Apparatus for testing electronic devices
An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows for fanning-in of electric paths. A distribution board has a plurality of interfaces that are strategically positioned to provide a dense configuration. The interfaces are connected through flexible attachments to an array of first connector modules. Each one of the first connector modules can be independently connected to a respective one of a plurality of second connector modules, thereby reducing stresses on a frame of the apparatus. Further features include for example a piston that allows for tight control of forces exerted by terminals onto contacts of a wafer.
1. An apparatus for testing an integrated circuit of a device, comprising:
an apparatus frame having first, second, and third portions;
a holder for the device mounted to the first portion of the apparatus frame;
a plurality of first connector modules held by the second portion of the apparatus frame, each having a body and a plurality of terminals and contacts on the body;
a contactor support structure;
a plurality of terminals on the contactor support structure, the contactor support structure being positioned so that the terminals thereon can make contact with contacts on the device;
a plurality of conductors connecting the terminals on the contactor support structure with the terminals of the first connector modules; and
a plurality of second connector modules held by the third portion of the apparatus frame, each having a body and a plurality of terminals and contacts on the body, the contacts of the first connector modules being engageable with the terminals of the second connector modules.
2. The apparatus of claim 1 , wherein the third portion of the apparatus frame is movable relative to the second portion of the apparatus frame to move the second connector modules relatively toward the first connector modules.
3. The apparatus of claim 1 , wherein the first connector modules are located in an array having a plurality of rows and columns.
4. The apparatus of claim 1 , wherein the first connector modules are located over a first area and the terminals on the contactor support structure are located over a second area, the first area being larger than the second area.
5. The apparatus of claim 1 , comprising a plurality of flexible ribbons, each including a flexible outer layer and a respective set of the conductors within the respective flexible outer layer.
6. The apparatus of claim 1 , wherein the body of each respective first connector module has a plurality of gaps formed therein and the contacts of the first connector module are within the gaps, and wherein each respective second connector module has a plurality of substrates held by the body of the second connector module and the terminals of the second connector module being located on the substrates, the substrates being insertable into the gaps.