Semiconductor package with passive device integration

1. An integrated circuit package, comprising:

a lead finger having a horizontal length, a horizontal width, and a vertical thickness, the lead finger having a groove formed therein at least halfway through the vertical thickness with a connected reservoir formed therein at least halfway through the vertical thickness;

a conductive bonding agent in the groove and the connected reservoir; and

an electronic device in the groove to be held to the lead finger by the conductive bonding agent in the groove and in the connected reservoir.

2. The integrated circuit package as claimed in claim 1 wherein the lead finger has a tip of at least one of the configurations of straight, increased width, side extension, flared, offset, extended, or a combination thereof.

3. The integrated circuit package as claimed in claim 1 further comprising the lead finger formed into an external lead around at least a portion of the integrated circuit package.

4. The integrated circuit package as claimed in claim 1 wherein:

the connected reservoir is adjacent to a corner of the groove; and

the groove has a second connected reservoir adjacent to a further corner of the groove for containing the conductive bonding agent.

5. The integrated circuit package as claimed in claim 1 further comprising:

a leadframe paddle having the groove provided therein;

a conductive bonding agent in the groove; and

the electronic device in the groove to be held by the conductive bonding agent.

6. The integrated circuit package as claimed in claim 1 further comprising:

an integrated circuit die bonded by at least one of wire or ball to the lead finger; and

at least one of a solder bump or a ball grid array ball formed on the lead finger.

7. An integrated circuit package, comprising:

lead fingers having horizontal lengths, horizontal widths, and vertical thicknesses, the lead fingers extending parallel, perpendicular, and a combination thereof one to another, a pair of lead fingers having blind or through grooves formed therein at least halfway through the vertical thicknesses with connected reservoirs formed therein at least halfway through the vertical thicknesses;

a conductive bonding agent in the blind or through grooves; and

a passive device in the blind or through grooves to be held to the lead finger by the conductive bonding agent in the grooves and in the connected reservoirs, the passive device extending between the pair of lead fingers.

8. The integrated circuit package as claimed in claim 7 wherein:

the lead fingers have tips of at least one of the configurations of straight, increased, side extension, flared, offset, extended, or a combination thereof;

the passive device includes a small, medium, or large passive device connected between two of the lead fingers; and

the blind or through grooves are formed proximate the tips of the lead fingers.

9. The integrated circuit package as claimed in claim 7 further comprising:

the lead fingers formed into external leads around at least a portion of the integrated circuit package; and

an additional passive device on one of the external leads exterior to the integrated circuit package.

10. The integrated circuit package as claimed in claim 7 wherein:

the connected reservoirs are adjacent to a corner of the grooves; and

the grooves have a second connected reservoir adjacent to a further corner of the grooves for containing the conductive bonding agent.

11. The integrated circuit package as claimed in claim 7 further comprising:

a leadframe paddle having at least a groove, a notch, or a relief provided therein;

a conductive bonding agent in at least the groove, the notch, the relief, or a combination thereof; and

at least the passive device in the groove, the notch, the relief, or a combination thereof is held by the conductive bonding agent between at least one of the lead fingers and the leadframe paddle, the integrated circuit die and the groove, the notch, the relief, or a combination thereof.

12. The integrated circuit package as claimed in claim 7 further comprising:

an integrated circuit die bonded by at least one of a wire or ball to the lead finger;

an encapsulant encapsulating the integrated circuit die and the lead finger; and

at least one of a solder bump or a ball grid array ball formed on the lead finger outside the integrated circuit package.