IP Library Granted Patent US 7,328,716
Granted Patent B2
US 7,328,716 · App. 11/062,509 · Granted Feb 12, 2008

Pressure-based gas delivery system and method for reducing risks associated with storage and delivery of high pressure gases

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Quick Facts
Patent No.
US 7,328,716
App. No.
11/062,509
Granted
Feb 12, 2008
Kind
B2
Abstract

Apparatus and method for dispensing a gas using a gas source coupled in selective flow relationship with a gas manifold. The gas manifold includes flow circuitry for discharging gas to a gas-using zone, and the gas source includes a pressure-regulated gas source vessel containing the gas at superatmospheric pressure. The pressure-regulated gas source vessel can be arranged with a pressure regulator at or within the vessel and a flow control valve coupled in flow relationship to the vessel, so that gas dispensed from the vessel flows through the regulator prior to flow through the flow control valve, and into the gas manifold. The apparatus and method permit an enhancement of the safety of storage and dispensing of toxic or otherwise hazardous gases used in semiconductor processes.

Claims (33)

1. An assembly for dispensing gas, comprising:

(a) a pressure-regulated gas source vessel adapted to hold fluid at superatmospheric pressure and constructed and arranged for discharging the gas at substantially lower pressure;

(b) a gas manifold adapted to receive discharged gas from the pressure-regulated gas source vessel and comprising gas flow circuitry for dispensing said gas;

wherein the gas manifold is constructed and arranged to: (i) selectively isolate the flow circuitry of the gas manifold from the pressure-regulated gas source vessel; and/or (ii) remove gas from the gas flow circuitry to enable change-out of the gas source vessel when the vessel has become depleted of gas to a predetermined extent.

2. The gas dispensing assembly of claim 1 , having at least one gas pressure regulator interiorly disposed in the gas source vessel within the interior volume that holds the fluid.

3. The gas dispensing assembly of claim 1 , wherein the circuitry of the gas manifold is isolatable from the pressure-regulated gas source vessel when a predetermined occurrence is detected in the gas manifold.

4. The gas dispensing assembly of claim 3 , wherein the predetermined occurrence is detected using a property of the dispensed gas.

5. The gas dispensing assembly of claim 1 , wherein the circuitry of the gas manifold is isolatable from the pressure-regulated gas source vessel when a gas is detected in the gas manifold at a pressure exceeding a predetermined pressure.

6. The gas dispensing assembly of claim 3 , wherein the predetermined occurrence is one or more of a high pressure occurrence.

7. The gas dispensing assembly of claim 3 , wherein the predetermined occurrence is a diminution of pressure in the gas manifold.

8. The gas dispensing assembly of claim 3 , wherein the predetermined occurrence is detected by volumetric flow rate of dispensed gas.

9. The gas dispensing assembly of claim 1 , wherein the gas source vessel holds fluid at superatmospheric pressure, and said fluid is selected from the group consisting of boron trifluoride, silane, methylsilane, trimethylsilane, arsine, phosphine, diborane, chlorine, BCl 3 , B 2 D 6 , tungsten hexafluoride, hydrogen fluoride, hydrogen chloride, hydrogen iodide, hydrogen bromide, germane, ammonia, stibine, hydrogen sulfide, hydrogen selenide, hydrogen telluride, halide (chlorine, bromine, iodine, and fluorine) gaseous compounds, NF 3 , organometallic compounds, Group V compounds, (CH 3 ) 3 Sb, hydrocarbon gases, silicon-containing gases, halide-containing gases, hydrogen, methane, nitrogen, carbon monoxide, and rare gas halides.

10. The gas dispensing assembly of claim 1 , wherein the gas source vessel contains a gas for semiconductor manufacturing.

11. The gas dispensing assembly of claim 1 , further comprising at least one component selected from the group consisting of:

(i) a vacuum circuit operable to effect evacuation of at least part of the flow circuitry of the gas manifold;

(ii) a purge gas circuit operable to effect purging of at least part of the flow circuitry of the gas manifold;

(iii) at least one flow control valve in the gas manifold;

(iv) at least one pressure sensor in the gas manifold;

(v) at least one pressure switch in the gas manifold; and

(vi) at least one regulator in the gas manifold.

12. The gas dispensing assembly of claim 1 , further comprising an electronics module, wherein said manifold is valved, including valves that are selectively adjustable, and at least one of said valves is operatively coupled to the electronics module for adjustment of at least one of said valves in operation of the gas dispensing assembly.

13. The gas dispensing assembly of claim 1 , further comprising an electronics module adapted to control a process condition of gas in operation of said assembly.

