Integrated circuit package
View Patent ↗An integrated circuit package is provided. A substrate is provided having solder openings therein and a conductive layer thereon. The conductive layer is processed to form a plurality of pads over the solder openings in the substrate. A mask is formed over the plurality of pads and openings formed in the mask over at least two pads of the plurality of pads. An integrated circuit die is bonded over the substrate using a conductive adhesive where the conductive adhesive is placed in the openings in conductive contact with at least two pads of the plurality of pads.
1. An integrated circuit comprising:
a substrate having solder openings provided therein;
a conductive layer on the substrate forming a plurality of pads over the solder openings in the substrate;
a mask over the plurality of pads, the mask having openings provided therein over at least two pads of the plurality of pads;
an integrated circuit die over the substrate; and
a conductive adhesive in the openings in conductive contact with the at least two pads of the plurality of pads, the conductive adhesive bonding the integrated circuit die over the substrate.
2. The integrated circuit as claimed in claim 1 wherein the conductive layer is a metal layer bonded to or integrally deposited on the substrate.
3. The integrated circuit as claimed in claim 1 additionally comprising:
a cross-connect in the conductive layer connecting at least two further pads of the plurality of pads; and
wherein:
the mask insulates the cross-connect from the conductive adhesive.
4. The integrated circuit as claimed in claim 1 additionally comprising:
a conductive plane over the substrate and under the integrated circuit die, the conductive plane bonded to the substrate by the conductive adhesive and in conductive contact with a pad of the plurality of pads.
5. The integrated circuit as claimed in claim 1 additionally comprising:
a conductive plane over the substrate and bonded to the substrate by the conductive adhesive and in conductive contact by the conductive adhesive with a pad of the plurality of pads; and
additional conductive adhesive bonding the integrated circuit die to the conductive plane.
6. An integrated circuit comprising:
a substrate having solder openings provided therein;
a metal layer on the substrate forming a plurality of pads over the solder openings in the substrate;
a soldermask over the plurality of pads, the soldermask having openings provided therein over at least two pads of the plurality of pads;
an integrated circuit die over the substrate; and
a conductive die attach adhesive in the openings in conductive contact with the at least two pads of the plurality of pads, the conductive die attach adhesive bonding the integrated circuit die over the substrate.
7. The integrated circuit as claimed in claim 6 wherein the metal layer is bonded to or integrally deposited on the substrate.
8. The integrated circuit as claimed in claim 6 additionally comprising:
a power cross-connect in the metal layer connecting at least two power pads of the plurality of pads; and
wherein:
the soldermask isolates and insulates the power cross-connect from the conductive die attach adhesive.
9. The integrated circuit as claimed in claim 6 additionally comprising:
a power cross-connect in the metal layer connecting at least two power pads of the plurality of pads;
a ground plane over the substrate and under the integrated circuit die, the ground plane bonded to the substrate by the conductive die attach adhesive and in conductive contact with a pad of the plurality of pads.
10. The integrated circuit as claimed in claim 6 additionally comprising:
a power cross-connect in the metal layer connecting at least two power pads of the plurality of pads;
a ground plane over the substrate and bonded to the substrate by the conductive die attach adhesive and in conductive contact by the conductive die attach adhesive with a pad of the plurality of pads; and
additional conductive die attach adhesive bonding the integrated circuit die to the ground plane.