substrate and contacting the first and second sets of connector contacts respectively; and

first and second sets of feedthrough board electric conductors carried by the feedthrough board substrate and connected to the first and second sets of board terminals respectively, the feedthrough board being removably mounted to the first connector to form an integrated feedthrough module; and

a backplane board including:

a backplane board, the integrated feedthrough module being connected to the backplane board with the feedthrough board extending horizontally and the backplane board extending vertically, the backplane board having a plurality of backplane board electric conductors connected to the feedthrough board electric conductors of the integrated feedthrough module.

3. The module of claim 2 , wherein the first integrated module includes:

a first insulation piece secured against the connector body, the first insulation piece being located against the feedthrough board substrate; and

a second insulation piece secured to the connector body on an opposite side to the first insulation piece.

4. A module comprising:

(i) a first connector including:

a connector body;

a first set of connector terminals on the connector body for connecting to respective ones of a first set of device holder contacts of a device holder;

a first set of connector contacts on the connector body; and

a first set of connector conductors carried by the connector body and connecting the first set of connector terminals to the first set of connector contacts;

(ii) a feedthrough board including:

a feedthrough board substrate;

a first set of board terminals on the feedthrough board substrate and contacting the first connector contacts; and

a first set of feedthrough board electric conductors carried by the feedthrough board substrate and connected to the first set of board terminals, the feedthrough board being mounted to the first connector to form an integrated feedthrough module; and

(iii) a first insulation piece secured against an outer surface of the connector body and the feedthrough board substrate.

5. The module of claim 4 , further comprising:

a second set of connector terminals on the connector body, the second set of connector terminals being spaced from the first set of connector terminals in a direction that the device holder engages with the connector body.

6. The module of claim 5 , wherein the device holder includes first and second sets of device holder contacts spaced from one another on a device holder substrate and contacting the first and second sets of connector terminals respectively.

7. The module of claim 4 , further comprising:

a fastener that secures the insulation piece to the connector body and the integrated feedthrough module.

8. The module of claim 4 , further comprising:

a second insulation piece secured against an outer surface of the connector body and the feedthrough board substrate on an opposite side to the first insulation piece.

9. The module of claim 8 , further comprising:

a fastener that secures the first and second insulation pieces to the connector body and the integrated feedthrough module.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Nov 5, 2019
From: QVT FUND LP; QUINTESSENCE FUND L.P.
To: AEHR TEST SYSTEMS
Reel/Frame 050928/0695 →
SECURITY INTEREST Recorded Apr 14, 2015
From: AEHR TEST SYSTEMS
To: QVT FUND LP; QUINTESSENCE FUND L.P.
Reel/Frame 035424/0783 →
RELEASE OF SECURITY INTEREST Recorded Apr 13, 2015
From: SILICON VALLEY BANK
To: AEHR TEST SYSTEMS
Reel/Frame 035420/0390 →
SECURITY AGREEMENT Recorded Sep 6, 2013
From: AEHR TEST SYSTEMS
To: SILICON VALLEY BANK
Reel/Frame 031171/0001 →
Continuity (2)
Division 12437465 · May 7, 2009
Related Publication 20110256774A1 · Oct 20, 2011