IP Library Granted Patent US 7,863,730
Granted Patent B2
US 7,863,730 · App. 10/921,377 · Granted Jan 4, 2011

Array-molded package heat spreader and fabrication method therefor

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Quick Facts
Patent No.
US 7,863,730
App. No.
10/921,377
Granted
Jan 4, 2011
Kind
B2
Abstract

A method for forming a heat spreader, and the heat spreader formed thereby, are disclosed. An array heat spreader having a plurality of connected heat spreader panels is formed. Slots are formed in opposing sides of the heat spreader panels. Legs are formed on and extending downwardly from each of the heat spreader panels in at least an opposing pair of the slots on the heat spreader panels. The legs are integral with the respective heat spreader panels from which they depend.

Claims (51)

1. A method for forming a heat spreader, comprising:

forming an array heat spreader having a plurality of connected heat spreader panels;

forming slots in opposing sides of the heat spreader panels, the slots extending horizontally along the heat spreader panels and extending substantially vertically through a top of the array heat spreader and a bottom of the array heat spreader; and

forming legs from material of the slots, the legs on and extending substantially vertically to each of the heat spreader panels adjacent to at least an opposing pair of the slots thereon, the legs being integral with the respective heat spreader panels from which they depend.

2. The method of claim 1 further comprising forming protrusions on the periphery of the array heat spreader, the protrusions being located for centering the array heat spreader in a cavity-down mold.

3. The method of claim 1 further comprising forming tip slots and legs in the corners of the array heat spreader.

4. The method of claim 1 further comprising forming at least one of:

an opening through at least one of the legs; and

at least one tab on at least one of the legs.

5. The method of claim 1 further comprising forming at least one of:

at least one inclined leg extending away from the heat spreader panels; and

feet on the bottom of at least one of the legs.

6. A method for forming a heat spreader, comprising:

forming an array heat spreader having a plurality of connected heat spreader panels;

forming slots in all the sides of the heat spreader panels, the slots extending horizontally along the heat spreader panels and substantially vertically through a top of the array heat spreader and a bottom of the array heat spreader;

forming stand-off and support legs from material of the slots, the legs on and extending substantially vertically to each of the heat spreader panels adjacent to all the slots thereon, the legs being integral with the respective heat spreader panels from which they depend;

encapsulating the heat spreader panels and legs in a molding compound; and

singulating individual packages from the encapsulated heat spreader panels and legs.

7. The method of claim 6 further comprising forming protrusions on the periphery of the array heat spreader, the protrusions being located for centering the array heat spreader in a cavity-down mold.

8. The method of claim 6 further comprising forming tip slots and legs in the corners of the array heat spreader.

9. The method of claim 6 further comprising forming at least one of:

an opening through at least one of the legs; and

at least one tab on at least one of the legs.

10. The method of claim 6 further comprising forming at least one of:

at least one inclined leg extending away from the heat spreader panels; and

feet on the bottom of at least one of the legs.

11. A heat spreader, comprising:

an array heat spreader having a plurality of connected heat spreader panels;

means forming slots in opposing sides of the heat spreader panels, the slots extended horizontally along the heat spreader panels and extended substantially vertically through a top of the array heat spreader and a bottom of the array heat spreader; and

legs on and extending downwardly from each of the heat spreader panels in at least an opposing pair of the slots thereon, the legs being integral with the respective heat spreader panels from which they depend and including material from the slots.

12. The heat spreader of claim 11 further comprising protrusions on the periphery of the array heat spreader, the protrusions being located for centering the array heat spreader in a cavity-down mold.

13. The heat spreader of claim 11 further comprising tip slots and legs in the corners of the array heat spreader.

14. The heat spreader of claim 11 further comprising at least one of:

an opening through at least one of the legs; and

at least one tab on at least one of the legs.

15. The heat spreader of claim 11 further comprising at least one of:

at least one inclined leg extending away from the heat spreader panels; and

feet on the bottom of at least one of the legs.

16. A heat spreader, comprising:

an array heat spreader having a plurality of connected heat spreader panels;

means forming slots in all the sides of the heat spreader panels;

stand-off and support legs on and extending downwardly from each of the heat spreader panels in all the slots thereon, the legs being integral with the respective heat spreader panels from which they depend; and

a molding compound encapsulating the heat spreader panels and legs.

17. The heat spreader of claim 16 further comprising protrusions on the periphery of the array heat spreader, the protrusions being located for centering the array heat spreader in a cavity-down mold.

18. The heat spreader of claim 16 further comprising tip slots and legs in the corners of the array heat spreader.

19. The heat spreader of claim 16 further comprising at least one of:

an opening through at least one of the legs; and

at least one tab on at least one of the legs.

20. The heat spreader of claim 16 further comprising at least one of:

at least one inclined leg extending away from the heat spreader panels; and

feet on the bottom of at least one of the legs.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S NAME PREVIOUSLY RECORDED AT REEL: 038378 FRAME: 0400. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064806/0593 →
RELEASE OF SECURITY INTEREST Recorded Jun 16, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052950/0497 →
CHANGE OF NAME Recorded Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0400 →
CHANGE OF NAME Recorded Aug 6, 2015
From: ST ASSEMBLY TEST SERVICES LTD.
To: STATS CHIPPAC LTD.
Reel/Frame 036286/0590 →
SECURITY INTEREST Recorded Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2004
From: SHIM, IL KWON; RAMAKRISHNA, KAMBHAMPATI; SAHAKIAN, DIANE; CHOW, SENG GUAN; FILOTEO, JR., DARIO S.; ARARAO, VIRGIL COTOCO
To: ST ASSEMBLY TEST SERVICES LTD.
Reel/Frame 015266/0912 →