Chip carrier and fabrication method

1. A method for manufacturing a chip carrier, comprising:

providing a substrate having a ground plane, a first side, and a second side;

forming a via that electrically connects the first side to the second side;

forming a printed wire on the first side;

forming a printed wire on the second side;

forming a passive component on the first side, the passive component free of a ground plane;

forming a solder ball on the second side;

forming the solder ball in a region on the second side outside a region located under the passive component; and

attaching an active component to the first side.

2. The method of claim 1 wherein forming the via that electrically connects the first side to the second side further comprises forming the via by reactive ion etching, wet etching, laser drilling, EDO drilling, or drilling with a ceramic bit.

3. The method of claim 1 further comprising electrically connecting the passive component to the active component and via with the printed wire on the first side.

4. A chip carrier, comprising:

a substrate having a ground plane, a first side, and a second side;

a via that electrically connects the first side to the second side;

a printed wire on the first side;

a printed wire on the second side;

a passive component, free of a ground plane, formed on the first side

a solder ball formed on the second side, wherein the solder ball is formed in a region on the second side located outside a region under the passive component; and

an active component attached to the first side.

5. The chip carrier of claim 4 wherein the via is a circuit element in a passive network.

6. The chip carrier of claim 4 wherein the passive component is electrically connected to the active component and via with the printed wire on the first side.