Integrated circuit solder bumping system
View Patent ↗An integrated circuit solder bumping system provides a substrate and forms a redistribution layer on the substrate. An insulation layer is formed on the redistribution layer. The insulation layer has a plurality of openings therethrough. A first UBM layer of titanium is deposited on the insulation layer and in the openings therethrough. A second UBM layer of chromium/copper alloy is deposited on the first UBM layer. A third UBM layer of copper is deposited on the second UBM layer. UBM pads of at least two different sizes are formed from the UBM layers. Solder paste is printed over at least some of the UBM pads. The solder paste is reflowed to form at least smaller solder bumps on at least some of the UBM pads. Bigger solder bumps are formed on at least some of the UBM pads.
1. An integrated circuit solder bumping method, comprising:
providing a substrate;
forming a redistribution layer on the substrate;
forming an insulation layer on the redistribution layer, the insulation layer having a plurality of openings therethrough;
depositing a first UBM layer of titanium on the insulation layer and in the openings therethrough;
depositing a second UBM layer of chromium/copper alloy on the first UBM layer;
depositing a third UBM layer of copper on the second UBM layer;
forming UBM pads of at least two different sizes from the UBM layers;
printing solder paste over at least some of the UBM pads;
reflowing the solder paste to form at least smaller solder bumps on at least some of the UBM pads; and
forming bigger solder bumps on at least some of the UBM pads.
2. The method of claim 1 wherein:
forming a redistribution layer further comprises forming a redistribution layer of aluminum, aluminum alloy, copper, an alloy thereof, a compound thereof, or a combination thereof; and
forming an insulation layer further comprises forming an insulation layer of polyimide, benzocyclobutene, or polybenzoxazole, a compound thereof, or a combination thereof.
3. The method of claim 1 wherein:
forming a redistribution layer further comprises forming a redistribution layer having a thickness in the range from 1° μm to 9° μm; and
forming an insulation layer further comprises forming an insulation layer having a thickness in the range from 4° μm to 12° μm.
4. The method of claim 1 wherein:
depositing a first UBM layer further comprises depositing a layer having a thickness in the range from 500 Å to 1500 Å;
depositing a second UBM layer further comprises depositing a chromium/copper alloy layer of 40-60% chromium to copper, and having a thickness in the range from 2500 Å to 5000 Å; and
depositing a third UBM layer further comprises depositing a layer having a thickness in the range from 5000 Å to 2° μm.
5. The method of claim 1 wherein forming bigger solder bumps further comprises printing additional solder paste over at least some of the UBM pads.
6. The method of claim 1 wherein forming bigger solder bumps further comprises dropping bigger solder balls onto at least some of the UBM pads.
7. An integrated circuit solder bumping method, comprising:
providing a redistribution substrate;
forming a first redistribution layer on the redistribution substrate;
forming a first insulation layer on the first redistribution layer;
forming a second redistribution layer on the first insulation layer;
forming a second insulation layer on the second redistribution layer, the second insulation layer having a plurality of openings of at least two different sizes therethrough;
depositing a first UBM layer of titanium on the second insulation layer and in the openings therethrough;
depositing a second UBM layer of chromium/copper alloy on the first UBM layer;
depositing a third UBM layer of copper on the second UBM layer;
masking and etching the UBM layers to form UBM pads over the openings, the UBM pads being formed of at least two different sizes according to the sizes of the openings;
printing solder paste over at least some of the UBM pads;
reflowing the solder paste to form at least smaller solder bumps on at least some of the UBM pads; and
forming bigger solder bumps on at least some of the UBM pads, the bigger solder bumps being formed with at least 100° μm of bump height difference greater than the smaller solder bumps.
8. The method of claim 7 wherein:
forming redistribution layers further comprises forming redistribution layers of aluminum, aluminum alloy, copper, an alloy thereof, a compound thereof, or a combination thereof; and
forming insulation layers further comprises forming insulation layers of polyimide, benzocyclobutene, or polybenzoxazole, a compound thereof, or a combination thereof.
9. The method of claim 7 wherein:
forming redistribution layers further comprises forming redistribution layers having a thickness in the range from 1° μm to 9° μm; and
forming insulation layers further comprises forming insulation layers having a thickness in the range from 4° μm to 12° μm.
10. The method of claim 7 wherein:
depositing a first UBM layer further comprises depositing a layer having a thickness in the range from 500 Å to 1500 Å and preferably 800 Å;
depositing a second UBM layer further comprises depositing a chromium/copper alloy layer of 40-60% chromium to copper, and preferably 50% chromium, and having a thickness in the range from 2500 Å to 5000 Å, and preferably 3500 Å; and
depositing a third UBM layer further comprises depositing a layer having a thickness in the range from 5000 Å to 2° μm, and preferably 8000 Å.
11. The method of claim 7 wherein forming bigger solder bumps further comprises printing, using a metal stencil, additional solder paste over at least some of the UBM pads, and reflowing the additional solder paste.
12. The method of claim 7 wherein forming bigger solder bumps further comprises dropping bigger solder balls onto at least some of the UBM pads, and reflowing the bigger solder balls.