Method for fabricating a resistive memory
View Patent ↗A method for fabricating a resistively switching memory cell is provided. The method includes the following steps: depositing a first electrode, applying a layer of a chalcogenide compound to the first electrode, applying a layer of silver or copper, and operating a noble gas plasma in a back-sputtering mode in order to effect silver or copper diffusion into the layer of the chalcogenide compound. Optionally, and if appropriate, further layers for the second electrode are then deposited.
1. A method for fabricating a resistively switching memory cell, the method comprising the following sequential steps:
depositing a first electrode;
applying a layer comprising a chalcogenide compound to the first electrode;
applying on the layer of the chalcogenide compound a metallic doping layer comprising one of silver and copper in an argon gas plasma; and then
performing an additional step of diffusion of the metal from the doping layer into the layer of the chalcogenide compound through a back-sputtering process in a xenon gas plasma.
2. The method of claim 1 , further comprising depositing a second electrode comprising at least one layer of copper, silver and a silver alloy.
3. The method of claim 2 , wherein the second electrode consists of silver.
4. The method of claim 1 , wherein the chalcogenide compound comprises one of a binary germanium sulfide compound, a germanium selenide compound and a ternary or quaternary composition made up of Ge, Si, Se and S.
5. The method of claim 4 , wherein the germanium sulfide compound has the formula Ge x S 1-x , the germanium selenide compound has the formula Ge x Se 1-x , and x has a value from 0.2 to 0.5.
6. The method of claim 5 , wherein x is 0.33.
7. The method of claim 1 , wherein the first electrode comprises an electrically conductive, inert material.
8. The method of claim 7 , wherein the first electrode consists of a material selected from the group consisting of tungsten, molybdenum, tantalum, titanium, conductive oxides, conductive nitrides, highly doped n-typed silicon compounds, highly doped p-type silicon compounds, and combinations thereof.
9. The method of claim 8 , wherein the first electrode consists of tungsten.
10. The method of claim 1 , wherein a voltage applied to the substrate in the back-sputtering process is within a range from about −200V to about −400V.
11. The method of claim 10 , wherein the voltage applied to the substrate in the back-sputtering process is about −400V.
12. The method of claim 1 , wherein a vacuum used in the back-sputtering process is within a range from 4×10 −3 mbar to 10×10 −3 mbar.
13. The method of claim 1 , wherein the back-sputtering process is performed for a period of time lasting from 5 minutes to 10 minutes.
14. A method for fabricating a resistive memory, the method comprising:
depositing a first electrode;
depositing a resistivity changing material contacting the first electrode;
depositing a metallic doping material comprising one of silver and copper in a noble gas plasma over the resistivity changing material; and
performing a diffusion of the metallic, doping material into the resistivity changing material via a back-sputtering process in a xenon gas plasma.
15. The method of claim 14 , further comprising depositing a second electrode comprising at least one of copper, silver, and a silver alloy over the resistivity changing material.
16. The method of claim 14 , wherein a voltage applied to the substrate in the back-sputtering process is within a range from −200V to −400V.
17. The method of claim 14 , wherein the first electrode comprises an electrically conductive and inert material.
18. The method of claim 14 , wherein the back-sputtering process is performed for a period lasting from 5 minutes to 10 minutes.
19. The method of claim 14 , wherein depositing the resistivity changing material comprises depositing a chalcogenide compound.
20. A method for fabricating a resistively switching memory, the method comprising:
depositing a first electrode comprising an electrically conductive and inert material;
applying a layer comprising a chalcogenide compound to the first electrode;
applying a metallic doping layer comprising one of silver and copper in an argon gas plasma to the layer of the chalcogenide compound;
performing a diffusion of the metal from the doping layer into the layer of the chalcogenide compound through a back-sputtering process in a xenon gas plasma; and
depositing a second electrode comprising at least one of copper, silver, and a silver alloy over the chalcogenide compound.