Ultra-thin wafer system and method of manufacture thereof
View Patent ↗An ultra-thin wafer system providing thinning a wafer on a protective tape to an ultra-thin thickness and forming electrical interconnects on the thinned wafer on a support plate.
1. A method of manufacture of an ultra-thin wafer system comprising:
thinning a wafer on a wafer protective tape to an ultra-thin thickness;
forming electrical interconnects on the wafer, wherein forming the electrical interconnects comprises applying a temporary adhesive between a support plate and a non-active surface of the wafer;
releasing the temporary adhesive using an irradiation process; and
removing the support plate after forming the electrical interconnects.
2. The method as claimed in claim 1 wherein forming the electrical interconnects comprises depositing solder on the wafer.
3. The method as claimed in claim 1 wherein:
thinning the wafer comprises attaching the wafer protective tape to an active surface of the wafer to protect active circuits thereon; and
further comprising:
removing the wafer protective tape before forming the electrical interconnects.
4. The method as claimed in claim 1 wherein thinning the wafer comprises grinding, etching or polishing the non-active surface of the wafer to thin the wafer.
5. A method of manufacture of an ultra-thin wafer system comprising:
thinning a wafer on a wafer protective tape to an ultra-thin thickness;
mounting a support plate to a non-active surface of the wafer to protect the wafer from breaking or deforming;
applying a temporary adhesive between the support plate and the non-active surface of the wafer;
forming electrical interconnects on an active surface of the wafer having the support plate thereon;
releasing the temporary adhesive using an irradiation process; and
removing the support plate from the wafer having the electrical interconnects formed thereon.
6. The method as claimed in claim 5 wherein applying the temporary adhesive comprises spin-coating a temporary adhesive paste having thermal and chemical immunity for forming the electrical interconnects, between the support plate and the non-active surface of the wafer.
7. The method as claimed in claim 5 wherein applying the temporary adhesive comprises tape laminating a temporary adhesive tape material having thermal and chemical immunity for forming the electrical interconnects, between the support plate and the non-active surface of the wafer.
8. The method as claimed in claim 5 wherein the support plate comprises a material providing structural support, planar rigidity, thermal and chemical immunity for forming the electrical interconnects.
9. The method as claimed in claim 5 wherein forming the electrical interconnects comprises depositing solder on the active surface of the wafer.
10. The method as claimed in claim 5 wherein thinning the wafer comprises attaching the wafer protective tape to the active surface of the wafer to protect active circuits thereon.
11. The method as claimed in claim 5 wherein thinning the wafer comprises rough grinding, fine grinding, wet etching, dry etching, chemical polishing, mechanical polishing or chemical-mechanical polishing the non-active surface of the wafer.