Integrated, integrated circuit singulation system
View Patent ↗An integrated, integrated circuit singulation system is provided including scribing a substrate using mechanical cutting or a plurality of passes of laser cutting, and dicing the substrate using mechanical cutting or laser cutting.
1. A method for an integrated circuit singulation system comprising:
scribing a substrate using a plurality of passes along each path of laser cutting through an active layer of the substrate; and
dicing the substrate using a plurality of passes along each path of mechanical cutting.
2. The method as claimed in claim 1 wherein:
scribing during the plurality of passes of laser cutting uses visible light, ultraviolet light, or a combination thereof.
3. The method as claimed in claim 1 wherein:
scribing during the plurality of passes of laser cutting traverses a scribe cut a plurality of times.
4. The method as claimed in claim 1 wherein:
scribing and dicing occur simultaneously.
5. The method as claimed in claim 1 wherein:
scribing and dicing occur sequentially.
6. A method for an integrated circuit singulation system comprising:
scribing a wafer using a plurality of passes along each path of laser cutting through an active layer in a test pattern, a saw street or an alignment region of the wafer; and
dicing the wafer using a plurality of passes along each path of mechanical cutting after laser cutting.
7. The method as claimed in claim 6 wherein:
dicing using the mechanical cutting is performed with a circular or beveled blade.
8. The method as claimed in claim 6 wherein:
scribing using the plurality of passes of laser cutting uses visible light, ultraviolet light, or a combination thereof.
9. The method as claimed in claim 6 wherein:
scribing and dicing occur simultaneously on different parts of the wafer.
10. The method as claimed in claim 6 wherein:
scribing and dicing occur sequentially.