Patent Assignment
Reel/Frame 024953/0554
Assignment of Assignor's Interest
Recorded: 2010-09-08
Pages: 6
Assignor
QIMONDA AG
Executed: 2010-06-14
Assignee
ADESTO TECHNOLOGY CORPORATION
1225 INNSBRUCK DRIVE, SUNNYVALE, CALIFORNIA, 94089
Covered Properties
(32)
Current Sense Amplifier
Memory System and Process for Controlling a Memory Component to Achieve Different Kinds of Memory Characteristics on One and the Same Memory Component
Method for Fabricating a Semiconductor Memory Cell
Method for Manufacturing an Integrated Circuit Including an Electrolyte Material Layer
Resistively Switching Memory
Semiconductor Memory Component in Cross-Point Architecture
Method for Operating an Integrated Circuit Having a Resistivity Changing Memory Cell
Method for Producing Memory Having a Solid Electrolyte Material Region
Method for Fabricating an Integrated Device Comprising a Structure with a Solid Electrolyte
A Memory Device Including Electrical Circuit Configured to Provide Reversible Bias Across the Pmc Memory Cell to Perform Erase and Write Functions
Memory Having Cbram Memory Cells and Method
Memory Component with Memory Cells Having Changeable Resistance and Fabrication Method Therefor
Resistive Memory Arrangement
Method for Manufacturing a Cbram Semiconductor Memory
Method for Improving the Thermal Characteristics of Semiconductor Memory Cells
Pmc Memory Circuit and Method for Storing a Datum in a Pmc Memory Circuit
Integrated Semiconductor Memory with an Arrangement of Nonvolatile Memory Cells, and Method
Method for Fabricating a Resistive Memory
Resistive Memory Element with Shortened Erase Time
Solid Electrolyte Memory Element and Method for Fabricating Such a Memory Element
Memory Cell, Memory Device and Method for the Production Thereof
Integrated Circuit Including Resistivity Changing Memory Cells
Memory Cells with an Anode Comprising Intercalating Material and Metal Species Dispersed Therein
Cbram Cell and Cbram Array, and Method of Operating Thereof
Method for Fabricating a Solid Electrolyte Memory Device and Solid Electrolyte Memory Device
Resistive Memory Arrangement
Methods of Manufacturing a Semiconductor Device; Method of Manufacturing a Memory Cell; Semiconductor Device; Semiconductor Processing Device; Integrated Circuit Having a Memory Cell
Integrated Circuit, Method for Manufacturing an Integrated Circuit, Memory Cell Array, Memory Module, and Device
Nor and Nand Memory Arrangement of Resistive Memory Elements
Resistive Switching Element
Application:
11/746,393 →
Publication:
US 2008/0278988
Method of Manufacturing an Integrated Circuit, an Integrated Circuit, and a Memory Module
A Memory Device Including Electrical Circuit Configured to Provide Reversible Bias Across the Pmc Memory Cell to Perform Erase and Write Functions
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 8, 2005
From: PINNOW, CAY-UWE; SYMANCZYK, RALF
To: INFINEON TECHNOLOGIES AG
Reel/Frame 016034/0345 →
Assignment of Assignor's Interest
Jun 6, 2005
From: PINNOW, CAY-UWE; UFERT, KLAUS-DIETER
To: INFINEON TECHNOLOGIES AG
Reel/Frame 016660/0968 →
Assignment of Assignor's Interest
Jul 19, 2005
From: HAPP, THOMAS D.; SYMANCZYK, RALF
To: INFINEON TECHNOLOGIES AG
Reel/Frame 016546/0321 →
Assignment of Assignor's Interest
Aug 19, 2005
From: SYMANCZYK, RALF; LIAW, CORVIN
To: INFINEON TECHNOLOGIES AG
Reel/Frame 016425/0532 →
Contribution Agreement (Relevant Parts; English Translation)
Oct 6, 2009
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023330/0771 →
Security Agreement
Oct 8, 2012
From: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
To: OPUS BANK
Reel/Frame 029090/0922 →
Security Agreement
Oct 7, 2013
From: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
To: BRIDGE BANK, NATIONAL ASSOCIATION
Reel/Frame 031371/0581 →
Release of Security Interest
Oct 15, 2013
From: OPUS BANK
To: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
Reel/Frame 031414/0232 →
Security Interest
May 22, 2015
From: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
To: OPUS BANK
Reel/Frame 035754/0580 →
Release of Security Interest
Oct 3, 2017
From: WESTERN ALLIANCE BANK
To: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
Reel/Frame 044219/0610 →
Security Interest
May 8, 2018
From: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
To: OBSIDIAN AGENCY SERVICES, INC., AS COLLATERAL AGENT
Reel/Frame 046105/0731 →
Release of Security Interest
May 9, 2019
From: OPUS BANK
To: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
Reel/Frame 049125/0970 →
Release of Security Interest
Sep 24, 2019
From: OBSIDIAN AGENCY SERVICES, INC., AS COLLATERAL AGENT
To: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
Reel/Frame 050480/0836 →
Release of Security Interest
Jul 12, 2022
From: VENTURE LENDING & LEASING IX, INC.; WTI FUND X, INC.
To: PARALLEL WIRELESS, INC.
Reel/Frame 060900/0022 →
Assignment of Assignor's Interest
Mar 12, 2023
From: PHARMALIPOCORE INC
To: SUNG, ROSEMARY
Reel/Frame 062954/0374 →
Assignment of Assignor's Interest
Mar 16, 2023
From: RENESAS DESIGN US INC. (FORMERLY KNOWN AS DIALOG SEMICONDUCTOR US INC. AS SUCCESSOR-IN-INTEREST TO ADESTO TECHNOLOGIES CORPORATION AND ARTEMIS ACQUISITION, LLC)
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 062999/0839 →
Assignment of Assignor's Interest
Mar 20, 2023
From: RENESAS DESIGN US INC. (FORMERLY KNOWN AS DIALOG SEMICONDUCTOR US INC. AS SUCCESSOR-IN-INTEREST TO ADESTO TECHNOLOGIES CORPORATION AND ARTEMIS ACQUISITION, LLC)
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 063118/0352 →