IP Library Granted Patent US 7,250,646
Granted Patent B2
US 7,250,646 · App. 10/965,780 · Granted Jul 31, 2007

TFT mask ROM and method for making same

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Quick Facts
Patent No.
US 7,250,646
App. No.
10/965,780
Filed
Oct 18, 2004
Granted
Jul 31, 2007
Kind
B2
Art Unit
2823
USPC
257/390
Abstract

There is provided a monolithic three dimensional TFT mask ROM array. The array includes a plurality of device levels. Each of the plurality of device levels contains a first set of enabled TFTs and a second set of partially or totally disabled TFTs.

Claims (48)

1. A mask ROM array, comprising:

a first set of enabled transistors in which each transistor contains a charge storage region; and

a second set of partially or totally disabled transistors;

wherein the first set of transistors and the second set of transistors comprise TFTs.

2. The array of claim 1 , wherein each transistor of the second set of transistors contains a charge storage region.

3. The array of claim 1 , wherein the second set of TFTs comprises a set of totally disabled TFTs.

4. The array of claim 1 , wherein the second set of TFTs comprises a plurality of totally disabled TFTs and a plurality of partially disabled TFTs.

5. The array of claim 1 , wherein at least a portion of channel regions of the partially or totally disabled TFTs of the second set have been selectively removed.

6. The array of claim 1 , wherein at least a portion of channel regions of the partially or totally disabled TFTs of the second set have been selectively doped to increase a threshold voltage of said TFTs to render said TFTs partially or totally inoperative.

7. The array of claim 1 , wherein:

the TFTs are selected from one or more of top gate co-planar TFTs, top gate staggered TFTs, bottom gate co-planar TFTs and bottom gate staggered TFTs; and

the charge storage region comprises a dielectric isolated floating gate, an ONO dielectric film or an insulating layer containing conductive nanocrystals located between a gate and a channel of a TFT.

8. The array of claim 7 , further comprising:

a first plurality of spaced apart conductors disposed at a first height above a substrate in a first direction; and

a second plurality of spaced apart rail stacks disposed at a second height in a second direction different from the first direction, each rail stack including:

a first semiconductor layer whose first surface is in contact with said first plurality of spaced apart conductors;

a conductive film; and

the charge storage region disposed between a second surface of the first semiconductor layer and the conductive film.

9. The array of claim 8 , wherein:

the first plurality of conductors comprise first rails, each comprising a polysilicon layer in contact with a metal or a metal silicide layer;

the first semiconductor layer comprises a polysilicon layer;

the conductive film comprises a polysilicon layer and a metal silicide layer; and

the TFTs are formed at intersections of adjacent first rails and the second rail stacks, such that the conductive film comprises a gate of the TFTs, portions of the first semiconductor layer comprise TFT channel regions and the polysilicon layers of the first rails comprise at least a portion of TFT source and drain regions.

10. A monolithic three dimensional TFT mask ROM array, comprising a plurality of device levels, wherein at least one device level of the plurality of device levels comprises the array of claim 1 .

11. The array of claim 1 , wherein the array comprises an array of CMOS TFTs each comprising the charge storage region.

12. The array of claim 11 , wherein the programmed array comprises a static random access memory cell and a logic cell.

13. The array of claim 12 , wherein the static random access memory array comprises:

the first set of enabled transistors comprising a set of enabled access and inverter TFTs;

the second set of partially or totally disabled transistors comprising a set of disabled isolation TFTs having at least a portion of a channel region removed;

and a third set of isolation TFTs having at least a portion of a channel region removed and at least a portion of the charge storage region removed such that a gate electrode contacts source or drain regions of the TFTs of the third set.

14. The array of claim 12 , wherein the logic cell comprises at least one antifuse link connecting a gate electrode and a source or a drain of a TFT.

15. The array of claim 1 , further comprising at least one antifuse link connecting a gate electrode and a source or a drain of a TFT.

16. The array of claim 1 , wherein at least one transistor of the second set of transistors is programmed by a mask ROM programming technique and at least one other transistor of the first set of transistors is programmed by hot carrier injection or Fowler-Nordheim tunneling.

17. The array of claim 1 , wherein the first set of enabled transistors comprises a set of EEPROM transistors.

18. The array of claim 1 , wherein each transistor of the first set of enabled transistors contains a charge storage region located between a gate and a channel.

19. A mask ROM array, comprising:

a first set of enabled transistors in which each transistor contains a charge storage region; and

a second set of partially or totally disabled transistors;

wherein at least one transistor of the second set of transistors is programmed by a mask ROM programming technique and at least one other transistor of the first set of transistors is programmed by hot carrier injection or Fowler-Nordheim tunneling.

20. The array of claim 19 , wherein the programmed array comprises a static random access memory cell and a logic cell.

21. The array of claim 20 , wherein the logic cell comprises at least one antifuse link connecting a gate electrode and a source or a drain of a transistor.

22. The array of claim 19 , wherein each transistor of the second set of transistors contains a charge storage region.

23. The array of claim 19 , wherein each transistor of the first set of transistors contains the charge storage region located between a gate and a channel.

24. The array of claim 23 , wherein each transistor of the second set of transistors contains a charge storage region.

25. The array of claim 23 , wherein the charge storage region comprises a dielectric isolated floating gate.

26. The array of claim 23 , wherein the charge storage region comprises an ONO dielectric film.

27. The array of claim 23 , wherein the charge storage region comprises an insulating layer containing conductive nanocrystals.

28. The array of claim 23 , wherein the first set of enabled transistors comprises a set of EEPROM transistors.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 12, 2021
From: SANDISK TECHNOLOGIES LLC
To: WODEN TECHNOLOGIES INC.
Reel/Frame 058871/0928 →
CHANGE OF NAME Recorded May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038813/0004 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT LISTED PATENT NUMBER 8853569 TO THE CORRECT PATENT NUMBER 8883569 PREVIOUSLY RECORDED ON REEL 038300 FRAME 0665. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Apr 25, 2016
From: SANDISK 3D LLC
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038520/0552 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2016
From: SANDISK 3D LLC.
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038300/0665 →
CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECTIVE MERGER TO ADD PAGES TO THE MERGER DOCUMENT PREVIOUSLY RECORDED PREVIOUSLY RECORDED ON REEL 017544 FRAME 0769. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 2, 2007
From: MATRIX SEMICONDUCTOR, INC.
To: SANDISK 3D LLC
Reel/Frame 018950/0686 →
MERGER Recorded Apr 28, 2006
From: MATRIX SEMICONDUCTOR, INC.
To: SANDISK 3D LLC
Reel/Frame 017544/0769 →