Semiconductor package and leadframe therefor having angled corners
View Patent ↗A leadframe for a semiconductor package is formed with an indentation on a bottom surface. A side of the indentation is used to form a mold-lock that assists in securing the leadframe to the encapsulation material of the semiconductor package.
1. A leadframe for a semiconductor package comprising:
a leadframe panel having a thickness and a plurality of package sites;
a connection pad and the flag within a package site of the plurality of package sites, the connection pad and the flag having a top surface, a bottom surface, and a side extending from the top surface to the bottom surface, the side positioned on an outside perimeter of the connection pad and the flag and having a first portion extending from the top surface and also having a second portion extending away from the first portion to the bottom surface wherein the first portion and the second portion are not parallel; and
a corner formed at an intersection between the second portion of the side and the bottom surface and forming an angle between the bottom surface and the second portion of the side that is greater than ninety degrees.
2. The leadframe of claim 1 wherein the second portion of the side extends up to seventy-five percent of the thickness of the leadframe panel.
3. The leadframe of claim 1 wherein the angle is no greater than one hundred thirty-five degrees.
4. The leadframe of claim 1 wherein the leadframe panel has a thickness between 250 and 1000 microns.
5. The leadframe of claim 1 wherein the second portion of the side has a shape that is approximately one-half of one of a semi-circle, a three-sided shape, or a five-sided shape.
6. A semiconductor package comprising:
a connection pad and the flag having a top surface, a bottom surface, and a side having a first portion extending from the top surface toward the bottom surface and the side also having a second portion extending from the first portion toward the bottom surface wherein the first portion and the second portion are not parallel and wherein the side is on an outside perimeter of the connection pad and the flag;
a package body encapsulating the top surface of the connection pad and the flag and at least a portion of the side of the connection pad and the flag; and
a corner formed at an intersection of the second portion of the side of the connection pad and the flag and the bottom surface and forming an angle between the bottom surface and the second portion that is greater than ninety degrees.
7. The semiconductor package of claim 6 wherein the second portion has a shape that is approximately one-half of one of a semi-circle, a three-sided shape, or a five-sided shape.