IP Library Granted Patent US 7,197,723
Granted Patent B2
US 7,197,723 · App. 10/953,480 · Granted Mar 27, 2007

Semiconductor device manufacturing

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Quick Facts
Patent No.
US 7,197,723
App. No.
10/953,480
Granted
Mar 27, 2007
Kind
B2
Abstract

In a system including a plurality of diverse semiconductor manufacturing facilities, each of the facilities having a respective manufacturing process requiring semiconductor specific design information in a corresponding diverse format, a method for supplying data to each of the facilities in an appropriate format includes establishing a database for each of the plurality of facilities, the database identifying the appropriate format for each of the facilities. The method also includes receiving semiconductor specific design information and converting the design information in accordance with the appropriate format for one of selected ones of the facilities. The method further includes providing a respective tapeout to said one of the selected ones of the facilities, each tapeout comprising the design information formatted in the appropriate format for the respective facility receiving the tapeout.

Claims (16)

1. In a system including a plurality of diverse semiconductor manufacturing facilities, each of the plurality of diverse semiconductor manufacturing facilities having a respective manufacturing process requiring semiconductor specific design information in a corresponding diverse format, a method for supplying data to each of the plurality of diverse semiconductor manufacturing facilities in an appropriate format comprising:

establishing a database for each of the plurality of diverse semiconductor manufacturing facilities, the database identifying the appropriate format for each of the plurality of diverse semiconductor manufacturing facilities;

receiving semiconductor specific design information;

converting the received semiconductor specific design information in accordance with an appropriate format for one of selected ones of the plurality of diverse semiconductor manufacturing facilities; and

providing a respective tapeout to said one of the selected ones of the plurality of diverse semiconductor manufacturing facilities, each tapeout comprising the received semiconductor specific design information formatted in an appropriate format for said one semiconductor manufacturing facility receiving the tapeout.

2. The method of claim 1 , wherein the semiconductor specific design information includes a desired number of semiconductor devices to be produced, the method further comprising:

determining a production availability for each of the plurality of diverse semiconductor manufacturing facilities; and

selecting at least one of the plurality of diverse semiconductor manufacturing facilities to manufacture a semiconductor device based on the desired number of semiconductor devices to be produced and the production availability of the at least one of the plurality of diverse semiconductor manufacturing facilities.

3. The method of claim 1 , further comprising, before providing a respective tapeout, ensuring that providing the converted received semiconductor specific design information is not prohibited by a regulatory agency.

4. The method of claim 1 , further comprising, before providing a respective tapeout, ensuring that any intellectual property rights associated with the converted semiconductor specific design information are properly licensed.

5. The method of claim 1 , wherein the receiving the semiconductor specific design information comprises:

providing a generic electronic form to be completed by a semiconductor designer; and

receiving a completed version of the generic electronic form from the semiconductor designer for a semiconductor specific design.

6. The method of claim 5 , wherein the converting the received semiconductor specific design information comprises:

extracting semiconductor specific design data from a received completed version of the generic electronic form; and

populating a facility specific form with the semiconductor specific design data from the generic electronic form.

Assignments (11)
RELEASE OF SECURITY INTEREST Recorded Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059720/0223 →
SECURITY INTEREST Recorded Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 060885/0001 →
SECURITY INTEREST Recorded Feb 1, 2018
From: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 045216/0020 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044886/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044887/0109 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032856-0031) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
MERGER Recorded Feb 20, 2015
From: AGERE SYSTEMS INC.
To: AGERE SYSTEMS LLC
Reel/Frame 035058/0895 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2015
From: AGERE SYSTEMS LLC
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035059/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →