IP Library Granted Patent US 7,193,477
Granted Patent B2
US 7,193,477 · App. 11/147,458 · Granted Mar 20, 2007

Concurrent triple-band gain amplifier for multi-standard coexist communications

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Quick Facts
Patent No.
US 7,193,477
App. No.
11/147,458
Granted
Mar 20, 2007
Kind
B2
Abstract

The present invention discloses a gain amplifier, capable of concurrently operating at three different frequency bands. The gain amplifier comprises an amplification stage for amplifying a signal applied to an input of the amplifier and a triple-band resonance load connected between a DC bias voltage and a DC bias input of the amplification stage. The triple-band resonance load uses a set of reactive elements to provide match in a first frequency band, a second frequency band and in a third frequency band, such as at 2.4 GHz, 5.8 GHz and 9.0 GHz. According to the gain amplifier of the present invention, it can effectively provide triple-band signal amplification and in-band interference suppression for various multi-standard coexist communication systems.

Claims (35)

1. A gain amplifier, comprising:

an amplification stage for amplifying a signal applied to an input of the amplifier; and

a multi-band resonant load connected between a DC bias voltage and a DC bias input of the amplification stage, the multi-band resonant load using a set of elements to provide a match in a first frequency band, at least two subset of the set of elements to provide a match in a second frequency band, and in a third frequency band;

wherein the set of elements includes a first capacitor, a first inductor, a second capacitor, a second inductor and a third inductor,

the first capacitor and the first inductor being connected in parallel to form a shunt resonator,

the second capacitor and the second inductor being connected in series to form a series resonator, and

the shunt resonator and the series resonator being connected in parallel, which is then connected in series with the third inductor L 3 .

2. A gain amplifier as claimed in claim 1 , wherein the amplification stage is a Darlington amplifier.

3. A gain amplifier as claimed in claim 1 , wherein the amplification stage is fabricated by using monolithic microwave integration circuit (MMIC) technology.

4. A gain amplifier as claimed in claim 3 , wherein the amplification stage is fabricated by the heterojunction bipolar transistor (HBT) technology on GaAs substrate.

5. A gain amplifier as claimed in claim 1 , wherein the multi-band resonant load is fabricated by using monolithic microwave integration circuit (MMIC) technology.

6. A gain amplifier as claimed in claim 1 , wherein the multi-band resonant load is fabricated by using monolithic microwave integration circuit (MMIC) technology on a single chip, except the third inductor is off chip.

7. A gain amplifier as claimed in claim 6 , wherein the third inductor is implemented by the bounding wire.

8. A gain amplifier as claimed in claim 1 , wherein the first and the second poles of the triple-band resonance load determine the center frequencies of the first and second pass-bands.

9. A gain amplifier as claimed in claim 2 , wherein the third zero frequency of the triple-band resonance load and the gain roll-off of the Darlington amplification stage the third passband.

10. A gain amplifier as claimed in claim 1 , wherein the second zero and the third zero of the triple-band resonance load enhance the in-band interference rejection.

11. A gain amplifier as claimed in claim 1 , wherein the first frequency band is centered at about 2.4 GHz, the second frequency band is centered at about 5.8 GHz and the third frequency band is centered at about 9.0 GHz.

12. A method of operating a gain amplifier in multiple frequency bands, the method comprising the steps of:

amplifying a signal applied to an input of the amplifier in an amplification stage; and

utilizing a set of elements of a triple-band resonance load connected between a DC bias voltage and a DC bias input of the amplification stage to provide match in a first frequency band, a second frequency band, and a third frequency band; the set of elements including a first capacitor, a first inductor, a second capacitor, a second inductor and a third inductor; the first capacitor and the first inductor being connected in parallel to form a shunt resonator; the second capacitor and the second inductor being connected in series to form a series resonator; and the above shunt resonator and the series resonator being connected in parallel, which is then connected in series with the third inductor.

13. A method as claimed in claim 12 , wherein the amplification stage is a Darlington amplifier.

14. A method as claimed in claim 12 , wherein the amplification stage is fabricated by using monolithic microwave integration circuit (MMIC) technology.

15. A method as claimed in claim 14 , wherein the amplification stage is fabricated by heterojunction bipolar transistor (HBT) technology on GaAs substrate.

16. A method as claimed in claim 12 , wherein the triple-band resonance load is fabricated by using monolithic microwave integration circuit (MMIC) technology.

17. A method as claimed in claim 12 , wherein the triple-band resonance load is fabricated by using monolithic microwave integration circuit (MMIC) technology on a single chip, except the third inductor is off chip.

18. A method as claimed in claim 17 , wherein the third inductor is implemented by the bounding wire.

19. A method as claimed in claim 12 , wherein the first and the second poles of the multi-band resonant load determine center frequencies of the first and second pass band.

20. A method as claimed in claim 13 , wherein the third zero frequency of the triple-band resonance load and the gain roll-off of the Darlington amplification stage the third passband.

21. A method as claimed in claim 12 , wherein the second zero and the third zero of the triple-band resonance load enhance the in-band interference rejection.

22. A method as claimed in claim 12 , wherein the first frequency band is centered at about 2.4 GHz, the second frequency band is centered at about 5.8 GHz and the third frequency band is centered at about 9.0 GHz.

23. A signal receiver comprising:

at least one antenna for receiving a signal in at least one of a first frequency band and a second frequency band;

a filter having an input coupled to an output of the at least one antenna, the filter providing filtering of the received signal in at least one of the first and second frequency bands;

a gain amplifier having an input coupled to an output of the filter, the gain amplifier including an amplification stage for amplifying the received signal applied to an input of the amplifier, and a triple-band resonance load connected between a DC bias voltage and a DC bias input of the amplification stage, triple-band resonance load connected between a DC bias voltage and a DC bias input of the amplification stage to provide match in a first frequency band, a second frequency band, and a third frequency band; the set of elements including a first capacitor, a first inductor, a second capacitor, a second inductor and a third inductor; the first capacitor and the first inductor being connected in parallel to form a shunt resonator; the second capacitor and the second inductor being connected in series to form a series resonator; the above shunt resonator and the series resonator being connected in parallel, which is then connected in series with the third inductor; and

a signal converter having an input coupled to an output of the amplifier, the signal converter converting the received signal to an intermediate frequency.

Assignments (18)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 059666/0545 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: MICROCHIP TECHNOLOGY INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0617 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 18, 2015
From: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 036631/0442 →
MERGER Recorded Sep 6, 2015
From: ISSC TECHNOLOGIES CORP.
To: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
Reel/Frame 036561/0892 →
CHANGE OF NAME Recorded Jul 13, 2010
From: INTEGRATED SYSTEM SOLUTION CORP.
To: ISSC TECHNOLOGIES CORP.
Reel/Frame 024675/0495 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2005
From: CHANG, SHENG-FUH; CHEN, WEN-LIN; CHEN, HUNG-CHENG; TANG, SHU-FEN; CHEN, ALBERT
To: INTEGRATED SYSTEM SOLUTION CORP.; CHANG, SHENG-FUH
Reel/Frame 016675/0248 →