IP Library Granted Patent US 7,523,830
Granted Patent B2
US 7,523,830 · App. 11/284,795 · Granted Apr 28, 2009

Wafer container with secondary wafer restraint system

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Quick Facts
Patent No.
US 7,523,830
App. No.
11/284,795
Granted
Apr 28, 2009
Kind
B2
Abstract

A wafer container providing improved wafer restraint during physical shock events. In embodiments of the invention, a secondary wafer restraint structure defining a plurality of notches is interposed between opposing wafer restraint members on the door of the container. The notches may be defined by one or more converging edges or surfaces meeting at a junction. The junctions are positioned so as to align with the wafer receiving portions of each opposing pair of wafer restraint member so that when the door is fully sealingly engaged with the enclosure of the container, the edge of the wafer is contacting the junction. In this position, any vertical movement of the wafer due to shock imparted to the container causes the wafer to contact the converging surfaces or edges, thereby limiting such movement. The positioning of the secondary wafer restraint structure between and proximate opposing fingers of the primary wafer restraint limits deflection of the wafer between support points and thereby further inhibits the wafer from “jumping” out of the supports and cross-slotting.

Claims (29)

1. The combination of a plurality of wafers and a container for holding the wafers in an axially aligned, generally parallel spaced apart arrangement, the container comprising:

an enclosure portion having a top, a bottom, a pair of opposing sides, a back and an opposing open front defined by a door frame;

a door sealingly receivable in the door frame to close the open front; and

a wafer restraint system comprising at least one wafer support structure in the enclosure portion and a wafer restraint structure on the door for engaging and restraining the wafers, the at least one wafer support structure including a plurality of wafer support shelves defining a plurality of slots, each slot adapted to receive a separate one of the plurality of wafers, the wafer restraint structure on the door comprising a primary restraint structure and a secondary restraint structure, the primary restraint structure comprising a plurality of resilient wafer engaging members arranged so that a first plurality of the wafer engaging members is spaced apart from and opposing a second plurality of the wafer engaging members, wherein each of the resilient wafer engaging members comprises a first elongate connecting portion and a first synclinally shaped wafer receiving portion, the first wafer receiving portion positioned proximate a first end of the first connecting portion, a second end of the first connecting portion being operably coupled with the door, the secondary restraint structure positioned intermediate the first and second pluralities of wafer engaging members and defining a plurality of notches, the notches arranged so that a separate one of the plurality of wafers is received in each notch when the door is engaged in the door frame.

2. The combination of claim 1 , wherein the primary restraint structure includes a perimeter frame defining a central aperture and having a pair of side rails, the resilient wafer engaging members projecting into the central aperture from the side rails.

3. The combination of claim 1 , wherein each resilient wafer engaging member further comprises a second elongate portion and a second synclinally shaped wafer receiving portion, a first end of the second elongate portion operably coupled with the first connecting portion proximate the first wafer receiving portion, the second wafer receiving portion positioned on the second connecting portion at a location spaced apart from the first wafer receiving portion.

4. The combination of claim 1 , wherein the wafer restraint structure comprises a body portion having a pair of opposing sides and a center portion, the resilient wafer engaging members of the primary restraint structure projecting inwardly toward the center portion from each of the opposing sides.

5. The combination of claim 4 , wherein the body portion of the wafer restraint structure has a raised portion proximate the center, wherein the raised portion defines the notches of the secondary restraint structure.

6. The combination of claim 1 , wherein the notches are each defined by a pair of converging edges meeting at a junction, the junction positioned so that when the door is fully received in the door frame, each wafer contacts a separate one of the junctions.

7. The combination of claim 1 , wherein the door has an interior side, and wherein the secondary restraint structure is integrally formed with and projects outwardly from the interior side of the door.

8. The combination of a plurality of wafers and a container for holding the wafers in an axially aligned, generally parallel spaced apart arrangement, the container comprising:

an enclosure portion having a top, a bottom, a pair of opposing sides, a back and an opposing open front defined by a door frame;

a door sealingly receivable in the door frame to close the open front; and

a wafer restraint system comprising at least one wafer support structure in the enclosure portion and a wafer restraint structure on the door for engaging and restraining the wafers, the at least one wafer support structure including a plurality of wafer support shelves defining a plurality of slots, each slot adapted to receive a separate one of the plurality of wafers, the wafer restraint structure on the door comprising a primary restraint structure including a plurality of resilient wafer engaging members arranged so that a first plurality of the wafer engaging members is spaced apart from and opposing a second plurality of the wafer engaging members, wherein each of the resilient wafer engaging members comprises a first elongate connecting portion and a first synclinally shaped wafer receiving portion, the first wafer receiving portion positioned proximate a first end of the first connecting portion, a second end of the first connecting portion being operably coupled with the door, the wafer restraint structure further comprising a secondary restraint structure positioned intermediate the first and second pluralities of wafer engaging members.

9. The combination of claim 8 , wherein the secondary restraint structure comprises a plurality of notches, each notch defined by a pair of converging surfaces meeting at a junction, the junction positioned so that when the door is fully received in the door frame, each wafer contacts a separate one of the junctions.

10. The combination of claim 8 , wherein the primary restraint structure includes a perimeter frame defining a central aperture and having a pair of side rails, the resilient wafer engaging members projecting into the central aperture from the side rails.

11. The combination of claim 8 , wherein each resilient wafer engaging member further comprises a second elongate portion and a second synclinally shaped wafer receiving portion, a first end of the second elongate portion operably coupled with the first connecting portion proximate the first wafer receiving portion, the second wafer receiving portion positioned on the second connecting portion at a location spaced apart from the first wafer receiving portion.

