Package in package (PiP)
View Patent ↗A package includes an internal package stacked upon a primary die. The package includes interconnection balls to allow the package to be electrically and physically connected to a mother board. The package is mounted to the mother board in a single operation thus minimizing labor and the associated manufacturing cost. Further, the package is tested and verified to be non-defective prior to mounting to the mother board.
1. A structure comprising:
a primary substrate comprising a first surface and a second surface;
a primary die attached to the first surface;
primary bond wires electrically connecting bond pads on a frontside surface of the primary die to first traces on the first surface of the primary substrate;
an internal package comprising:
an internal substrate comprising a first surface and a second surface;
an internal die attached to the first surface of the internal substrate; and
an adhesive attaching the internal package to the frontside surface of the primary die, wherein the width of the internal package is less than the width between the bond pads on the frontside surface of the primary die such that the internal package entirely fits inward of the bond pads.
2. The structure of claim 1 further comprising:
second traces on the second surface of the primary substrate, the second traces electrically connected to the first traces.
3. The structure of claim 2 further comprising interconnection balls on the second traces.
4. The structure of claim 1 wherein the internal package further comprises:
internal bond wires electrically connecting bond pads on a frontside surface of the internal die to first traces on the first surface of the internal substrate.
5. The structure of claim 4 wherein the internal package further comprises an internal encapsulant encapsulating the first surface of the internal substrate, the internal die, and the internal bond wires.
6. The structure of claim 5 wherein a first surface of the internal encapsulant is connected to the adhesive.
7. The structure of claim 4 wherein the internal package further comprises second traces electrically coupled to the first traces of the internal package.
8. The structure of claim 7 wherein the second traces of the internal package are electrically connected to the first traces of the primary substrate by secondary bond wires.
9. The structure of claim 8 wherein the first surface of the primary substrate, the primary die, the primary bond wires, the adhesive, the internal package, and the secondary bond wires are encapsulated in a primary encapsulant.
10. The structure of claim 1 further comprising a third die connected to the frontside surface of the primary die.
11. The structure of claim 1 wherein the internal die is a first internal die, the internal package further comprising:
a second internal die mounted on the first internal die; and
a third internal die mounted on the second internal die.
12. The structure of claim 1 wherein the
internal die is flip chip mounted to the internal substrate.
13. The structure of claim 1 wherein the
internal substrate comprises a hole; and
the internal die is located within the hole.
14. The structure of claim 1 wherein the primary substrate comprises a primary leadframe substrate.
15. A structure comprising:
a primary substrate;
a primary die attached to the primary substrate;
primary bond wires electrically connecting bond pads on a frontside surface of the primary die to first traces of the primary substrate;
an internal package comprising:
an internal substrate comprising a first surface and a second surface; and
an internal die attached to the first surface of the internal substrate,
wherein the internal package is mounted to the frontside surface of the primary die by an adhesive, wherein the width of the internal package is less than the width between the bond pads on the frontside surface of the primary die such that the internal package does not extend beyond the bond pads on the frontside surface of the primary die; and
secondary bond wires electrically connecting the internal package to the primary substrate.
16. A structure comprising:
a primary substrate comprising a first surface and a second surface;
a primary die attached to the first surface;
primary bond wires electrically connecting bond pads on a frontside surface of the primary die to first traces on the first surface of the primary substrate;
an internal package comprising:
an internal substrate comprising a first surface and a second surface;
an internal die attached to the first surface of the internal substrate;
internal bond wires electrically connecting bond pads on a frontside surface of the internal die to first traces on the first surface of the internal substrate; and
second traces electrically coupled to the first traces of the internal package;
an adhesive connected to the frontside surface of the primary die only inward of the bond pads of the primary die and the internal package, wherein the width of the internal package is less than the width between the bond pads on the frontside surface of the primary die such that the internal package entirely fits inward of the bond pads on the frontside surface of the primary die;
secondary bond wires electrically connecting the second traces of the internal package to the first traces of the primary substrate; and
second traces on the second surface of the primary substrate, the second traces electrically connected to the first traces of the primary substrate.
17. The structure of claim 16 further comprising interconnection balls on the second traces of the primary substrate.
18. The structure of claim 1 further comprising a passive device structure coupled to the first surface of the primary substrate.
19. The structure of claim 18 wherein the passive device structure comprises terminals electrically connected to the first traces.