IP Library Granted Patent US 7,361,915
Granted Patent B2
US 7,361,915 · App. 11/290,346 · Granted Apr 22, 2008

Beam current stabilization utilizing gas feed control loop

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Quick Facts
Patent No.
US 7,361,915
App. No.
11/290,346
Granted
Apr 22, 2008
Kind
B2
Abstract

One or more aspects of the present invention pertain to stabilizing the current or density of an ion beam within an ion implantation system by selectively adjusting a lone parameter of feed gas flow. Adjusting the gas flow does not necessitate adjustments to other operating parameters and thereby simplifies the stabilization process. This allows the beam current to be stabilized relatively quickly so that ion implantation can begin promptly and continue uninterrupted. This improves throughput while reducing associated implantation costs.

Claims (43)

1. A method of implanting ions into a workpiece, comprising:

initiating an ion implantation process; and

solely adjusting a source gas feed to achieve a desired stabilized beam current.

2. The method of claim 1 , comprising:

implementing a control feedback loop to make continual non-discrete adjustments to the source gas feed in real time based upon corresponding measurements taken of the beam current to achieve the desired stabilized beam current.

3. The method of claim 2 , comprising:

adjusting the source gas feed to achieve a desired extraction current.

4. The method of claim 1 , comprising:

adjusting the source gas feed to achieve a desired extraction current.

5. The method of claim 4 , comprising:

implementing a control feedback loop to make continual non-discrete adjustments to the source gas feed in real time based upon corresponding measurements taken of the beam current to achieve the desired stabilized beam current.

6. The method of claim 3 , comprising:

moving the wafer relative to the ion beam to implant ions into the workpiece.

7. A method of implanting ions into a workpiece, comprising:

initiating an ion implantation process; and

implementing a control feedback loop to make continual non-discrete adjustments to a source gas feed in real time based upon corresponding measurements taken of the beam current to achieve a desired stabilized beam current.

8. The method of claim 7 , comprising:

solely adjusting the source gas feed to achieve the desired stabilized beam current.

9. The method of claim 8 , comprising:

adjusting the source gas feed to achieve a desired extraction current.

10. The method of claim 7 , comprising:

adjusting the source gas feed to achieve a desired extraction current.

11. The method of claim 10 , comprising:

solely adjusting the source gas feed to achieve the desired stabilized beam current.

12. The method of claim 9 , comprising:

moving the wafer relative to the ion beam to implant ions into the workpiece.

13. The method of claim 11 , comprising:

moving the wafer relative to the ion beam to implant ions into the workpiece.

14. A method of implanting ions into a workpiece, comprising:

initiating an ion implantation process; and

adjusting a source gas feed to achieve a desired stabilized extraction current.

15. The method of claim 14 , comprising:

solely adjusting the source gas feed to achieve the desired stabilized beam current.

16. The method of claim 15 , comprising:

implementing a control feedback loop to make continual non-discrete adjustments to the source gas feed in real time based upon corresponding measurements taken of the beam current to achieve the desired stabilized beam current.

17. The method of claim 14 , comprising:

implementing a control feedback loop to make continual non-discrete adjustments to the source gas feed in real time based upon corresponding measurements taken of the beam current to achieve the desired stabilized beam current.

18. The method of claim 17 , comprising:

solely adjusting the source gas feed to achieve the desired stabilized beam current.

19. The method of claim 16 , comprising:

moving the wafer relative to the ion beam to implant ions into the workpiece.

20. The method of claim 18 , comprising:

moving the wafer relative to the ion beam to implant ions into the workpiece.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Apr 7, 2023
From: SILICON VALLEY BANK A DIVISION OF FIRST-CITIZENS BANK & TRUST COMPANY
To: AXCELIS TECHNOLOGIES, INC.
Reel/Frame 063270/0277 →
SECURITY INTEREST Recorded Jul 31, 2020
From: AXCELIS TECHNOLOGIES, INC.
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
Reel/Frame 053375/0055 →
CONSENT AND LICENSE AGREEMENT Recorded Apr 17, 2009
From: AXCELIS TECHNOLOGIES, INC.
To: SEN CORPORATION
Reel/Frame 022562/0758 →
SECURITY AGREEMENT Recorded May 9, 2008
From: AXCELIS TECHNOLOGIES, INC.
To: SILICON VALLEY BANK
Reel/Frame 020986/0143 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2005
From: RATHMELL, ROBERT D.; VANDERBERG, BO H.
To: AXCELIS TECHNOLOGIES, INC.
Reel/Frame 017284/0589 →