12. The combination of claim 8 , wherein the wafer restraint structure comprises a body portion having a pair of opposing sides and a center portion, the resilient wafer engaging members of the primary restraint structure projecting inwardly toward the center portion from each of the opposing sides.

13. The combination of claim 12 , wherein the body portion of the wafer restraint structure has a raised portion proximate the center, and wherein the means for inhibiting the wafers from being dislodged comprises a plurality of notches defined in the raised portion.

14. A container for holding a plurality of wafers in an axially aligned, generally parallel spaced apart arrangement, the container comprising:

an enclosure portion having a top, a bottom, a pair of opposing sides, a back and an opposing open front;

a door for sealingly closing the open front; and

a wafer restraint system comprising at least one wafer support structure in the enclosure portion and a wafer restraint structure on the door for engaging and restraining the wafers, the at least one wafer support structure including a plurality of wafer support shelves defining a plurality of slots, each slot adapted to receive a separate one of the plurality of wafers, the wafer restraint structure on the door comprising a primary restraint structure and a secondary restraint structure, the primary restraint structure comprising a plurality of resilient wafer engaging members arranged so that a first plurality of the wafer engaging members is spaced apart from and opposing a second plurality of the wafer engaging members, each wafer engaging member having a wafer contact portion spaced apart a first distance from the door, the secondary restraint structure positioned intermediate the first and second pluralities of wafer engaging members, the secondary restraint structure defining a plurality of generally v-shaped grooves, each groove registered with a separate one of the wafer engaging members of the first plurality and a separate one of the wafer engaging members of the second plurality, wherein portions of the secondary restraint structure on either side of each groove project from the door a second distance greater than the first distance by which each wafer contact portion is spaced apart from the door.

15. The combination of claim 14 , wherein the primary restraint structure includes a perimeter frame defining a central aperture and having a pair of side rails, the resilient wafer engaging members projecting into the central aperture from the side rails.

16. The combination of claim 14 , wherein each of the resilient wafer engaging members comprises a first elongate connecting portion and a first synclinally shaped wafer receiving portion, the first wafer receiving portion positioned proximate a first end of the first connecting portion, a second end of the first connecting portion being operably coupled with the door.

17. The combination of claim 16 , wherein each resilient wafer engaging member further comprises a second elongate portion and a second synclinally shaped wafer receiving portion, a first end of the second elongate portion operably coupled with the first connecting portion proximate the first wafer receiving portion, the second wafer receiving portion positioned on the second connecting portion at a location spaced apart from the first wafer receiving portion.

18. The combination of claim 14 , wherein the wafer restraint structure comprises a body portion having a pair of opposing sides and a center portion, the resilient wafer engaging members of the primary restraint structure projecting inwardly toward the center portion from each of the opposing sides.

19. The combination of claim 18 , wherein the body portion of the wafer restraint structure has a raised portion proximate the center, wherein the raised portion defines the grooves of the secondary restraint structure.

20. The combination of claim 14 , wherein the door has an interior side, and wherein the secondary restraint structure is integrally formed with the door.

Assignments (10)
SECURITY INTEREST Recorded Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
ASSIGNMENT OF PATENT SECURITY INTEREST RECORDED AT REEL/FRAME 048811/0679 Recorded Nov 5, 2019
From: GOLDMAN SACHS BANK USA
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 050965/0035 →
SECURITY INTEREST Recorded Nov 13, 2018
From: ENTEGRIS, INC.; SAES PURE GAS, INC.
To: GOLDMAN SACHS BANK USA
Reel/Frame 048811/0679 →
RELEASE OF SECURITY INTEREST Recorded Nov 8, 2018
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: ENTEGRIS, INC.; POCO GRAPHITE, INC.; ATMI, INC.; ATMI PACKAGING, INC.; ADVANCED TECHNOLOGY MATERIALS, INC.
Reel/Frame 047477/0151 →
RELEASE OF SECURITY INTEREST Recorded Nov 8, 2018
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: ENTEGRIS, INC.; POCO GRAPHITE, INC.; ATMI, INC.; ATMI PACKAGING, INC.; ADVANCED TECHNOLOGY MATERIALS, INC.
Reel/Frame 047477/0032 →
SECURITY INTEREST Recorded May 2, 2014
From: ENTEGRIS, INC.; POCO GRAPHITE, INC.; ATMI, INC.; ADVANCED TECHNOLOGY MATERIALS, INC.; ATMI PACKAGING, INC.
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 032812/0192 →
SECURITY INTEREST Recorded May 1, 2014
From: ENTEGRIS, INC.; POCO GRAPHITE, INC.; ATMI, INC.; ADVANCED TECHNOLOGY MATERIALS, INC.; ATMI PACKAGING, INC.
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 032815/0852 →
RELEASE OF SECURITY INTEREST Recorded Aug 17, 2011
From: WELLS FARGO BANK NATIONAL ASSOCIATION
To: ENTEGRIS, INC.
Reel/Frame 026764/0880 →
SECURITY AGREEMENT Recorded Mar 9, 2009
From: ENTEGRIS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS AGENT
Reel/Frame 022354/0784 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 18, 2006
From: BURNS, JOHN; FULLER, MATTHEW A.; KING, JEFFERY J.; FORBES, MARTIN L.; SMITH, MARK V.
To: ENTEGRIS, INC.
Reel/Frame 017027/0132 →