IP Library Granted Patent US 8,115,282
Granted Patent B2
US 8,115,282 · App. 11/492,305 · Granted Feb 14, 2012

Memory cell device and method of manufacture

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,115,282
App. No.
11/492,305
Granted
Feb 14, 2012
Kind
B2
Abstract

According to one embodiment of the present invention, a solid state electrolyte memory cell includes a cathode, an anode and a solid state electrolyte. The anode includes an intercalating material and first metal species dispersed in the intercalating material.

Claims (50)

1. An integrated circuit device comprising a cathode, an anode and a solid state electrolyte arranged between the cathode and the anode, the anode comprising an intercalating material and first metal species dispersed in the intercalating material, wherein the solid state electrolyte comprises chalcogenide material and a second metal species, wherein a homogeneous surface of the anode is formed.

2. The integrated circuit device according to claim 1 , wherein the first metal species comprises silver atoms.

3. The integrated circuit device according to claim 1 , wherein the first metal species comprises silver ions.

4. The integrated circuit device according to claim 1 , wherein the intercalating material comprises carbon.

5. The integrated circuit device according to claim 4 , wherein the intercalating material comprises a material selected from the group consisting of artificial graphite, petroleum coke, coal tar, coke, carbon fiber, acetylene, resin pyrolytic graphite, graphite sphere, petroleum coke, needle coke, carbon fiber and hard carbon.

6. The integrated circuit device according to claim 1 , wherein the intercalating material comprises silicon.

7. The integrated circuit device according to claim 1 , wherein the intercalating material comprises an inorganic material.

8. The integrated circuit device according to claim 7 , wherein the intercalating material comprises an inorganic material selected from the group consisting of MoS 2 , CoO x , MnO 2 , CoMnO x , TiS 2 , NbSe 3 , VO x , V 2 O 5 and CuCl 2 .

9. The integrated circuit device according to claim 1 , wherein the intercalating material comprises an organic polymer.

10. The integrated circuit device according to claim 9 , wherein the organic polymer is conductive.

11. The integrated circuit device according to claim 9 , wherein the organic polymer comprises a material selected from the group consisting of polyacetylene, polypyrrole, polyaniline and polythiophene.

12. The integrated circuit device according to claim 1 , wherein the solid electrolyte comprises a sulfur, selenium or tellurium compound and wherein the second metal species comprises a metal selected from the group consisting of germanium, bismuth, nickel, and zinc.

13. The integrated circuit device according to claim 1 , wherein the solid electrolyte comprises a sulfur, selenium and tellurium compound and wherein the second metal species comprises a metal selected from the group consisting of germanium, bismuth, nickel, and zinc.

14. The integrated circuit device according to claim 1 , wherein the second metal species comprises silver ions.

15. A memory cell comprising:

an anode, the anode comprising an intercalating material and first metal species intercalated in the intercalating material;

a cathode; and

a chalcogenide material arranged in an electrical contact between the cathode and the anode, the chalcogenide material comprising a second metal species, wherein a homogenous surface of the anode is formed.

16. The memory cell according to claim 15 , wherein the first metal species comprises silver atoms.

17. The memory cell according to claim 15 , wherein the first metal species comprises silver ions.

18. The memory cell according to claim 15 , wherein the intercalating material comprises carbon.

19. The memory cell according to claim 18 , wherein the intercalating material comprises a material selected from the group consisting of artificial graphite, petroleum coke, coal tar, coke, carbon fiber, acetylene, resin pyrolytic graphite, graphite sphere, petroleum coke, needle coke, carbon fiber and hard carbon.

20. The memory cell according to claim 15 , wherein the intercalating material comprises silicon.

21. The memory cell according to claim 15 , wherein the intercalating material comprises an inorganic material.

22. The memory cell according to claim 21 , wherein the inorganic material comprises a material selected from the group consisting of MoS 2 , MnO 2 , CoO x , CoMnO x , TiS 2 , NbSe 3 , VO x , V 2 O 5 and CuCl 2 .

23. The memory cell according to claim 15 , wherein the intercalating material comprises an organic polymer.

24. The memory cell according to claim 23 , wherein the organic polymer is conductive.

25. The memory cell according to claim 23 , wherein the organic polymer comprises a material selected from the group consisting of polyacetylene, polypyrrole, polyaniline and polythiophene.

26. The memory cell according to claim 15 , wherein the chalcogenide material comprises a sulfur, selenium or tellurium compound and the second metal species comprises a metal selected from the group consisting of germanium, bismuth, nickel, and zinc.

27. The memory cell according to claim 15 , wherein the chalcogenide material comprises a sulfur, selenium and tellurium compound and the second metal species comprises a metal selected from the group consisting of germanium, bismuth, nickel, and zinc.

28. The memory cell according to claim 15 , wherein the second metal species comprises silver ions.

29. A memory arrangement comprising:

a word line;

a bit line; and

a memory cell in an electrical contact with the word line and the bit line, the memory cell comprising an anode, a cathode and a chalcogenide material arranged in electrical contact between the anode and the cathode, the chalcogenide material comprising a second metal species and the anode comprising an intercalating material and a first metal species intercalated in the intercalating material, wherein a homogeneous surface of the anode is formed.

