Multi-chip semiconductor connector and method
View Patent ↗In one exemplary embodiment, a multi-chip connector is formed to have a first conductive strip that is suitable for attaching to a first semiconductor die and a second conductive strip that is attached suitable for attaching to a second semiconductor die.
1. A multi-chip connector comprising:
a first conductive strip having a first connection portion and a first support portion, the first connection portion having a first major surface and a second major surface;
a first semiconductor die attachment area on the first major surface of the first support portion of the first conductive strip wherein the first semiconductor die attachment area is formed on the first conductive strip prior to attaching the first conductive strip to a semiconductor die, the first semiconductor die attachment area extending a first distance from the first major surface of the first connection portion of the first conductive strip and being integral there with; and
a second conductive strip underlying the first conductive strip, the second conductive strip having a second connection portion, a second support portion, and a second semiconductor die attachment area on a portion of the second connection portion wherein the second semiconductor die attachment area is formed on the second conductive strip prior to attaching the second conductive strip to a semiconductor die, the second semiconductor die attachment area extending from the second connection portion of the second conductive strip and being integral there with.
2. The multi-chip connector of claim 1 further including an insulator between the first conductive strip and the second conductive strip.
3. The multi-chip connector of claim 2 wherein the insulator is adjacent the second major surface of the first conductive strip.
4. The multi-chip connector of claim 2 wherein the insulator is one of polyimide or epoxy and wherein the insulator does not extend to a distal end of the first support portion or a distal end of the second support portion.
5. The multi-chip connector of claim 1 wherein the first connection portion is in a first plane and the first support portion is in a second plane.
6. The multi-chip connector of claim 1 wherein the first semiconductor die attachment area is one of a ball-bond or solder.
7. The multi-chip connector of claim 1 wherein the first semiconductor die attachment area is in a first plane and the second semiconductor die attachment area is in a second plane.
8. The multi-chip connector of claim 1 wherein a first semiconductor die is attached to the first semiconductor die attachment area and a second semiconductor die is attached to the second semiconductor die attachment area.
9. The multi-chip connector of claim 1 wherein the first semiconductor die attachment area is a portion of the first conductive strip that is formed to extend the first distance from the first major surface of the first connection portion.