PRE-MOLDED LEADFRAME AND METHOD THEREFOR

1 . A method of manufacturing a semiconductor package, comprising:

providing a leadframe having a die pad and a plurality of terminal leads; and

forming a first molding material in the leadframe to expose an upper surface of the die pad and the upper surfaces of the plurality of terminal leads.

2 . The method of manufacturing a semiconductor package as claimed in claim 1 , further comprising:

forming a plurality of thermal/ground bump pads on the die pad wherein the upper surfaces of the thermal/ground bump pads form the upper surface of the die pad; and

forming a plurality of terminal pads on the plurality of terminal leads wherein the upper surfaces of the plurality of terminal pads form the upper surface of the plurality of terminal leads.

3 . The method of manufacturing a semiconductor package as claimed in claim 1 , further comprising:

providing a heat spreader holder integral with the first molding material for attaching at least one of a heat spreader, a radiation shield, a transparent lid, and combinations thereof.

4 . The method of manufacturing a semiconductor package as claimed in claim 1 , further comprising:

half-etching a notch in the lower surface of the plurality of terminal leads intermediate the plurality of terminal pads and the outer edges of the plurality of terminal leads.

5 . The method of manufacturing a semiconductor package as claimed in claim 1 , further comprising:

attaching a die to the upper surface of the die pad; and

connecting the die to the plurality of terminal leads.

6 . A method of manufacturing a semiconductor package, comprising:

providing a leadframe having a die pad and a plurality of terminal leads;

forming a plurality of thermal/ground bump pads on the die pad;

forming a plurality of terminal pads on the plurality of terminal leads; and

forming a first molding material in the leadframe to expose an upper surface of the plurality of thermal/ground bump pads and an upper surface of the plurality of terminal pads; and

connecting a die to the plurality of thermal/ground bump pads and the plurality of terminal pads.

7 . The method of manufacturing a semiconductor package as claimed in claim 6 , wherein:

forming the plurality of thermal/ground bump pads and the plurality of terminal pads half-etches the upper surfaces of the die pad and the plurality of terminal leads.

8 . The method of manufacturing a semiconductor package as claimed in claim 6 , wherein connecting the die uses at least one of solder balls, solder bumps, wire bonds, and a combination thereof.

9 . The method of manufacturing a semiconductor package as claimed in claim 6 , further comprising:

providing a heat spreader holder integral with the first molding material for attaching at least one of a heat spreader, a radiation shield, a transparent lid, and combinations thereof.

10 . The method of manufacturing a semiconductor package as claimed in claim 6 , further comprising:

half-etching a notch in the lower surface of the terminal leads intermediate the plurality of terminal pads and the outer edges of the plurality of terminal leads.

11 . A semiconductor package comprising:

a leadframe having a die pad and a plurality of terminal leads; and

a first molding material in the leadframe to expose an upper surface of the die pad and the upper surfaces of the plurality of terminal leads.

12 . The semiconductor package as claimed in claim 11 , further comprising:

a plurality of thermal/ground bump pads on the die pad wherein the upper surfaces of the thermal/ground bump pads form the upper surface of the die pad; and

a plurality of terminal pads on the plurality of terminal leads wherein the upper surfaces of the plurality of terminal pads form the upper surface of the plurality of terminal leads.

13 . The semiconductor package as claimed in claim 11 , further comprising:

a heat spreader holder integral with the first molding material for attachment of at least one of a heat spreader, a radiation shield, a transparent lid, and combinations thereof.

14 . The semiconductor package as claimed in claim 11 , wherein:

the plurality of terminal leads has a notch in the lower surface of the plurality of terminal leads intermediate the plurality of terminal pads and the outer edges of the plurality of terminal leads.

15 . The semiconductor package as claimed in claim 11 , further comprising:

a die attached to the upper surface of the die pad; and

a plurality of connections connecting the die to the plurality of terminal leads.

16 . A semiconductor package, comprising:

a leadframe having a die pad and a plurality of terminal leads;

a plurality of thermal/ground bump pads on the die pad;

a plurality of terminal pads on the plurality of terminal leads; and

a first molding material in the leadframe to expose an upper surface of the plurality of thermal/ground bump pads and an upper surface of the plurality of terminal pads; and

a die connected to the plurality of thermal/ground bump pads and the plurality of terminal pads.

17 . The semiconductor package as claimed in claim 16 , wherein:

the plurality of thermal/ground bump pads and the plurality of terminal pads are half-etched from the upper surfaces of the die pad and the plurality of terminal leads.

18 . The semiconductor package as claimed in claim 16 , further comprising:

at least one of solder balls, solder bumps, wire bonds, and a combination thereof to connect the die to the plurality of thermal/ground bump pads and the plurality of terminal pads.

19 . The semiconductor package as claimed in claim 16 , further comprising:

a heat spreader holder integral with the first molding material for attachment of at least one of a heat spreader, a radiation shield, a transparent lid, and combinations thereof.

20 . The semiconductor package as claimed in claim 16 , wherein:

the plurality of terminal leads has a notch in the lower surface of the terminal leads intermediate the plurality of terminal pads and the outer edges of the plurality of terminal leads.