30. The memory arrangement according to claim 29 , wherein the word line and the bit line are arranged substantially perpendicular to each other.

31. The memory arrangement according to claim 30 , wherein the memory cell is arranged at a cross point of the word line and the bit line.

32. The memory arrangement according to claim 29 , wherein the first metal species comprises silver atoms.

33. The memory arrangement according to claim 29 , wherein the first metal species comprises silver ions.

34. The memory arrangement according to claim 29 , wherein the intercalating material comprises carbon.

35. The memory arrangement according to claim 29 , wherein the intercalating material comprises a material selected from the group consisting of artificial graphite, petroleum coke, coal tar, coke, carbon fiber, acetylene, resin pyrolytic graphite, graphite sphere, petroleum coke, needle coke, carbon fiber and hard carbon.

36. The memory arrangement according to claim 29 , wherein the intercalating material comprises silicon.

37. The memory arrangement according to claim 29 , wherein the intercalating material comprises an inorganic material.

38. The memory arrangement according to claim 37 , wherein the inorganic material comprises a material selected from the group consisting of MoS 2 , MnO 2 , TiS 2 , CoO x , CoMnO x , NbSe 3 , VO x , V 2 O 5 and CuCl 2 .

39. The memory arrangement according to claim 29 , wherein the intercalating material comprises an organic polymer.

40. The memory arrangement according to claim 39 , wherein the organic polymer is conductive.

41. The memory arrangement according to claim 40 , wherein the organic polymer comprises a material selected from the group consisting of polyacetylene, polypyrrole, polyaniline and polythiophene.

42. The memory arrangement according to claim 29 , wherein the chalcogenide material comprises a sulfur, selenium or tellurium compound and wherein the second metal species comprises a metal selected from the group consisting of germanium, bismuth, nickel, and zinc.

43. The memory arrangement according to claim 29 , wherein the chalcogenide material comprises a sulfur, selenium and tellurium compound and wherein the second metal species comprises a metal selected from the group consisting of germanium, bismuth, nickel, and zinc.

44. The memory arrangement according to claim 29 , wherein the second metal species comprises silver ions.

Assignments (14)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 20, 2023
From: RENESAS DESIGN US INC. (FORMERLY KNOWN AS DIALOG SEMICONDUCTOR US INC. AS SUCCESSOR-IN-INTEREST TO ADESTO TECHNOLOGIES CORPORATION AND ARTEMIS ACQUISITION, LLC)
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 063118/0352 →
RELEASE OF SECURITY INTEREST Recorded Sep 24, 2019
From: OBSIDIAN AGENCY SERVICES, INC., AS COLLATERAL AGENT
To: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
Reel/Frame 050480/0836 →
RELEASE OF SECURITY INTEREST Recorded May 9, 2019
From: OPUS BANK
To: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
Reel/Frame 049125/0970 →
SECURITY INTEREST Recorded May 8, 2018
From: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
To: OBSIDIAN AGENCY SERVICES, INC., AS COLLATERAL AGENT
Reel/Frame 046105/0731 →
RELEASE OF SECURITY INTEREST Recorded Oct 3, 2017
From: WESTERN ALLIANCE BANK
To: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
Reel/Frame 044219/0610 →
SECURITY INTEREST Recorded May 22, 2015
From: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
To: OPUS BANK
Reel/Frame 035754/0580 →
RELEASE OF SECURITY INTEREST Recorded Oct 15, 2013
From: OPUS BANK
To: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
Reel/Frame 031414/0232 →
SECURITY AGREEMENT Recorded Oct 7, 2013
From: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
To: BRIDGE BANK, NATIONAL ASSOCIATION
Reel/Frame 031371/0581 →
SECURITY AGREEMENT Recorded Oct 8, 2012
From: ADESTO TECHNOLOGIES CORPORATION; ARTEMIS ACQUISITION LLC
To: OPUS BANK
Reel/Frame 029090/0922 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEES ERRONEOUSLY NAMED AS INFINEON TECHNOLOGIES AG AND ALTIS SEMICONDUCTOR PREVIOUSLY RECORDED ON REEL 018368 FRAME 0413. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECT ASSIGNEES TO BE QIMONDA AG AND ALTIS SEMICONDUCTOR. Recorded Nov 5, 2010
From: MEGE, SANDRA
To: QIMONDA AG; ALTIS SEMICONDUCTOR
Reel/Frame 025317/0737 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2010
From: MEGE, SANDRA
To: INFINEON TECHNOLOGIES AG; ALTIS SEMICONDUCTOR
Reel/Frame 024957/0569 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2010
From: QIMONDA AG
To: ADESTO TECHNOLOGY CORPORATION
Reel/Frame 024953/0554 →
CONTRIBUTION AGREEMENT (RELEVANT PARTS; ENGLISH TRANSLATION) Recorded Oct 6, 2009
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023330/0771 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 10, 2006
From: MEGE, SANDRA
To: INFINEON TECHNOLOGIES AG; ALTIS SEMICONDUCTOR
Reel/Frame 018368/0413 →