Method of making circuitized substrate
View Patent ↗A method of making a circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer.
1. A method of making a circuitized substrate, said method comprising:
providing a first dielectric layer including a high glass transition temperature, dicyandiamide-free epoxy resin material and a high molecular weight thermoplastic resin material and a filler comprised of particles having a size within the range of from about 200 Angstroms to about 35 microns, said particles comprising from about 10 percent to about 80 percent by volume of said first dielectric layer, said first dielectric layer not including continuous or semi-continuous fibers as part thereof, said first dielectric layer having a dielectric constant within the range of from about 3.5 to about 4.0;
forming a plurality of conductive thru-holes within said first dielectric layer having a pattern density of from about 5,000 to about 10,000 holes per square inch of said first dielectric layer; and
positioning at least one circuitized layer on said first dielectric layer.
2. The method of claim 1 wherein said particles of said filler comprise about 39 percent by volume of said first dielectric layer.
3. The method of claim 1 wherein the aspect ratio of the thickness of said circuitized substrate to the diameter of each of said thru-holes is within the range of from about 2:1 to about 20:1.
4. The method of claim 1 wherein said filler comprised of said particles comprises spherical amorphous silica having a particle size of from about 2 to about 15 microns.
5. The method of claim 1 wherein said filler comprised of said particles comprises aluminum oxide or aluminum nitride having a particle size of from about 2 to about 15 microns.
6. The method of claim 1 further including providing a coupling agent on said particles having a thickness of no more than a few monolayers.
7. The method of claim 6 wherein said coupling agent is silane.
8. The method of claim 1 wherein said first dielectric layer is provided further including a thixotrope.
9. The method of claim 1 wherein said at least one circuitized layer is comprised of copper.
10. The method of claim 1 further including positioning a second circuitized layer on said first dielectric layer on a side opposite said at least one circuitized layer.
11. The method of claim 10 further including electrically coupling selected parts of said at least one circuitized layer with selected parts of said second circuitized layer with selected ones of said conductive thru holes.
12. The method of claim 11 further including positioning second and third dielectric layers on said at least one circuitized layer and said second circuitized layer, respectively, and forming third and fourth circuitized layers on said second and third dielectric layer, respectively.
13. The method of claim 1 wherein said plurality of conductive thru-holes are provided within said first dielectric layer using a laser.
14. The method of claim 1 further including electrically coupling at least one electrical component to said at least one circuitized layer on said first layer of said dielectric material.