Apparatus, systems and methods for processing signals between a tester and a plurality of devices under test at high temperatures and with single touchdown of a probe array
View Patent ↗Apparatus is for processing signals between a tester and devices under test. In one embodiment, the apparatus includes at least one multichip module. Each multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to devices under test. At least one driver is provided to operate each of the micro-electromechanical switches. A method of processing signals between a tester and devices under test is disclosed. In an embodiment, the method includes connecting the tester and the devices under test with at least one multichip module. Each of the at least one multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to the devices under test. The method includes operating each of the micro-electromechanical switches. Other embodiments are also disclosed.
1. A method of processing signals between a tester and a plurality of devices under test, the method comprising:
mounting at least one multichip module directly on a probe card, each of the at least one multichip module having a plurality of micro-electromechanical switches connected between a first set of connectors and a second set of connectors, the mounting of the at least one multichip module directly on the probe card connecting the second set of connectors to a probe array of the probe card;
connecting the first set of connectors to the tester by attaching the probe card, with the multichip modules mounted thereon, to the tester, wherein the first set of connectors are not connected to the tester when the probe card is not attached to the tester;
connecting the plurality of devices under test to the probe array of the probe card; and
selectively operating each of the plurality of micro-electromechanical switches to process the signals between individual ones of the first set of connectors to the tester and selected multiple ones of the second set of connectors to the plurality of devices under test.
2. A method in accordance with claim 1 , further comprising operating the at least one multichip module at a speed of at least 100 MHz.
3. A method in accordance with claim 1 , further comprising operating the multichip module at a temperature of at least 125° C.
4. A method in accordance with claim 1 , further comprising operating the multichip module at a temperature of at least 125° C., and operating the at least one multichip module at a speed of at least 100 MHz.
5. A method in accordance with claim 1 , wherein the at least one multichip module is directly mounted on the probe card by screwing the multichip module to the probe card.
6. A method in accordance with claim 1 , wherein mounting the at least one multichip module directly to the probe card comprises mounting a plurality of multichip modules directly to the probe card.