Integrated circuit package system with heat dissipation enclosure
View Patent ↗An integrated circuit package system is provided providing an integrated circuit die, and enclosing the integrated circuit die in a heat dissipation enclosure comprises mounting the integrated circuit die on a die paddle attaching a heat block ring to the die paddle around the integrated circuit die, and attaching a heat slug on the heat block ring over the integrated circuit die.
1. An integrated circuit package manufacturing method comprising:
providing an integrated circuit die; and
enclosing the integrated circuit die in a heat dissipation enclosure comprises:
mounting the integrated circuit die on a die paddle having discrete pads connected to corners of a central portion thereof,
attaching a heat block ring to the pad and around the integrated circuit die with the heat block ring having inwardly extending pads lining up over the discrete pads, and
attaching a heat slug on the heat block ring over the integrated circuit die.
2. The method as claimed in claim 1 wherein attaching the heat block ring to the die paddle around the integrated circuit die includes forming the heat block ring having a recess for an electrical interconnect connected to the integrated circuit die.
3. The method as claimed in claim 1 wherein enclosing the integrated circuit die in the heat dissipation enclosure comprises:
forming a substrate having the die paddle therein;
mounting the integrated circuit die on the die paddle; and
thermally connecting an external interconnect through the substrate and the die paddle to the integrated circuit die.
4. The method as claimed in claim 1 wherein enclosing the integrated circuit die in the heat dissipation enclosure comprises:
providing a substrate having the die paddle therein;
mounting the integrated circuit die on the die paddle;
attaching the heat block ring on the substrate around the integrated circuit die; and
thermally connecting an external interconnect through the substrate to the heat block ring.
5. The method as claimed in claim 1 further comprising encapsulating the integrated circuit die and the heat dissipation enclosure.
6. An integrated circuit package manufacturing method comprising:
providing an integrated circuit die;
enclosing the integrated circuit die in a heat dissipation enclosure comprises:
mounting the integrated circuit die on a substrate having a die paddle having discrete pads connected to corners of a central portion thereof,
attaching a heat block ring on the pad and the substrate around the integrated circuit die with the heat block ring having inwardly extending pads lining up over the discrete pads, and
attaching a heat slug on the heat block ring over the integrated circuit die; and
attaching an external interconnect to the substrate on a side opposite the heat dissipation enclosure.
7. The method as claimed in claim 6 further comprising connecting an electrical interconnect between the integrated circuit die and the substrate.
8. The method as claimed in claim 6 wherein mounting the integrated circuit die on the substrate having the die paddle includes forming the substrate having a metal layer.
9. The method as claimed in claim 6 wherein mounting the integrated circuit die on the substrate having the die paddle includes forming the substrate having an electrical via.
10. The method as claimed in claim 6 wherein enclosing the integrated circuit die in the heat dissipation enclosure includes forming the heat dissipation enclosure with a thermally conductive material.
11. An integrated circuit package system comprising:
an integrated circuit die;
a die paddle for supporting the integrated circuit die, the die paddle having discrete pads connected to corners of a central portion thereof;
a heat block ring attached to the pad and around the integrated circuit die with the heat block ring having inwardly extending pads lining up over the discrete pads; and
a heat slug on the heat block ring over the integrated circuit die for forming a heat dissipation enclosure.
12. The system as claimed in claim 11 wherein the heat block ring attached to the die paddle around the integrated circuit die includes the heat block ring having a recess for an electrical interconnect connected to the integrated circuit die.
13. The system as claimed in claim 11 further comprising:
a substrate having the die paddle therein; and
an external interconnect thermally connected though the substrate and the die paddle to the integrated circuit die.
14. The system as claimed in claim 11 further comprising:
a substrate having the die paddle therein;
the heat block ring on the substrate around the integrated circuit die; and
an external interconnect thermally connected through the substrate to the heat block ring.
15. The system as claimed in claim 11 further comprising a molding compound to cover the integrated circuit die and the heat dissipation enclosure.
16. The system as claimed in claim 11 further comprising:
a substrate having the die paddle therein; and
an external interconnect on the substrate on a side opposite the heat dissipation enclosure.
17. The system as claimed in claim 16 further comprising an electrical interconnect between the integrated circuit die and the substrate.
18. The system as claimed in claim 16 wherein the substrate has a metal layer.
19. The system as claimed in claim 16 wherein the substrate has an electrical via.
20. The system as claimed in claim 16 wherein the heat block ring and the heat slug are of a thermally conductive material.