Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires
View Patent ↗An integrated circuit package system that includes: providing an electrical interconnect system including a first lead-finger system and a second lead-finger system; connecting a first device to the first lead-finger system with a wire bond; stacking a second device over the first device; and connecting the second device to the second lead-finger system with a bump bond.
1. An integrated circuit package system comprising:
providing an electrical interconnect system including a first lead-finger system and a second lead-finger system;
mounting a first device having a first device active side and a first device backside side coplanar with a side of the first lead-finger system;
attaching a wire bond to the first device active side and the first lead-finger system;
stacking a second device over the first device; and
connecting the second device to the second lead-finger system with a bump bond.
2. The system as claimed in claim 1 wherein:
providing the electrical interconnect system further includes providing a stacking support system attached to the first lead-finger system and the second lead-finger system for package stacking.
3. The system as claimed in claim 1 wherein:
stacking the second device includes offsetting the second device to expose a portion of the first device active side and a second device active side.
4. The system as claimed in claim 1 further comprising:
configuring the integrated circuit package system to expose the first device backside and a second device backside.
5. The system as claimed in claim 1 further comprising:
providing an inter-device structure between the first device and the second device.