14. The gas dispensing assembly of claim 13 , wherein the process condition of gas comprises a condition selected from the group consisting of pressure, temperature, flow rate and composition of the gas.

15. The gas dispensing assembly of claim 14 , wherein the process condition of gas comprises pressure.

16. The gas dispensing assembly of claim 1 , further comprising a gas cabinet in which said gas source vessel and gas manifold are disposed.

17. The gas dispensing assembly of claim 1 , wherein the gas manifold is operatively coupled to a multiplicity of pressure-regulated gas source vessels.

18. A gas dispensing assembly for dispensing gas, comprising: (a) a pressure-regulated gas source vessel holding gas at superatmospheric pressure and constructed and arranged for discharging the gas at substantially lower pressure; (b) a gas manifold arranged to receive discharged gas from the pressure-regulated gas source vessel and comprising gas flow circuitry for dispensing said gas;

wherein the gas manifold is constructed and arranged to:

(i) selectively isolate the flow circuitry of the gas manifold from the pressure-regulated gas source vessel when the gas from the gas source vessel in said gas flow circuitry is at pressure above a predetermined value, wherein the pressure is monitored using a pressure switch means positioned in said gas manifold, said pressure switch means being positioned downstream of the means for selectively isolating the flow circuitry of the gas manifold from the pressure-regulated gas source vessel; and

(ii) remove gas from the gas flow circuitry to enable change-out of the gas source vessel when the vessel has become depleted of gas;

wherein the gas source vessel comprises a restricted flow orifice in a gas outlet port thereof.

19. A gas dispensing assembly comprising: (a) a gas source vessel for holding gas at superatmospheric pressure, with at least one pressure regulator at or within the vessel, and a flow control valve coupled to the vessel, wherein the at least one pressure regulator and the flow control valve are arranged so that gas discharged from the gas source vessel flows through the at least one pressure regulator prior to flow through the flow control valve; and (b) a gas manifold arranged to receive gas from the gas source vessel and comprising gas flow circuitry for dispensing gas, wherein the gas manifold is constructed and arranged to remove gas from the gas flow circuitry to enable change-out of the gas source vessel when the vessel has become depleted of gas.

20. A method of operating a gas source coupled in selective flow relationship with a gas manifold, wherein the gas manifold includes flow circuitry for discharging gas to a gas-using zone, said method comprising using as the gas source a gas source vessel containing the gas at superatmospheric pressure, with a pressure regulator at or within the vessel and a flow control valve coupled in flow relationship to the vessel, wherein the pressure regulator and the flow control valve are arranged so that gas dispensed from the vessel flows through said regulator prior to flow through said flow control valve, and into said gas manifold, wherein the pressure regulator is constructed and arranged to provide a gas pressure in said manifold that is substantially below the pressure of the superatmospheric pressure gas in the gas source vessel.

Assignments (8)
SECURITY INTEREST Recorded Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
ASSIGNMENT OF PATENT SECURITY INTEREST RECORDED AT REEL/FRAME 048811/0679 Recorded Nov 5, 2019
From: GOLDMAN SACHS BANK USA
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 050965/0035 →
SECURITY INTEREST Recorded Nov 13, 2018
From: ENTEGRIS, INC.; SAES PURE GAS, INC.
To: GOLDMAN SACHS BANK USA
Reel/Frame 048811/0679 →
RELEASE OF SECURITY INTEREST Recorded Nov 8, 2018
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: ENTEGRIS, INC.; POCO GRAPHITE, INC.; ATMI, INC.; ATMI PACKAGING, INC.; ADVANCED TECHNOLOGY MATERIALS, INC.
Reel/Frame 047477/0151 →
RELEASE OF SECURITY INTEREST Recorded Nov 8, 2018
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: ENTEGRIS, INC.; POCO GRAPHITE, INC.; ATMI, INC.; ATMI PACKAGING, INC.; ADVANCED TECHNOLOGY MATERIALS, INC.
Reel/Frame 047477/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2015
From: ADVANCED TECHNOLOGY MATERIALS, INC.
To: ENTEGRIS, INC.
Reel/Frame 034894/0025 →
SECURITY INTEREST Recorded May 2, 2014
From: ENTEGRIS, INC.; POCO GRAPHITE, INC.; ATMI, INC.; ADVANCED TECHNOLOGY MATERIALS, INC.; ATMI PACKAGING, INC.
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 032812/0192 →
SECURITY INTEREST Recorded May 1, 2014
From: ENTEGRIS, INC.; POCO GRAPHITE, INC.; ATMI, INC.; ADVANCED TECHNOLOGY MATERIALS, INC.; ATMI PACKAGING, INC.
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 032815/0852 →