Double-sided waffle pack
View Patent ↗Double-sided waffle packs and methods of using the same are provided. In one aspect, a waffle pack is provided that includes a body that has a first side and second side opposite the first side. The first side has a first cavity for enabling a semiconductor die to be seated therein when the body is in a first orientation. The second side has a second cavity for enabling a semiconductor die to be seated therein when the body is in a second orientation opposite the first orientation. The first cavity has a first footprint and the second cavity has a second footprint. The first and second footprints are substantially aligned vertically.
1. A waffle pack, comprising:
a body having a first side and second side opposite the first side, the first side having a first projection including a first cavity for enabling a semiconductor die to be seated therein when the body is in a first orientation, the second side having a second cavity including a third cavity nested therein, the second cavity adapted to stackably receive a second projection of another waffle pack, the third cavity for enabling a semiconductor die to be seated therein when the body is in a second orientation opposite the first orientation; and
the first cavity having a first footprint and the third cavity having a second footprint.
2. The waffle pack of claim 1 , wherein the first and second footprints are rectangular.
3. The waffle pack of claim 1 , wherein the first projection and the second projection are rectangular.
4. The waffle pack of claim 3 , wherein the second cavity comprises a third footprint and the second projection of the another waffle pack comprises a fourth footprint that is substantially the same as the third footprint.
5. The waffle pack of claim 1 , wherein the first projection comprises a third fourth cavity for enabling another semiconductor die to be seated therein when the body is in the first orientation.
6. The waffle pack of claim 5 wherein the second cavity comprises a fifth cavity nested therein for enabling another semiconductor die to be seated therein when the body is in the second orientation.
7. The waffle pack of claim 1 , wherein the body comprises a plastic.
8. The waffle pack of claim 1 , wherein the first and second footprints being substantially aligned vertically.
9. The waffle pack of claim 1 , comprising a semiconductor chip positioned in one of the first and the third cavities.
10. A waffle pack, comprising:
a body having a first side and second side opposite the first side;
the first side of the body having a first plurality of cavities for enabling a corresponding plurality of semiconductor die to be seated in the first plurality of cavities when the body is in a first orientation;
the second side having a second plurality of cavities for enabling a second corresponding plurality of semiconductor die to be seated in the second plurality of cavities when the body is in a second orientation opposite the first orientation; and
the first and second pluralities of cavities forming pairs of cavities, one cavity in a given pair having a first footprint and the other cavity in the given pair having a second footprint, the first and second footprints being substantially aligned vertically.
11. The waffle pack of claim 10 , wherein the first and second footprints are rectangular.
12. The waffle pack of claim 10 , wherein the first side comprises a step.
13. The waffle pack of claim 12 , wherein the second side comprises a cavity having substantially the same footprint as the step.
14. The waffle pack of claim 10 , wherein the first side comprises a third cavity.
15. The waffle pack of claim 14 , wherein the second side comprises a step having substantially the same footprint as the third cavity.
16. The waffle pack of claim 10 , wherein the body comprises a plastic.
17. The waffle pack of claim 10 , comprising a semiconductor chip positioned in one of the first plurality of cavities.