Method for producing a conductor path on a substrate, and a component having a conductor path fabricated in accordance with such a method
View Patent ↗A component having at least one conductor path on a substrate, and a production method for fabricating such a component is provided. The component is made by providing at least one conductor path on a predefined area of the substrate. Then a dielectric insulating layer is formed over the at least one conductor path, and a an area of the substrate is completely back etched below the at least one conductor path beginning on the bottom side of the substrate in such a way that the at least one conductor path is supported across the completely back-etched area of the substrate by adhesion to the second insulating layer.
1. A component comprising:
a substrate having a portion thereof completely back-etched on a lower surface thereof;
a first dielectric insulating layer being provided on an upper surface of the substrate, and which covers the portion of the substrate that is back-etched; and
at least one conductor path, which is integratable into the first dielectric insulating layer, and which has a lower surface thereof adjacent to the portion of the substrate that is back-etched,
wherein a second dielectric insulating layer is provided between the first dielectric insulating layer and the substrate, and
wherein the substrate is completely back-etched directly to a surface of the first dielectric insulating layer.
2. The component according to claim 1 , wherein the substrate is a silicon-containing semiconductor substrate, particularly monocrystalline silicon.
3. The component according to claim 2 , wherein the second dielectric insulating layer is made of an inorganic insulation material, a silicon oxide, a silicon dioxide, a silicon nitride, or a silicon with buried air gaps.
4. The component according to claim 1 , wherein the first dielectric insulating layer is a membrane made of an organic insulating material, an organic polymer material, benzocyclobutene, a SILK material, an SU-8 material, or a polyimide.
5. The component according to claim 1 , wherein the at least one conductor path is made of aluminum, copper, silver, gold, or titanium.
6. The component according to claim 1 , wherein the at least one conductor path is a conductor path that is used in a high frequency field.
7. The component according to claim 1 , wherein the component is a semiconductor component.
8. The component according to claim 1 , wherein the at least one conductor path is embedded into the first dielectric insulating layer.
9. The component according to claim 1 , wherein the at least one conductor path is completely embedded into the first dielectric insulating layer.
10. The component according to claim 1 , wherein the at least one conductor path is supported by the first dielectric insulating layer across the back-etched portion of the substrate.
11. The component according to claim 1 , wherein the at least one conductor path is suspended from the first dielectric insulating layer across the back-etched portion of the substrate.
12. The component according to claim 1 , wherein the at least one conductor path is embedded into the first dielectric insulating layer, except for the lower surface of the at least one conductor which is adjacent to the portion of the substrate that is back-etched.
13. The component according to claim 1 , wherein the lower surface of the at least one conductor which is exposed to air in the portion of the substrate that is back-etched.
14. The component according to claim 1 , further comprising:
a third dielectric insulating layer provided above the first dielectric insulating layer, and
at least one additional conductor that is embedded in the third dielectric insulating layer and that is adjacent to the portion of the substrate that is back-etched.
15. A component comprising:
a substrate having a back-etched portion on a lower surface thereof;
a first dielectric insulating layer provided above an upper surface of the substrate; and
at least one conductor path that is adjacent to the back-etched portion of the substrate,
wherein at least a portion of the at least one conductor path is embedded into the first dielectric insulating layer such that the at least one conductor path is supported by the first dielectric insulating layer across the back-etched portion of the substrate,
wherein a second dielectric insulating layer is provided between the first dielectric insulating layer and the substrate, and
wherein the substrate is completely back-etched directly to a surface of the first dielectric insulating layer.
16. The component according to claim 15 , wherein the at least one conductor path is completely embedded into the first dielectric insulating layer.
17. The component according to claim 15 , wherein the at least one conductor path is embedded into the first dielectric insulating layer, except for the lower surface of the at least one conductor which is adjacent to the back-etched portion of the substrate.
18. The component according to claim 15 , wherein the at least one conductor path is imbedded in the first dielectric insulating layer, except for the lower surface of the at least one conductor which is exposed to air in the back-etched portion of the substrate.
19. The component according to claim 15 , wherein the first dielectric insulating layer comprises a membrane made of an organic insulating material, an organic polymer material, benzocyclobutene, a SiLK material, an SU-8material, or a polyimide.
20. The component according to claim 15 , further comprising:
a third dielectric insulating layer provided above the first dielectric insulating layer, and
at least one additional conductor that is embedded in the third dielectric insulating layer and that is adjacent to the portion of the substrate that is back-etched.