Shielded package having shield fence
View Patent ↗A shielded package includes a shield assembly having a shield fence, a shield lid, and a shield lid adhesive electrically coupling the shield lid to the shield fence. The shield fence includes a porous sidewall through which molding compound passes during molding of the shielded package. Further, the shield fence includes a central aperture through which an electronic component is die attached and wire bonded.
1. A structure comprising:
a substrate comprising a first surface and a second surface;
a first electronic component coupled to the first surface of the substrate;
a ground ring on the first surface, wherein the first electronic component is coupled to a central region of the first surface of the substrate defined by the ground ring;
a second electronic component coupled to the central region;
at least one ground trace on the second surface, the at least one ground trace being coupled to the ground ring; and
a shield assembly comprising:
a shield fence comprising posts and a shield lid mounting ring, the posts being electrically coupled to the ground ring; and
a shield lid electrically coupled to the shield lid mounting ring; and
an encapsulant enclosing the first surface of the substrate, the first electronic component, and the shield fence.
2. The structure of claim 1 wherein the encapsulant further encloses the second electronic component.
3. The structure of claim 1 wherein the shield lid comprises an electrically conductive ink.
4. A structure comprising:
a substrate comprising a first surface and a second surface;
a ground ring on the first surface;
a first electronic component coupled to a central region of the first surface of the substrate defined by the ground ring;
traces on the first surface of the substrate;
bond wires coupling bond pads of the first electronic component to the traces;
at least one ground trace on the second surface, the at least one ground trace being coupled to the ground ring;
a shield assembly comprising:
a shield fence comprising:
a porous sidewall comprising posts, the posts being electrically coupled to the ground ring; and
a shield lid mounting ring;
a shield lid;
a shield lid adhesive electrically coupling the shield lid to the shield lid mounting ring; and
an encapsulant enclosing the first surface of the substrate, the first electronic component, the bond wires, and the shield fence.
5. The structure of claim 4 wherein the porous sidewall further comprises post supports extending between and connecting adjacent ones of the posts.
6. The structure of claim 4 wherein the porous sidewall comprises molding apertures.
7. The structure of claim 6 wherein the molding apertures are defined by the shield lid mounting ring and the posts.
8. The structure of claim 7 wherein the encapsulant is formed from molding compound which has passed through the molding apertures.
9. The structure of claim 4 wherein the shield lid is spaced above the encapsulant.
10. The structure of claim 4 wherein the shield lid adhesive spaces the shield lid above the encapsulant.