IP Library Granted Patent US 7,102,470
Granted Patent B2
US 7,102,470 · App. 10/978,395 · Granted Sep 5, 2006

Dual-band bandpass filter with stepped-impedance resonators

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Quick Facts
Patent No.
US 7,102,470
App. No.
10/978,395
Granted
Sep 5, 2006
Kind
B2
Abstract

A dual-band bandpass filter with stepped-impedance resonators uses only one circuit to generate dual-band effect. It adopts the principle of stepped-impedance resonator, which contains a connecting section and two coupling sections. The impedance and electrical length of the connecting section and coupling sections conforms to a selected condition to generate two passbands at desired frequencies. A multi-layer broadside-coupled parallel lines structure may be applied to increase coupling-amount between the parallel lines so that the dual-band bandpass filters have broader bandwidth and less loss.

Claims (69)

1. A dual-band bandpass filter equipped with stepped-impedance resonators for filtering a signal, comprising:

a circuit board;

an input end located on the circuit board for receiving the signal;

an output end located on the circuit board to transmit the filtered signal; and

at least two resonators located on the circuit board, each of the resonators including a connecting section and two coupling sections; the connecting section connecting two coupling sections; one coupling section of the first resonator being coupled with one coupling section of the second resonator and the other coupling section of the first resonator being coupled with the input end or the output end;

wherein the circuit board is a multi-layer circuit board, including at least a first layer, a second layer and a third layer, the resonators being located at least on the second layer, the input end and the output end being located respectively on the first layer and the third layer;

wherein an impedance of the connecting section and the coupling sections satisfies the condition:

R

=

(

tan

π

f

1

2

f

2

)

2

,

wherein f 1 is a first resonance frequency of the resonator, and f 2 is the second resonance frequency of the resonator and wherein each of the connecting sections of the two resonators is located on two of the layers of the circuit board such that the coupling sections of the two resonators are located on two opposite sides of the circuit board.

2. The dual-band bandpass filter equipped with stepped-impedance resonators of claim 1 , wherein the impedance of the connecting section and the coupling section is controllable by adjusting the width and length of the coupling sections and the connecting section.

3. The dual-band bandpass filter equipped with stepped-impedance resonators of claim 1 , wherein the coupling sections are connected to the two ends of the connecting section in a symmetrical fashion.

4. The dual-band bandpass filter equipped with stepped-impedance resonators of claim 1 , wherein the coupling sections and the connecting section are transverse electromagnetic (TEM) or quasi-TEM transmission lines.

5. The dual-band bandpass filter equipped with stepped-impedance resonators of claim 4 , wherein the coupling sections have respectively a long shaft in parallel with a long shaft of the connecting section.

6. The dual-band bandpass filter equipped with stepped-impedance resonators of claim 4 , wherein the coupling sections have respectively a long shaft in normal to a long shaft of the connecting section.

7. The dual-band bandpass filter equipped with stepped-impedance resonators of claim 6 , wherein the two coupling sections are located on the same side of the connecting section.

8. The dual-band bandpass filter equipped with stepped-impedance resonators of claim 6 , wherein the two coupling sections are located on two opposite sides of the connecting section.

9. The dual-band bandpass filter equipped with stepped-impedance resonators of claim 1 , wherein the resonators, and the input end and the output end are located on opposite sides to the circuit board.

10. The dual-band bandpass filter equipped with stepped-impedance resonators of claim 1 , wherein the coupling sections are broadside-coupled or co-plane coupled.

11. A dual-band bandpass filter equipped with stepped-impedance resonators for filtering a signal, comprising:

a circuit board;

an input end located on the circuit board for receiving the signal;

an output end located on the circuit board to transmit the filtered signal; and

at least two resonators located on the circuit board, each of the resonators including a connecting section and two coupling sections; the connecting section connecting two-coupling sections; one coupling section of the first resonator being coupled with one coupling section of the second resonator and the other coupling section of the first resonator being coupled with the input end or the output end;

wherein the circuit board is a multi-layer circuit board including at least a first layer, a second layer and a third layer, one of the two resonators being coupled with the input end on the first layer and being crossed over to the second layer to couple with another resonator, the other resonator being crossed over to the third layer to couple with the output end;

wherein an impedance of the connecting section and the coupling section satisfies the condition:

R

=

(

tan

π

f

1

2

f

2

)

2

,

wherein f 1 is a first resonance frequency of the resonator, and f 2 is the second resonance frequency of the resonator.

12. The dual-band bandpass filter equipped with stepped-impedance resonators of claim 11 , wherein the impedance of the connecting section and the coupling section is controllable by adjusting the width and length of the coupling sections and the connecting section.

13. The dual-band bandpass filter equipped with stepped-impedance resonators of claim 11 , wherein the coupling sections are connected to the two ends of the connecting section in a symmetrical fashion.

14. The dual-band bandpass filter equipped with stepped-impedance resonators of claim 11 , wherein the coupling sections and the connecting section are transverse electromagnetic (TEM) or quasi-TEM transmission lines.

15. The dual-band bandpass filter equipped with stepped-impedance resonators of claim 14 , wherein the coupling sections have respectively a long shaft in parallel with a long shaft of the connecting section.

16. The dual-band bandpass filter equipped with stepped-impedance resonators of claim 14 , wherein the coupling sections have respectively a long shaft in normal to a long shaft of the connecting section.

17. The dual-band bandpass filter equipped with stepped-impedance resonators of claim 16 , wherein the two coupling sections are located on the same side of the connecting section.

18. The dual-band bandpass filter equipped with stepped-impedance resonators of claim 16 , wherein the two coupling sections are located on two opposite sides of the connecting section.

19. The dual-band bandpass filter equipped with stepped-impedance resonators of claim 11 , wherein the resonators, and the input end and the output end are located on opposite sides to the circuit board.

20. The dual-band bandpass filter equipped with stepped-impedance resonators of claim 11 , wherein each of the connecting sections of the two resonators is located on two sides of the circuit board such that the coupling sections of the two resonators are located on two opposite sides of the circuit board.

21. The dual-band bandpass filter equipped with stepped-impedance resonators of claim 11 , wherein the coupling sections are broadside-coupled or co-plane coupled.

Assignments (18)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 059666/0545 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: MICROCHIP TECHNOLOGY INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0617 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 18, 2015
From: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 036631/0442 →
MERGER Recorded Sep 6, 2015
From: ISSC TECHNOLOGIES CORP.
To: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
Reel/Frame 036561/0892 →
CHANGE OF NAME Recorded Oct 18, 2011
From: INTEGRATED SYSTEM SOLUTION CORP.
To: ISSC TECHNOLOGIES CORP.
Reel/Frame 027082/0905 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 2, 2004
From: CHANG, SHENG-FUH; CHANG, SHUEN-CHIEN; CHEN, JIA LIANG; CHEN, SHIH-CHIEH; CHEN, HUNG-CHENG; TANG, SHU-FEN; CHEN, ALBERT
To: INTEGRATED SYSTEM SOLUTION CORP.; CHANG, SHENG-FUH
Reel/Frame 015950/0189 →