Power semiconductor device having improved performance and method

1. A semiconductor device, comprising:

a substrate having a major surface, wherein the substrate comprises a first conductivity type;

a pedestal structure overlying a portion of the major surface, wherein the pedestal structure includes a dielectric material;

a conductive material disposed along a side surface of the pedestal structure to define an edge of a first conduction electrode of the semiconductor device, wherein the first conduction electrode comprises a control electrode;

an offset doped region of a second conductivity type formed in the major surface adjacent the first conduction electrode, wherein the offset doped region comprises a wider portion adjacent the major surface, and a narrower portion underlying the wider portion, and wherein the wider portion of the offset doped region forms a drain edge of a channel region when the semiconductor device is in operation, and wherein the control electrode overlaps portions of both the wider and the narrower portions of the offset doped region;

a current carrying region of the first conductivity type formed in the offset doped region;

a second doped region of the second conductivity type formed in the substrate external to the offset doped region and in proximity to and spaced apart from the drain edge of the channel region; and

a first conductive layer formed as part of the pedestal structure and coupled to the second doped region.

2. The semiconductor device of claim 1 , wherein the, substrate includes a semiconductor layer of a first conductivity type formed over the substrate, wherein the semiconductor layer has a lower doping concentration than the substrate.

3. The semiconductor device of claim 2 further comprising a second doped region of the first conductivity type formed adjacent the major surface adjacent the drain edge of the channel, wherein the second doped region has a greater doping concentration than the semiconductor layer.

4. The device of claim 2 , wherein the semiconductor layer comprises silicon-germanium.

5. The semiconductor device of claim 1 wherein a second surface of the substrate forms a second conduction electrode.

6. The semiconductor device of claim 1 , wherein the first conductive layer comprises polycrystalline silicon.

7. The semiconductor device of claim 1 , wherein the second doped region is coupled to the current carrying region.

8. The semiconductor device of claim 1 wherein the wider portion is about 0.6 microns wider than the narrower portion.

9. The semiconductor device of claim 1 , wherein the pedestal structure includes:

a first dielectric layer formed over the top surface of the substrate;

a second dielectric layer formed over the first dielectric layer; and

a second conductive layer formed over the second dielectric layer, wherein the second conductive layer is coupled to the first conduction electrode.

10. A semiconductor device, comprising:

a semiconductor substrate;

a semiconductor layer of a first conductivity type formed over the semiconductor substrate and having a major surface;

an offset body region of a second conductivity type disposed in the semiconductor layer, the offset body region having a first portion adjoining the major surface, and second portion underlying the first portion, the second portion stepped-in from sides of the first portion, wherein the first portion is for forming a channel of the semiconductor device;

a current conducting region of the first conductivity type formed in the offset body region;

a pedestal structure formed overlying the major surface, wherein the pedestal structure includes a dielectric material and a first conductive layer;

a gate electrode formed along a side surface of the pedestal structure and adjacent the channel, wherein the gate electrode overlaps both the first and second portions of the offset body region; and

a first doped region of the second conductivity type formed in the semiconductor layer external to the offset body region in proximity to the major surface and spaced apart from the offset body region, wherein the first conductive layer is electrically coupled to the first doped region.

11. The semiconductor device of claim 10 further comprising a second doped region of the first conductivity type formed adjacent the offset body region, wherein the second doped region has a higher dopant concentration than the semiconductor layer.

12. The device of claim 10 , wherein the semiconductor layer comprises silicon-germanium.

13. The semiconductor device of claim 10 , wherein the first portion is about 0.6 microns wider than the second portion.

14. The semiconductor device of claim 10 wherein the semiconductor substrate comprises the second conductivity type.