STACKED INTEGRATED CIRCUITS PACKAGE SYSTEM
A stacked integrated circuits package system is provided providing a first substrate, mounting a first integrated circuit having a recess to the first substrate, and mounting a second integrated circuit in the recess.
1 . A stacked integrated circuits package system comprising:
providing a first substrate;
mounting a first integrated circuit having a recess to the first substrate; and
mounting a second integrated circuit in the recess.
2 . The system as claimed in claim 1 wherein mounting the first integrated circuit having a recess to the first substrate comprises etching the recess on a back side of the first integrated circuit.
3 . The system as claimed in claim 1 further comprising locally thinning a back side of the first integrated circuit.
4 . The system as claimed in claim 1 further comprising:
attaching electrical interconnect structures on the second integrated circuit;
connecting a second substrate to the electrical interconnect structures on the second integrated circuit; and
electrically connecting the second substrate to the first substrate.
5 . The system as claimed in claim 1 wherein mounting a second integrated circuit in the recess comprises:
mounting a second substrate in the recess;
forming electrical interconnect structures to the second integrated circuit;
connecting the electrical inteconnect structures on the second integrated circuit to the second substrate;
mounting a third integrated circuit on the second integrated circuit; and
electrically connecting the second substrate and the third integrated circuit to the first substrate.
6 . A stacked integrated circuits package system comprising:
providing a first substrate;
providing a first integrated circuit having electrical interconnect structures on an active side;
mounting the first integrated circuit on the first substrate with the electrical interconnect structures;
etching a recess on the back side of the first integrated circuit;
attaching a second integrated circuit in the recess; and
electrically connecting the second integrated circuit to the first substrate.
7 . The system as claimed in claim 6 further comprising encapsulating a mold compound over the first integrated circuit, the second integrated circuit, and the first substrate.
8 . The system as claimed in claim 6 wherein electrically connecting the second integrated circuit comprises connecting wire bonds to electrically connect the second integrated circuit to the first substrate.
9 . The system as claimed in claim 6 further comprising forming solder bumps on the first integrated circuit to electrically connect the first integrated circuit to the first substrate.
10 . The system as claimed in claim 6 further comprising etching the back side of the first integrated circuit.
11 . A stacked integrated circuits package system comprising:
a first substrate having a first integrated circuit mounted thereto;
a recess in the first integrated circuit; and
a second integrated circuit in the recess.
12 . The system as claimed in claim 11 wherein the recess in the first integrated circuit comprises the recess on a back side of the first integrated circuit.
13 . The system as claimed in claim 11 wherein the first integrated circuit having the recess includes the recess having different geometric shapes.
14 . The system as claimed in claim 11 further comprising:
electrical interconnect structures on the second integrated circuit;
a second substrate connected to the electrical interconnect structures on the second integrated circuit; and
the second substrate electrically connected to the first substrate.
15 . The system as claimed in claim 11 wherein the second integrated circuit in the recess comprises:
a second substrate in the recess;
electrical interconnect structures on the second integrated circuit, wherein the electrical interconnect structures electrically connected on the second substrate;
a third integrated circuit on the second integrate circuit; and
the second substrate and the third integrated circuit electrically connected to the first substrate.
16 . A stacked integrated circuits package system comprising:
a first substrate;
a first integrated circuit having electrical interconnect structures on an active side, wherein the first integrated circuit mounted on the first substrate with the electrical interconnect structures;
a recess on the back side of the first integrated circuit;
a second integrated circuit in the recess, wherein the second integrated circuit electrically connected to the first substrate.
17 . The system as claimed in claim 16 further comprising a mold compound over the first integrated circuit, the second integrated circuit, and the first substrate.
18 . The system as claimed in claim 16 further comprising wire bonds to electrically connect the second integrated circuit to the first substrate.
19 . The system as claimed in claim 16 further comprising solder bumps on the first integrated circuit to electrically connect the first integrated circuit to the first substrate.
20 . The system as claimed in claim 16 further comprising integrated circuits stacked above the second integrated circuit electrically connected to the first substrate.