Stacked integrated circuit package-in-package system with recessed spacer

1. A stacked integrated circuit package-in-package system comprising:

forming a first integrated circuit spacer package including a mold compound with a recess provided therein wherein forming the first integrated circuit spacer package including a mold compound with the recess provided therein and having a beveled form;

stacking the first integrated circuit spacer package on an integrated circuit die on a substrate with the recess positioned therebetween; and

attaching a first electrical interconnect extending from the recess and connected between the integrated circuit die and the substrate.

2. The system as claimed in claim 1 wherein forming the first integrated circuit spacer package including a mold compound with the recess provided therein and having a stepped form.

3. The system as claimed in claim 1 wherein forming the first integrated circuit spacer package including a mold compound with the recess provided therein and having a curved form.

4. The system as claimed in claim 1 further comprising encapsulating the first integrated circuit spacer package, the integrated circuit die, and the first electrical interconnect.

5. A stacked integrated circuit package-in-package system comprising:

forming a first integrated circuit spacer package including a mold compound and a carrier wherein forming the mold compound having the recess provided therein comprises:

forming a top mold plate having an isolation recess in an isolation mask along an abscissa and a channel recess in a channel mask along an ordinate;

filling the isolation recess and the channel recess with the mold compound to form an encapsulation;

forming the encapsulation having a first side, formed in the channel recess, with an obtuse angle and the mold compound on the carrier below the channel mask; and

forming the encapsulation having a second side, adjacent to the first side formed in the isolation recess, with the obtuse angle and the isolation mask on the carrier;

forming the mold compound having a recess provided therein with a trapezoid prism shape having a carrier side, as a base of the trapezoid prism shape, wider than an attachment side, as a top of the trapezoid prism shape;

stacking the first integrated circuit spacer package on an integrated circuit die on a substrate with the recess positioned therebetween; and

attaching a first electrical interconnect extending from the recess and connected between the integrated circuit die and the substrate.

6. The system as claimed in claim 5 wherein forming the mold compound having the recess provided therein comprises:

forming a top mold plate having a channel recess in a channel mask along an ordinate and an abscissa;

filling the channel recess with the mold compound to form an encapsulation; and

forming the encapsulation having a side, formed in the channel recess, with an obtuse angle and the mold compound on the carrier below the channel mask.

7. The system as claimed in claim 5 wherein forming the mold compound having the recess provided therein comprises:

forming an individual mold cap having an injection hole and a recess;

filling the recess through the injection hole with the mold compound to form an encapsulation; and

forming the encapsulation having a side, formed in the recess, with an obtuse angle.

8. The system as claimed in claim 5 wherein forming the mold compound having the recess provided therein comprises:

forming a planar mold cap and a molding recess; and

filling the molding recess with the mold compound to form an encapsulation.

9. A stacked integrated circuit package-in-package system comprising:

a first integrated circuit spacer package including a mold compound with a recess provided therein wherein the recess is a beveled, stepped, or curved form;

the first integrated circuit spacer package on an integrated circuit die on a substrate with the recess positioned therebetween; and

a first electrical interconnect extending from the recess and connected between the integrated circuit die and the substrate.

10. The system as claimed in claim 9 further comprising a package mold to cover the first integrated circuit spacer package, the integrated circuit die, and the first electrical interconnect.

11. The system as claimed in claim 9 wherein:

the first integrated circuit spacer package including the mold compound with the recess provided therein serves as a spacer;

the first integrated circuit spacer package on the integrated circuit die on the substrate with the recess positioned therebetween for a electrical connection to the integrated circuit die;

the first electrical interconnect extending from the recess and connected between the integrated circuit die and the substrate;

forming a first integrated circuit spacer package including a mold compound and a carrier; and

further comprising:

a carrier of the first integrated circuit package; and

the mold compound has a trapezoid prism shape having a carrier side on the carrier, as a base of the trapezoid prism shape, wider than an attachment side, as a top of the trapezoid prism shape.

12. The system as claimed in claim 11 wherein the mold compound has a first side, along an ordinate, in an obtuse angle with the carrier exposed and a second side, along an abscissa and adjacent to the first side, in the obtuse angle with the substrate covered by the mold compound.

13. The system as claimed in claim 11 wherein the mold compound has a side with an obtuse angle and covers the carrier.

14. The system as claimed in claim 11 wherein the mold compound has a side with a curved shape.

15. The system as claimed in claim 11 wherein the mold compound has a side with a stepped shape.