IP Library Granted Patent US 7,444,167
Granted Patent B2
US 7,444,167 · App. 11/149,230 · Granted Oct 28, 2008

Dual-band wireless LAN RF transceiver

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Quick Facts
Patent No.
US 7,444,167
App. No.
11/149,230
Granted
Oct 28, 2008
Kind
B2
Abstract

The present invention discloses a dual-band RF transceiver. The transceiver comprises a first module, used as the RF front-end of the dual-band transceiver and used for receiving and transmitting a first RF signal and a second RF signal; a second module, electrically connected to the first module, used as the IF IQ modulator/demodulator of the dual-band RF transceiver; a third module, electrically connected to the first and the second modules, used as the tripe-band phase-locked frequency synthesizer of the dual-band RF transceiver and used for providing a first local oscillating signal and a second local oscillating signal to the first module, and a third local oscillating signal to the second module. The dual-band RF transceiver according to the present invention realizes the dual-band triple-mode operation of IEEE802.11 a/b/g by a single dual-band RF module, and therefore the circuit size, power dissipation, component count, and cost can be dramatically reduced.

Claims (37)

1. A dual-band RF transceiver, comprising:

a first module, used as the RF front-end of the dual-band transceiver and used for receiving and transmitting a first RF signal and a second RF signal;

a second module, electrically connected to the first module, used as an intermediate-frequency IQ modulator/demodulator of the dual-band RF transceiver; and

a third module, electrically connected to the first and the second modules, used as a triple-band phase-locked frequency synthesizer of the dual-band RF transceiver and used for providing a first local oscillating signal and a second local oscillating signal to the first module, and a third local oscillating signal to the second module,

wherein the first module is constructed from several dual-band circuits.

2. A dual-band RF transceiver as claimed in claim 1 , wherein the first module comprising:

a dual-band RF filtering unit, electrically connected to a dual-band antenna, used for processing the first RF signal and the second RF signal and transmitting them among a dual-band receiving unit, a dual-band transmitting unit, and a dual-band antenna;

a dual-band receiving unit, electrically connected to the dual-band RF filtering unit, used for processing the first RF signal and the second RF signal and transmitting them to the second module; and

a dual-band transmitting unit, electrically connected to the dual-band RF filtering unit, used for processing the first RF signal and the second RF signal from the second module.

3. A dual-band RF transceiver as claimed in claim 2 , wherein the dual-band RF filtering unit comprising:

a dual-band antenna switch, used for switching the first RF signal and the second RF signal;

a dual-band RF filter, electrically connected to the dual-band antenna switch, used for filtering the first RF signal and the second RF signal; and

a dual-band transmit/receive switch, electrically connected among the dual-band RF filter, the dual-band receiving unit and the dual-band transmitting unit, used for determining the signal direction of the first RF signal and the second RF signal.

4. A dual-band RF transceiver as claimed in claim 2 , wherein the dual-band receiving unit comprising:

a dual-band low-noise amplifier, used for receiving the first RF signal and the second RF signal from the dual-band transmit/receive switch, amplifying the first RF signal and the second RF signal, and reducing the noise contribution from the following circuits;

a dual-band gain amplifier, electrically connected to the dual-band low-noise amplifier, used for amplifying the first RF signal and the second RF signal;

a first dual-band image filter, electrically connected to the dual-band gain amplifier, used for suppressing the images of the first RF signal and the second RF signal;

a first broadband mixer, electrically connected to the first dual-band image filter, used for mixing the first RF signal with the first local oscillating signal of the third module to generate a first intermediate frequency (IF) signal, and used for mixing the second RF signal with the second local oscillating signal of the third module to generate a second IF signal;

a first IF filter, electrically connected to the first broadband mixer, used for suppressing the spurious response generated by the first broadband mixer to obtain the first IF signal and the second IF signal; and

a first variable-gain amplifier, electrically connected to the first IF filter, used for amplifying the first IF signal and the second IF signal and outputting the first IF signal and the second IF signal to the second module.

5. A dual-band RF transceiver as claimed in claim 4 , wherein the first IF filter is a surface acoustic wave (SAW) filter.

6. A dual-band RF transceiver as claimed in claim 4 , wherein the frequency of the first IF signal is equal to the frequency of the second IF signal.

7. A dual-band RF transceiver as claimed in claim 6 , wherein the frequencies of the first IF signal and the second IF signal are near 374 MHz.

8. A dual-band RF transceiver as claimed in claim 6 , wherein the frequencies of the third IF signal and the first IF signal are near 374 MHz.

9. A dual-band RF transceiver as claimed in claim 2 , wherein the dual-band transmitting module comprising:

a second variable-gain amplifier, electrically connected to the second module, used for amplifying a third IF signal and a fourth IF signal from the second module;

a second IF filter, electrically connected to the second variable-gain amplifier, used for suppressing the spurious response generated by the second variable-gain amplifier to obtain the third IF signal;

a second broadband mixer, electrically connected to the second IF filter, used for mixing the third IF signal with the first local oscillating signal of the third module to generate the first RF signal;

a second broadband mixer, electrically connected to the second IF filter, used for mixing the fourth IF signal with the second local oscillating signal of the third module to generate the second RF signal;

a second dual-band image filter, electrically connected to the second broadband mixer, used for suppressing the spurious response generated by the broadband mixer;

a dual-band driving amplifier, electrically connected to the dual-band image filter, used for raising the power level of the first RF signal and the second RF signal from the second dual-band image filter;

a dual-band power amplifier, electrically connected to the dual-band driving amplifier, used for further raising the power level of the first RF signal and the second RF signal and then outputting to the dual-band transmit/receive switch.

10. A dual-band RF transceiver as claimed in claim 9 , wherein the second IF filter is a SAW filter.

11. A dual-band RF transceiver as claimed in claim 9 , wherein the frequency of the third IF signal is equal to the frequency of the first IF signal.

12. A dual-band RF transceiver as claimed in claim 1 , wherein the first module uses the super-heterodyne topology.

13. A dual-band RF transceiver as claimed in claim 1 , wherein the first RF signal is the RF signal of the 5.2 GHz IEEE 802.11a WLAN.

14. A dual-band RF transceiver as claimed in claim 1 , wherein the second RF signal is the RF signal of the 2.4 GHz IEEE 802.11 b/g WLAN.

Assignments (18)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 059666/0545 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: MICROCHIP TECHNOLOGY INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0617 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 18, 2015
From: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 036631/0442 →
MERGER Recorded Sep 6, 2015
From: ISSC TECHNOLOGIES CORP.
To: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
Reel/Frame 036561/0892 →
CHANGE OF NAME Recorded Jul 13, 2010
From: INTEGRATED SYSTEM SOLUTION CORP.
To: ISSC TECHNOLOGIES CORP.
Reel/Frame 024675/0495 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2005
From: CHANG, SHENG-FUH; CHEN, WEN-LIN; TSAI, CHENG-HUA; CHIEN, CHIN-HUNG; CHEN, HUNG-CHENG; TANG, SHU-FEN; CHEN, ALBERT
To: INTEGRATED SYSTEM SOLUTION CORP.; CHANG, SHENG-FUH
Reel/Frame 016684/0137 →