Surface mount capacitor and method of making same
View Patent ↗A surface mount capacitor ( 10 ) and method for making the same. A solid slug or pellet anode body ( 1 ) is encapsulated in a case ( 6 ) of insulating material. An anode and cathode termination pair ( 2, 3 ) are formed with surface mount mounting portions on one side of the case ( 6 ). An electrical connection ( 4 ) is made from the cathode termination ( 2 ) to a cathode on pellet ( 1 ) through the case ( 6 ). An electrical connection ( 7 ) is made between an anode associated with the pellet ( 1 ) and the anode termination ( 3 ) externally of the case ( 6 ). The external connection ( 7 ) allows improved volumetric efficiency by freeing up space in the case ( 6 ) for a bigger pellet ( 1 ). The method includes mass producing these capacitors ( 10 ) by mounting a plurality of pellets ( 1 ) on a lead frame ( 11 ) with pre-formed anode/cathode termination pairs ( 2, 3 ), at least substantially encapsulating the plurality of mounted pellets ( 1 ) and each pellet's associated anode and cathode, singulating the encapsulated pellets ( 1 ) to expose a portion of the pellet anode, and applying the electrical external conductive path ( 7 ) between pellet anode and anode termination ( 3 ).
1. A surface mount capacitor comprising:
a) a capacitive element including an anode and a cathode;
b) an encapsulation material forming a case around the capacitive element except for an exposed portion of the anode;
c) an electrically conductive planar substrate comprising anode and/or cathode terminations having surface mounting portions on a single exterior side of the case and to which the capacitive element is mounted;
d) a conductive path between the exposed portion of the anode and the anode termination comprising an external conductive connection on an external surface of the case.
2. The capacitor of claim 1 wherein the external surface of the case is on a side of the case different from the single exterior side of the case.
3. The capacitor of claim 1 wherein the case includes a top side, a bottom side, a first side between the top and bottom sides, a second side between the top and bottom sides, a first end side and a second end side, and wherein surface mounting portions of the anode and cathode terminations are on the bottom side and the external conductive connection is on at least one of the first or second end sides.
4. The capacitor of claim 1 wherein the external conductive path comprises a multilayer structure with the range of 10 to 20 μm thick.
5. The capacitor of claim 4 wherein the thin layer comprises a metal deposition layer.
6. The capacitor of claim 4 wherein the multilayer structure is 0.01 μm to 10 μm thick.
7. The capacitor of claim 4 wherein the multilayer structure is 0.1 μm to 5 μm thick.
8. The capacitor of claim 1 wherein the external conductive path and anode and cathode terminations are plated with an electrically conductive plating material.
9. The capacitor of claim 1 wherein the cathode termination is electrically connected to the cathode of the capacitive element by an electrically conductive material.
10. The capacitor of claim 9 wherein the electrically conductive material comprises a conductive adhesive.
11. The capacitor of claim 1 wherein the anode termination is isolated from the capacitive element, other than by the external conduction connection, by plastic material.
12. The capacitor of claim 11 wherein the plastic material comprises an epoxy adhesive.
13. The capacitor of claim 12 further comprising an insulative layer between the epoxy adhesive and the anode termination.
14. The capacitor of claim 1 wherein the capacitive element comprises a solid body.
15. The capacitor of claim 14 wherein the solid body is a pellet.
16. The capacitor of claim 15 wherein the pellet comprises tantalum, niobium, or niobium oxide.
17. The capacitor of claim 15 wherein the anode comprises the pellet and a wire having a portion embedded in or welded to the pellet and a portion outside of the pellet, and a dielectric layer formed by oxidation of anode material, and the cathode comprises an electrolyte layer on the exterior of the pellet.
18. The capacitor of claim 17 wherein the portion of the wire outside the pellet is exposed at the surface of the case at which the external conductive path is positioned.
19. The capacitor of claim 18 wherein the surface of the case at which the external conductive path is positioned is generally in a first plane.
