IP Library Granted Patent US 7,442,605
Granted Patent B2
US 7,442,605 · App. 11/113,332 · Granted Oct 28, 2008

Resistively switching memory

Assignee: Infineon Technologies AG
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,442,605
App. No.
11/113,332
Granted
Oct 28, 2008
Kind
B2
Abstract

The present invention relates to a reproducible conditioning during the manufacturing of a resistively switching CBRAM memory cell comprising a first electrode and a second electrode with an active material positioned therebetween. The active material is adapted to be placed in a more or less electroconductive state by means of electrochemical switching processes. A CBRAM memory cell manufactured pursuant to the method according to the invention has, due to the improved conditioning, more reliable and more distinctly evaluable electrical switching properties. Moreover, no more forming step is necessary with the method according to the present invention.

Claims (30)

1. A method for manufacturing a resistively switching memory cell, comprising a first electrode and a second electrode with an active material positioned therebetween, the active material being adapted to be placed in a substantially electroconductive state by means of electrochemical switching processes, comprising:

doping the active material in a doping process by diffusing a mobile material into the active material from the first electrode in a direction to the second electrode to build a doped region; and

performing a retraction process by at least partial retraction of the mobile material diffused into the active material from a region close to the second electrode to generate or modify a doping profile between the doped region and an undoped region, wherein performing the retraction process comprises applying an electric charge to the electrodes by contact with a high frequency inert gas plasma.

2. The method according to claim 1 , wherein the doping process further comprises:

doping the active material by diffusing a mobile material into the active material in a doping process; and

overdoping the active material by diffusing the mobile material into the active material in an overdoping process exceeding the prior doping, such that, in the active material, a doped region is formed from the first electrode up to the second electrode.

3. The method according to claim 1 , wherein at least one of the doping process and the overdoping process is performed such that the mobile material is diffused into the active material from the first electrode up to the second electrode.

4. The method according to claim 1 , wherein the active material comprises a chalcogenide compound, consisting of a GeSe, GeS, AgSe, or a CuS compound, and wherein the mobile material comprises alkali ions or metal ions, respectively, consisting of Ag, Zn, or Cu.

5. The method according to claim 1 , wherein the mobile material diffused into the active material diffuses back at least partially from the active material during the retraction process.

6. The method according to claim 1 , wherein a doped or overdoped phase and an undoped phase are formed in the active material.

7. The method according to claim 6 , wherein a particular penetration depth of the mobile material into the active material, in a region between the doped or overdoped phase and the undoped phase in the active material, is achieved.

8. The method according to claim 6 , wherein a particular concentration profile of the mobile material is formed in the active material, in a region between the doped or overdoped phase and the undoped phase in the active material.

9. The method according to claim 1 , wherein the mobile material is diffused into the active material or diffused back, respectively, with an electric charge of appropriate polarity that is applied from outside preferably via the electrodes.

10. The method according to claim 1 , wherein the active material is preconditioned preferably by means of photo diffusion.

11. The method according to claim 1 , wherein self-adjusting processes are used in which different lithography levels do not comprise any misadjustment with respect to one another.

12. A method for manufacturing a resistively switching memory cell, comprising a first electrode and a second electrode with an active material positioned therebetween, the active material being adapted to be placed in a substantially electroconductive state by means of electrochemical switching processes, comprising:

doping the active material in a doping process by diffusing a mobile material into the active material from the first electrode in a direction to the second electrode to build a doped region; and

performing a retraction process by at least partial retraction of the mobile material diffused into the active material from a region close to the second electrode to generate or modify a doping profile between the doped region and an undoped region, wherein performing the retraction process comprises applying an electric charge to the electrodes by inert gas ion beams.

13. The method according to claim 12 , wherein the doping process further comprises:

doping the active material by diffusing a mobile material into the active material in a doping process; and

overdoping the active material by diffusing the mobile material into the active material in an overdoping process exceeding the prior doping, such that, in the active material, a doped region is formed from the first electrode up to the second electrode.

14. The method according to claim 12 , wherein at least one of the doping process and the overdoping process is performed such that the mobile material is diffused into the active material from the first electrode up to the second electrode.

15. The method according to claim 12 , wherein the active material comprises a chalcogenide compound, consisting of a GeSe, GeS, AgSe, or a CuS compound, and wherein the mobile material comprises alkali ions or metal ions, respectively, consisting of Ag, Zn, or Cu.

16. The method according to claim 12 , wherein the mobile material diffused into the active material diffuses back at least partially from the active material during the retraction process.

17. The method according to claim 12 , wherein a doped or overdoped phase and an undoped phase are formed in the active material.

18. The method according to claim 17 , wherein a particular penetration depth of the mobile material into the active material, in a region between the doped or overdoped phase and the undoped phase in the active material, is achieved.

19. The method according to claim 17 , wherein a particular concentration profile of the mobile material is formed in the active material, in a region between the doped or overdoped phase and the undoped phase in the active material.

20. The method according to claim 12 , wherein the mobile material is diffused into the active material or diffused back, respectively, with an electric charge of appropriate polarity that is applied from outside preferably via the electrodes.

21. The method according to claim 12 , wherein the active material is preconditioned preferably by means of photo diffusion.

22. The method according to claim 12 , wherein self-adjusting processes are used in which different lithography levels do not comprise any misadjustment with respect to one another.

Assignments (11)
RELEASE OF SECURITY INTEREST Recorded Sep 24, 2019
From: OBSIDIAN AGENCY SERVICES, INC., AS COLLATERAL AGENT
To: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
Reel/Frame 050480/0836 →
RELEASE OF SECURITY INTEREST Recorded May 9, 2019
From: OPUS BANK
To: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
Reel/Frame 049125/0970 →
SECURITY INTEREST Recorded May 8, 2018
From: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
To: OBSIDIAN AGENCY SERVICES, INC., AS COLLATERAL AGENT
Reel/Frame 046105/0731 →
RELEASE OF SECURITY INTEREST Recorded Oct 3, 2017
From: WESTERN ALLIANCE BANK
To: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
Reel/Frame 044219/0610 →
SECURITY INTEREST Recorded May 22, 2015
From: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
To: OPUS BANK
Reel/Frame 035754/0580 →
RELEASE OF SECURITY INTEREST Recorded Oct 15, 2013
From: OPUS BANK
To: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
Reel/Frame 031414/0232 →
SECURITY AGREEMENT Recorded Oct 7, 2013
From: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
To: BRIDGE BANK, NATIONAL ASSOCIATION
Reel/Frame 031371/0581 →
SECURITY AGREEMENT Recorded Oct 8, 2012
From: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
To: OPUS BANK
Reel/Frame 029090/0922 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2010
From: QIMONDA AG
To: ADESTO TECHNOLOGY CORPORATION
Reel/Frame 024953/0554 →
CONTRIBUTION AGREEMENT (RELEVANT PARTS; ENGLISH TRANSLATION) Recorded Oct 6, 2009
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023330/0771 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2005
From: UFERT, KLAUS DIETER; PINNOW, CAY-UWE
To: INFINEON TECHNOLOGIES AG
Reel/Frame 016801/0899 →
Priority Claims (1)
DE 10 2004 020 297 · Apr 26, 2004 · national
Continuity (1)
Related Publication 20050250281A1 · Nov 10, 2005