IP Library Assignment 019795/0808
Patent Assignment
Reel/Frame 019795/0808

Security Agreement

Recorded: 2007-09-10 Received: 2007-09-10 Pages: 36
Assignor
Assignee
JPMORGAN CHASE BANK, N.A.
270 PARK AVENUE, NEW YORK, NY, 10017, UNITED STATES
Covered Properties (100)
Electronic Package Having Down-Set Leads and Method
Application: 11/575,204 →
Class-D Amplifier and Method Therefor
Application: 11/572,431 →
Battery Protection Method and Circuit Therefor
Application: 11/570,400 →
Method of Testing a Power Supply Controller and Structure Therefor
Application: 11/573,076 →
Semiconductor Device Having Trench Structures and Method
Application: 11/769,650 →
Encapsulated Electronic Device
Application: 11/769,490 →
Circuit Component and Method of Manufacture
Application: 11/768,558 →
Power Supply Soft Start Controller with No Output Voltage Undershoot When Transistioning from Skip Cycle Mode to Normal Mode
Application: 11/573,708 →
Method of Forming a Transistor Diagnostic Circuit
Application: 11/759,772 →
Schottky Diode and Method Therefor
Application: 11/757,222 →
Edge Seal for a Semiconductor Device and Method Therefor
Application: 11/754,087 →
Method of Forming a Pwm Controller and Structure Therefor
Application: 11/749,542 →
Tuning Circuit and Method
Application: 11/749,038 →
Semiconductor Component and Method of Manufacture
Application: 11/746,437 →
Parameter Control Circuit Including Charging and Discharging Current Mirrors and Method Therefor
Application: 11/743,066 →
Semiconductor Component and Method of Manufacture
Application: 11/737,923 →
Power System Inhibit Method and Device and Structure Therefor
Application: 11/735,893 →
Soft-Start Circuit and Method Therefor
Application: 11/576,174 →
Dc-To-Dc Converter and Method Therefor
Application: 11/576,030 →
Semiconductor Package Structure Having Enhanced Thermal Dissipation Characteristics
Application: 11/575,864 →
Semiconductor Package Structure Having Enhanced Thermal Dissipation Characteristics
Application: 11/575,808 →
Method for Regulating a Voltage and Circuit Therefor
Application: 11/575,632 →
Accurate Voltage Reference Circuit and Method Therefor
Application: 11/688,136 →
Schottky Diode Structure with Multi-Portioned Guard Ring and Method of Manufacture
Application: 11/683,502 →
Semiconductor Component and Method of Manufacture
Application: 11/681,500 →
Method of Forming a Signal Level Translator and Structure Therefor
Application: 11/574,559 →
Led Control System
Application: 11/678,793 →
Multi-Chip Semiconductor Connector Assembly Method
Application: 11/673,942 →
Switched Capacitor Controller and Method Therefor
Application: 11/573,592 →
Multi-Chip Semiconductor Connector and Method
Application: 11/672,102 →
Method of Forming a Low Capacitance Semiconductor Device and Structure Therefor
Application: 11/671,664 →
Semiconductor Device Having Trench Edge Termination Structure
Application: 11/671,514 →
Method of Forming an Over-Voltage Protection Circuit and Structure Therefor
Application: 11/671,034 →
High Accuracy Zero Crossing Detector and Method Therefor
Application: 11/573,152 →
Semiconductor Component and Method of Manufacturing
Application: 11/668,872 →
Dc-Dc Converter Controller Having Optimized Load Transient Response and Method Thereof
Application: 11/572,727 →
Method for Regulating a Voltage and Circuit Therefor
Application: 11/572,456 →
Method for Regulating a Voltage and Circuit Therefor
Application: 11/572,460 →
Semiconductor Device Having Reduced Gate Charge and Reduced on Resistance and Method
Application: 11/624,560 →
Method of Forming an Operational Amplifier and Structure Therefor
Application: 11/623,134 →
Semiconductor Component and Method of Manufacture
Application: 11/618,363 →
Voltage Reference Circuit and Method Therefor
Application: 11/613,589 →
Method of Forming a Power Supply Controller and Structure Therefor
Application: 11/566,891 →
Charge Pump Circuit and Method Therefor
Application: 11/566,965 →
Power Supply Controller and Method Therefor
Application: 11/561,990 →
Protection Circuit and Method Therefor
Application: 11/561,932 →
Compensated Switching Power Supply Controller and Method Therefor
Application: 11/554,681 →
Semiconductor Device Having Deep Trench Charge Compensation Regions and Method
Application: 11/582,889 →
