Semiconductor device having laminated electronic conductor on bit line
There are provided a semiconductor device and a fabrication method therefor including an ONO film ( 18 ) formed on a semiconductor substrate ( 10 ), a word line ( 24 ) formed on the ONO film ( 18 ), a bit line ( 20 ) formed in the semiconductor substrate ( 10 ), and a conductive layer ( 32 ) that is in contact with the bit line ( 20 ), runs in a length direction of the bit line ( 20 ), and includes a polysilicon layer or a metal layer. In accordance with the present invention, a semiconductor device and a fabrication method therefor are provided wherein degradation of the writing and erasing characteristics and degradation of the transistor characteristics such as a junction leakage are suppressed, and the bit line resistance is decreased.
1. A semiconductor device comprising:
an ONO film formed on a semiconductor substrate;
a word line formed on the ONO film;
a bit line formed in the semiconductor substrate; and
a conductive layer in contact with the bit line, the conductive layer overlying the semiconductor substrate and running in a direction of a length of the bit line, wherein the conductive layer runs substantially the entire length of the bit line, and wherein the conductive layer comprises either a polysilicon layer or a metal layer.
2. The semiconductor device as claimed in claim 1 , wherein the conductive layer is thicker than the ONO film.
3. The semiconductor device as claimed in claim 2 , wherein the bit line resistance may be lowered by increasing the thickness of the conductive layer.
4. The semiconductor device as claimed in claim 2 , wherein the bit line resistance may be lowered by increasing the thickness of the conductive layer relative to the ONO film.
5. The semiconductor device as claimed in claim 1 , wherein the word line is isolated from the conductive layer by at least a portion of a top oxide film provided in the ONO film.
6. The semiconductor device as claimed in claim 5 , wherein the word line and the conductive layer are isolated from each other by a top oxide film.
7. The semiconductor device as claimed in claim 1 , wherein the conductive layer is successively formed in a current-flowing direction.
8. The semiconductor device as claimed in claim 1 , wherein the conductive layer has a lower resistance than the bit line.
9. The semiconductor device as claimed in claim 1 , wherein the conductive layer underlies the word line.
10. A memory device comprising:
an ONO film formed on a semiconductor substrate;
a word line formed on the ONO film;
a bit line formed in the semiconductor substrate; and
a conductive layer in contact with the bit line and running substantially along a length of the bit line, wherein the conductive layer runs substantially the entire length of the bit line, wherein the conductive layer underlies the word line and overlies the semiconductor substrate, and wherein the conductive layer comprises either a polysilicon layer or a metal layer.
11. The memory device as claimed in claim 10 , wherein the conductive layer is thicker than the ONO film.
12. The memory device as claimed in claim 11 , wherein the bit line resistance may be lowered by increasing the thickness of the conductive layer.
13. The memory device as claimed in claim 11 , wherein the bit line resistance may be lowered by increasing the thickness of the conductive layer relative to the ONO film.
14. The memory device as claimed in claim 10 , wherein the word line is isolated from the conductive layer by at least a portion of a top oxide film provided in the ONO film.
15. The memory device as claimed in claim 14 , wherein the word line and the conductive layer are isolated from each other by a top oxide film.
16. The memory device as claimed in claim 10 , wherein the conductive layer is successively formed in a current-flowing direction.
17. The memory device as claimed in claim 10 , wherein the conductive layer has a lower resistance than the bit line.