Multi-chip semiconductor connector assembly method
View Patent ↗In one exemplary embodiment, a multi-chip connector is formed to have a first conductive strip that is attached to a first semiconductor die and a second conductive strip that is attached to a second semiconductor die.
1. A method of forming a multi-chip semiconductor connector assembly comprising:
providing a vertical current flow semiconductor device formed on a first semiconductor die, the first vertical current flow semiconductor device having a first connection point on a first surface of the first semiconductor die and a second connection point on a second surface of the first semiconductor die wherein the first surface of the first semiconductor die is opposite to the second surface of the first semiconductor die;
providing a second vertical current flow semiconductor device formed on a second semiconductor die, the second vertical current flow semiconductor device having a first connection point on a first surface of the second semiconductor die and a second connection point on a second surface of the second semiconductor die wherein the first surface of the second semiconductor die is opposite to the second surface of the second semiconductor die;
attaching mechanically and connecting electrically a first attachment area on a first surface of a first conductive strip to the first connection point on the first surface of the first semiconductor die without wire-bonding the first semiconductor die to the first conductive strip; and
attaching a second attachment area on a second surface of the first conductive strip to the first connection point on the first surface of the second semiconductor die wherein the first semiconductor die is in a first plane and the second semiconductor die is in a second plane that is different than the first plane.
2. The method of claim 1 wherein attaching mechanically and connecting electrically the first attachment area on the first surface of the first conductive strip to the first connection point on the first surface of the first semiconductor die includes attaching the first attachment area to one of a source connection point, a gate connection point, or a drain connection point of a first vertical current flow transistor and wherein attaching the second attachment area on the second surface of the first conductive strip to the first connection point on the first surface of the second semiconductor die includes attaching the second attachment area to one of a source connection point, a gate connection point, or a drain connection point of a second vertical current flow transistor.
3. The method of claim 1 wherein attaching the second attachment area on the second surface of the first conductive strip to the first connection point on the first surface of the second semiconductor die includes attaching the second attachment area that has a first portion overlying a first portion of the first attachment area.
4. The method of claim 1 wherein attaching mechanically and connecting electrically the first attachment area on the first surface of the first conductive strip to the first connection point on the first surface of the first semiconductor die includes attaching the first attachment area to the first connection point by a method selected from the group of soldering or using conductive epoxy or thermo-compression bonding.
5. The method of claim 1 further including connecting the first conductive strip to a first lead of a semiconductor package leadframe.
6. The method of claim 1 wherein attaching mechanically and connecting electrically the first attachment area on the first surface of the first conductive strip to the first connection point includes forming a distal end of the first conductive strip as a terminal of a semiconductor package.
7. A method of forming a multi-chip semiconductor connector assembly comprising:
providing a vertical current flow semiconductor device formed on a first semiconductor die, the first vertical current flow semiconductor device having a first connection point on a first surface of the first semiconductor die and a second connection point on a second surface of the first semiconductor die wherein the first surface of the first semiconductor die is opposite to the second surface of the first semiconductor die;
providing a second vertical current flow semiconductor device formed on a second semiconductor die, the second vertical current flow semiconductor device having a first connection point on a first surface of the second semiconductor die and a second connection point on a second surface of the second semiconductor die wherein the first surface of the second semiconductor die is opposite to the second surface of the second semiconductor die;
attaching mechanically and connecting electrically through one common connection point a first attachment area on a first surface of a first conductive strip to the first connection point on the first surface of the first semiconductor die;
attaching mechanically and connecting electrically a first attachment area on a first surface of a second conductive strip to the first connection point on the first surface of the second semiconductor die; and
attaching the first conductive strip to the second conductive strip.
8. The method of claim 7 wherein attaching mechanically and connecting electrically the first attachment area on the first surface of the first conductive strip to the first connection point on the first surface of the first semiconductor die includes attaching the first attachment area to one of a source connection point, a gate connection point, or a drain connection point of a first vertical current flow transistor; and
wherein attaching mechanically and connecting electrically the second attachment area on the second surface of the first conductive strip to the first connection point on the first surface of the second semiconductor die includes attaching the second attachment area to one of a source connection point, a gate connection point, or a drain connection point of a second vertical current flow transistor.