Method of Forming a Semiconductor Device Having Trench Charge Compensation Regions
Application: 11/536,249 →
Led Controller and Method Therefor
Application: 11/535,177 →
Semiconductor Device and Method of Producing High Contrast Identification Mark
Application: 11/526,254 →
Dc-Dc Converter and Method
Application: 11/530,983 →
Semiconductor Package and Method Therefor
Application: 11/469,239 →
Semiconductor Package Structure Having Multiple Heat Dissipation Paths and Method of Manufacture
Application: 11/468,542 →
Semiconductor Package Structure and Method of Manufacture
Application: 11/466,539 →
Semiconductor Package and Leadframe Therefor Having Angled Corners
Application: 11/491,664 →
Method of Forming a Schottky Diode and Structure Therefor
Application: 11/457,678 →
Power Factor Correction Circuit and Method Therefor
Application: 11/479,198 →
Method of Forming a Secondary-Side Controller and Structure Therefor
Application: 11/479,164 →
Multilayer Gettering Structure for Semiconductor Device and Method
Application: 11/482,237 →
Integrated Filter Having Ground Plane Structure
Application: 11/482,238 →
Negative Current Compensation Method and Circuit
Application: 10/566,565 →
Method of Forming a Programmable Voltage Regulator and Structure Therefor
Application: 11/474,473 →
Method of forming a feedback network and structure therefor
Application: 11/474,472 →
Method for Inhibiting Thermal Run-Away
Application: 11/424,844 →
Filter Having Integrated Floating Capacitor and Transient Voltage Suppression Structure and Method of Manufacture
Application: 11/454,682 →
Semiconductor Filter Structure and Method of Manufacture
Application: 11/454,387 →
Circuit and Method for Reducing Electromagnetic Interference
Application: 11/424,499 →
Circuit and Mathod for Regulating Voltage
Application: 11/424,222 →
Method of Forming a Voltage Regulator and Structure Therefor
Application: 11/448,881 →
Dishwasher
Application: 11/422,733 →
Semiconductor Device Having Sub-Surface Trench Charge Compensation Regions
Application: 11/442,706 →
Accurate Timing Generator and Method Therefor
Application: 11/441,328 →
Shunt Protection Circuit and Method Therefor
Application: 11/416,506 →
Semiconductor Package Structure and Method of Manufacture
Application: 11/403,978 →
Linear Regulator and Method Therefor
Application: 11/403,979 →
Led Control Circuit and Method Therefor
Application: 11/399,523 →
Method of Forming an Eprom Cell and Structure Therefor
Application: 11/389,639 →
Power Semiconductor Device Having Improved Performance and Method
Application: 11/384,161 →
Bi-Directional Transistor with by-Pass Path and Method Therefor
Application: 11/367,626 →
Method of Forming an Mos Transistor and Structure Therefor
Application: 11/367,627 →
Method for Nullifying Temperature Dependence and Circuit Therefor
Application: 11/357,878 →
Method of Forming a Floating Charge Pump and Structure Therefor
Application: 11/355,161 →
Schottky Diode Structure with Enhanced Breakdown Voltage and Method of Manufacture
Application: 11/345,789 →
Power Supply Controller and Method Therefor
Application: 11/339,110 →
Switching Power Supply Controller with Improved Effeciency and Method Therefor
Application: 11/337,236 →
Fault Control Circuit and Method Therefor
Application: 11/324,072 →
Thyristor and Method of Manufacture
Application: 11/317,340 →
Thyristor and Method of Manufacture
Application: 11/317,213 →
Semiconductor Package Structure for Vertical Mount and Method
Application: 11/311,824 →
Encapsulated Electronic Device Structure
Application: 11/305,526 →
Multi-Phase Power Supply Controller and Method Therefor
Application: 11/286,979 →
Semiconductor Device and Method of Providing Regions of Low Substrate Capacitance
Application: 11/285,968 →
Output Amplifier Structure with Bias Compensation
Application: 11/282,021 →
Semiconductor Package Structure and Method of Manufacture
Application: 11/281,141 →
Semiconductor component and method of manufacture
Application: 11/281,160 →
Diagnostic Circuit and Method Therefor
Application: 11/272,359 →
Method of Forming a Power Supply Controller and Device Therefor
Application: 11/264,107 →
Method of Forming a Leaded Molded Array Package
Application: 11/259,981 →
Method of Forming a Trench Semiconductor Device and Structure Therefor
Application: 11/256,409 →