Method of fabricating trench MIS device with thick oxide layer in bottom of trench
View Patent ↗A trench MIS device includes a thick dielectric layer at the bottom of the trench. The thick dielectric layer can be formed by the deposition or thermal growth of a dielectric material, such as silicon dioxide, on the bottom portion of the trench. The thick dielectric layer, which reduces the capacitance between the drain and gate of the device, can be formed in both the active areas of the device, where the switching function is performed, and in the inactive areas where, among other things, contacts are made to the gate electrode.
1. A method of fabricating an MIS device comprising:
providing a semiconductor substrate;
forming a trench in said substrate;
depositing a mask layer in said trench;
etching said mask layer to form an exposed area at a bottom of said trench;
forming an insulating layer in said exposed area by means of a process comprising chemical vapor deposition;
depositing a conductive material into said trench over the insulating layer; and
creating a contact between said conductive material and a metal layer overlying said substrate.
2. The method of claim 1 wherein forming an insulating layer in said exposed area comprises depositing an insulating layer by chemical vapor deposition such that the insulating layer fills the entire remaining space within the trench and then etching the insulating layer back such that a top surface of the insulating layer is located within the trench.
3. The method of claim 2 wherein depositing said insulating layer by chemical vapor deposition comprises depositing said insulating layer such that said insulating layer overflows a top surface of said substrate.
4. The method of claim 1 wherein said trench is located in a gate bus region of said device.
5. The method of claim 1 wherein said trench is located in a termination region of said device.
6. The method of claim 1 wherein depositing a conductive material into said trench comprises depositing doped polysilicon in said trench.
7. The method of claim 1 wherein depositing a mask layer comprises depositing silicon nitride.
8. The method of claim 1 wherein said substrate comprises silicon.
9. The method of claim 1 wherein said insulating layer comprises an oxide.
10. The method of claim 1 wherein said insulating layer comprises glass.
11. The method of claim 10 wherein said insulating layer comprises phosphosilicate glass.
12. The method of claim 10 wherein said insulating layer comprises borophosphosilicate glass.
13. The method of claim 1 wherein forming a trench comprises etching the substrate and thermally growing a pad oxide.
14. The method of claim 1 wherein forming an insulating layer in said exposed area comprises depositing an insulating layer by chemical vapor deposition such that the insulating layer fills the entire remaining space within the trench and then etching the insulating layer back such that a top surface of the insulating layer is approximately level with a top surface of the substrate.
15. The method of claim 1 comprising removing the mask layer before depositing a conductive material into said trench.
16. The method of claim 15 wherein the substrate is doped with material of a first conductivity type in the vicinity of the trench, the method further comprising:
forming a gate dielectic layer adjoining the insulating layer; and
introducing a dopant of a second conductivity type opposite to the first conductivity type to form a body region such that a PN junction between the body region and a remaining area of the substrate is located near an interface between the gate dielectric layer and the insulating layer.
17. The method of claim 16 wherein introducing a dopant of the second conductivity type comprises diffusing the dopant such that a portion of the PN junction is located below the trench.