Integrated circuit package system with leadframe substrate
A system for manufacturing an integrated circuit package system is provided. A dual-type leadframe having first and second rows of leads is formed. A first row of bumps is formed on an integrated circuit chip. Solder paste is placed on the first row of leads, and the first row of bumps is pressed into the solder paste on the first row of leads. The solder paste is reflow soldered to form solder and connect the integrated circuit chip to the first row of leads, and the integrated circuit chip, the first row of bumps, the solder, and the leadframe are encapsulated.
1. An integrated circuit package method comprising:
forming a dual-type leadframe having lead tips;
forming a first row of bumps on an integrated circuit chip;
placing solder paste on the lead tips;
pressing the first row of bumps into the solder paste on the lead tips;
reflow soldering the solder paste to form solder and connect the integrated circuit chip to the lead tips;
encapsulating the integrated circuit chip, the bumps, the solder, and the dual-type leadframe; and
planarizing the bottom of the dual-type leadframe after encapsulating to form a first row of leads.
2. The method as claimed in claim 1 further comprising:
forming a second row of bumps on the integrated circuit chip;
pressing the second row of bumps into the solder paste on the lead tips; and
planarizing the bottom of the dual-type leadframe after encapsulating forms a second row of leads.
3. The method as claimed in claim 1 wherein:
planarizing includes etching the bottom of the first row of leads after reflow soldering.
4. The method as claimed in claim 1 wherein:
forming the dual-type leadframe includes a paddle.
5. The method as claimed in claim 1 further comprising:
forming a plating layer on the lead tips;
bonding a second integrated circuit chip to the first integrated circuit chip; and
wire bonding the second integrated circuit chip to the plating layer on the lead tips.
6. The method as claimed in claim 5 wherein the wire bonding of the second integrated circuit chip includes wire bonding to center pads on at least one of the integrated circuit chips.
7. The method as claimed in claim 5 further comprising:
bonding a spacer to the second integrated circuit chip;
bonding a third integrated circuit chip to the spacer;
wire bonding the third integrated circuit chip to the lead tips; and
planarizing the bottom of the dual-type leadframe after encapsulating forms a third row of leads having the third integrated circuit chip wire bonded thereto.
8. An integrated circuit package method comprising:
forming a dual-type leadframe having lead tips in first and second rows with grooves or dimples;
forming a first row of bumps on an integrated circuit chip;
placing solder paste on the lead tips;
pressing the first row of bumps into the solder paste on the lead tips in the first row;
reflow soldering the solder paste to form solder and connect the integrated circuit chip to the lead tips in the first row;
encapsulating the integrated circuit chip, the bumps, the solder, and the leadframe to form an encapsulated structure;
planarizing the bottom of the dual-type leadframe after encapsulating to form a first row of leads and a second row of leads; and
singulating the encapsulated structure.
9. The method as claimed in claim 8 further comprising:
forming a second row of bumps on the integrated circuit chip;
depositing solder paste on the lead tips in the second row;
pressing the second row of bumps into the solder paste on the lead tips in the second row; and
reflow soldering the solder paste at one time.
10. The method as claimed in claim 8 further comprising:
etching the bottom half of the lead tips after reflow soldering.
11. The method as claimed in claim 8 further comprising:
singulating the dual-type leadframe to separate each of the lead tips in the first and second rows from each other and a paddle.
12. The method as claimed in claim 8 further comprising:
forming a plating layer on the lead tips in the second row;
bonding a second integrated circuit chip to the first integrated circuit chip; and
wire bonding the second integrated circuit chip to the plating layer on the lead tips in the second row.
13. The method as claimed in claim 12 wherein the wire bonding of the second integrated circuit chip includes wire bonding to center pads on at least one of the integrated circuit chips.
14. The method as claimed in claim 12 further comprising:
forming the leadframe with lead tips in a third row;
forming a plating layer on the lead tips in the third row;
bonding a spacer to the second integrated circuit chip;
bonding a third integrated circuit chip to the spacer; and
wire bonding the third integrated circuit chip to the lead tips in the third row.