Integrated circuit package system including shield
View Patent ↗A method of manufacture of an integrated circuit package system which includes providing a substrate and attaching a first device to the substrate. Attaching a shield to the substrate. Processing the shield to form apertures and configuring the shield to block electromagnetic energy that passes through the apertures.
1. A method of manufacture of an integrated circuit package system comprising:
providing a substrate;
attaching a first device to the substrate;
attaching a shield to the substrate;
processing the shield to form apertures;
configuring the shield to block electromagnetic energy that passes through the apertures; and
depositing an encapsulation material through the apertures.
2. The method as claimed in claim 1 wherein:
processing the shield to form the apertures facilitates dispersion of the encapsulation material.
3. The method as claimed in claim 1 wherein:
configuring the shield includes forming a projection to block electromagnetic energy.
4. The method as claimed in claim 1 wherein:
configuring the shield includes bending upwards flanges to block electromagnetic energy.
5. The method as claimed in claim 1 wherein:
configuring the shield includes forming a collar shield to block electromagnetic energy.
6. A method of manufacture of an integrated circuit package system comprising:
providing a substrate;
attaching a first device to the substrate;
forming a shield with a top and sidewalls from a continuous piece of material, the shield attached to the substrate;
forming apertures within the sidewalls;
configuring the shield to block electromagnetic energy that passes though the apertures by lengthening a projection; and
attaching a second device over the first device, the second device supported by the shield.
7. The method as claimed in claim 6 wherein:
forming the apertures within the sidewalls includes cutting the sidewalls.
8. The method as claimed in claim 6 wherein:
configuring the shield to block electromagnetic energy includes overlapping parts of the shield.
9. The method as claimed in claim 6 wherein:
attaching the first device includes attaching semiconductor chips and integrated circuit packages that transmit or receive electromagnetic energy.
10. The method as claimed in claim 6 wherein:
attaching the second device includes attaching semiconductor chips and integrated circuit packages that transmit or receive electromagnetic energy.