20. The capacitor of claim 19 wherein the anode and cathode terminations are exposed externally of the case at or near a second plane.
21. The capacitor of claim 20 wherein the first and second planes are generally orthogonal.
22. The capacitor of claim 1 further comprising minimizing volume of the case around the capacitive element relative to the volume of the capacitive element.
23. The capacitor of claim 22 wherein volume of the case is minimizing by minimizing wall thickness of the case by high precision molding and singulation of the case.
24. An electrical circuit board comprising:
a) an electrical circuit board;
b) an electrical circuit on the circuit board including at least one surface mount capacitor;
c) the surface mount capacitor comprising a case of encapsulating material, a capacitive element inside the case including an anode and a cathode, a portion of the anode being exposed, an electrically conductive planar substrate comprising anode and cathode external terminations having surface mount portions outside and on one side of the case and to which the capacitive element is mounted, an external conductive connection outside the case in operative electrical communication with the capacitive element and the exposed portion of the anode termination, and an at least partially internal conductive path between the cathode termination and the capacitive element.
25. The circuit board of claim 24 wherein the external conductive path allows an improvement in volumetric efficiency by allowing a larger capacitive element in the case than if the anode termination was electrically connected to the capacitive element through the case.
26. The circuit board of claim 24 further comprising minimizing volume of the case around the capacitive element relative to the volume of the capacitive element.
27. The circuit board of claim 26 wherein volume of the case is minimizing by minimizing wall thickness of the case by high precision molding and singulation of the case.
28. The circuit board of claim 24 further comprising a plurality of said capacitors.
29. The circuit board of claim 24 wherein the capacitive element comprises a solid pellet anode body, an embedded or welded wire partially in the anode body, a dielectric layer formed by oxidation of the anode body, and an electrolyte layer over the dielectric layer.
30. An electrical or electronic device comprising:
a) a housing and a user interface;
b) an electrical circuit board in the housing including at least one surface mount capacitor;
c) the surface mount capacitor comprising a case of encapsulating material, a capacitive element inside the case including an anode and a cathode, a portion of the anode being exposed, an electrically conductive planar substrate comprising anode and cathode external terminations having surface mount portions outside and on one side of the case and to which the capacitive element is mounted, an at least partially external conductive connection outside the case in operative electrical communication with the capacitive element and the exposed portion of the anode termination, and an at least partially internal conductive path between the cathode termination and the capacitative element.
31. The device of claim 30 wherein the external conductive path allows an improvement in volumetric efficiency by allowing a larger capacitive element in the case than if the anode termination was electrically connected to the capacitive element through the case.
32. The device of claim 30 further comprising minimizing volume of the case around the capacitive element relative to the volume of the capacitive element.
33. The device of claim 32 wherein volume of the case is minimizing by minimizing wall thickness of the case by high precision molding and singulation of the case.
34. The device of claim 30 further comprising a plurality of said capacitors.
35. The device of claim 30 wherein the capacitive element comprises a solid pellet anode body, an embedded or welded wire in the anode body, a dielectric layer formed by oxidation of the anode body, and an electrolyte layer over the dielectric layer.
36. The device of claim 30 wherein the device comprises a hand-held radio frequency communications device.
37. The device of claim 30 wherein the device comprises a medical instrument.
38. The device of claim 30 wherein the device comprises a microprocessor.
39. A surface mount capacitor comprising:
a) a capacitive element including an anode and a cathode;
b) an encapsulation material forming a case around the capacitive element except for an exposed portion of the anode;
c) an electrically conductive planar substrate comprising anode and/or cathode terminations having surface mounting portions on a single exterior side of the case and to which the capacitive element is mounted;
d) a conductive path between the exposed portion of the anode and the anode termination comprising an external conductive connection on an external surface of the case wherein the anode termination is isolated from the capacitive element, other than by the external conduction connection, by plastic material.
40. The capacitor of claim 39 wherein the plastic material comprises an epoxy adhesive.
41. The capacitor of claim 40 further comprising an insulative layer between the epoxy adhesive and the anode termination.