Granted Patent B2

US 7,343,674 · App. 11/349,998 · Granted Mar 18, 2008

Abstract

Claims (12)

1. A method of making a circuitized substrate assembly, said method comprising:

providing a first circuitized substrate having an opening therein;

providing a second circuitized substrate having an opening therein;

positioning an electrically conductive cover member on a surface of said second circuitized substrate facing said first circuitized substrate to substantially cover said opening in said second circuitized substrate;

positioning a quantity of electrically conductive paste on said cover member;

aligning said first and second circuitized substrates such that said openings in said circuitized substrates are substantially aligned; and

bonding said first and second circuitized substrates such that said quantity of electrically conductive paste only partly fills said opening in said first circuitized substrate.

2. The method of claim 1 wherein said bonding of said first and second substrates is achieved by laminating.

3. The method of claim 2 wherein said laminating is accomplished at a temperature of from about 70 to about 200 degrees Celsius.

4. The method of claim 3 wherein said laminating is accomplished at a pressure of from about 50 to about 500 pounds per square inch.

5. The method of claim 4 wherein said laminating is accomplished for a time period of from about 30 to about 180 minutes.

6. The method of claim 1 wherein said opening in said second substrate is substantially filled with dielectric material prior to said positioning of said electrically conductive cover member on a surface of said second circuitized substrate.

Assignments (13)